OT PLD, 10ns, PAL-Type, CMOS, PDIP24, PLASTIC, DIP-24
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Intel(英特尔) |
零件包装代码 | DIP |
包装说明 | DIP, DIP24,.3 |
针数 | 24 |
Reach Compliance Code | compliant |
其他特性 | PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK |
架构 | PAL-TYPE |
最大时钟频率 | 58.8 MHz |
JESD-30 代码 | R-PDIP-T24 |
JESD-609代码 | e0 |
长度 | 31.61 mm |
专用输入次数 | 13 |
I/O 线路数量 | 8 |
输入次数 | 22 |
输出次数 | 8 |
产品条款数 | 72 |
端子数量 | 24 |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 13 DEDICATED INPUTS, 8 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP24,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
可编程逻辑类型 | OT PLD |
传播延迟 | 10 ns |
认证状态 | Not Qualified |
座面最大高度 | 4.32 mm |
最大供电电压 | 5.25 V |
最小供电电压 | 4.75 V |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
P85C224-10 | N85C220-7 | N85C220-10 | P85C220-7 | N85C224-10 | N85C224-7 | P85C220-10 | P85C224-7 | |
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描述 | OT PLD, 10ns, PAL-Type, CMOS, PDIP24, PLASTIC, DIP-24 | OT PLD, 9ns, PAL-Type, CMOS, PQCC20, PLASTIC, LCC-20 | OT PLD, 10ns, PAL-Type, CMOS, PQCC20, PLASTIC, LCC-20 | OT PLD, 9ns, PAL-Type, CMOS, PDIP20, PLASTIC, DIP-20 | OT PLD, 10ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28 | OT PLD, 9ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28 | OT PLD, 10ns, PAL-Type, CMOS, PDIP20, PLASTIC, DIP-20 | OT PLD, 9ns, PAL-Type, CMOS, PDIP24, PLASTIC, DIP-24 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) |
零件包装代码 | DIP | QLCC | QLCC | DIP | QLCC | QLCC | DIP | DIP |
包装说明 | DIP, DIP24,.3 | PLASTIC, LCC-20 | PLASTIC, LCC-20 | DIP, DIP20,.3 | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ | DIP, DIP20,.3 | DIP, DIP24,.3 |
针数 | 24 | 20 | 20 | 20 | 28 | 28 | 20 | 24 |
Reach Compliance Code | compliant | unknown | compliant | compliant | compliant | unknown | compliant | compliant |
其他特性 | PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK |
架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
最大时钟频率 | 58.8 MHz | 74 MHz | 58.8 MHz | 74 MHz | 58.8 MHz | 74 MHz | 58.8 MHz | 74 MHz |
JESD-30 代码 | R-PDIP-T24 | S-PQCC-J20 | S-PQCC-J20 | R-PDIP-T20 | S-PQCC-J28 | S-PQCC-J28 | R-PDIP-T20 | R-PDIP-T24 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 31.61 mm | 8.9662 mm | 8.9662 mm | 25.55 mm | 11.5062 mm | 11.5062 mm | 25.55 mm | 31.61 mm |
专用输入次数 | 13 | 8 | 8 | 9 | 12 | 12 | 9 | 13 |
I/O 线路数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
输入次数 | 22 | 18 | 18 | 18 | 22 | 22 | 18 | 22 |
输出次数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
产品条款数 | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
端子数量 | 24 | 20 | 20 | 20 | 28 | 28 | 20 | 24 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 13 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 9 DEDICATED INPUTS, 8 I/O | 12 DEDICATED INPUTS, 8 I/O | 12 DEDICATED INPUTS, 8 I/O | 9 DEDICATED INPUTS, 8 I/O | 13 DEDICATED INPUTS, 8 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | QCCJ | QCCJ | DIP | QCCJ | QCCJ | DIP | DIP |
封装等效代码 | DIP24,.3 | LDCC20,.4SQ | LDCC20,.4SQ | DIP20,.3 | LDCC28,.5SQ | LDCC28,.5SQ | DIP20,.3 | DIP24,.3 |
封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
可编程逻辑类型 | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
传播延迟 | 10 ns | 9 ns | 10 ns | 9 ns | 10 ns | 9 ns | 10 ns | 9 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.32 mm | 4.57 mm | 4.57 mm | 5.08 mm | 4.57 mm | 4.57 mm | 5.08 mm | 4.32 mm |
最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | YES | NO | YES | YES | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | QUAD | QUAD | DUAL | QUAD | QUAD | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | 8.9662 mm | 8.9662 mm | 7.62 mm | 11.5062 mm | 11.5062 mm | 7.62 mm | 7.62 mm |
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