EEPROM, 128X16, Serial, CMOS, PDSO8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Integrated Circuit Systems（IDT ） |
| 包装说明 | SOP, SOP8,.25 |
| Reach Compliance Code | unknown |
| 数据保留时间-最小值 | 40 |
| 耐久性 | 10000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e0 |
| 内存密度 | 2048 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 16 |
| 端子数量 | 8 |
| 字数 | 128 words |
| 字数代码 | 128 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 128X16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 串行总线类型 | MICROWIRE |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.006 mA |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 写保护 | HARDWARE/SOFTWARE |
| 93CX56KI | 93CX56PM | 93CX66K | 93CX66KI | 93CX66P | 93CX66PM | 93CX66PI | 93CX56K | 93CX56P | 93CX56PI | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 128X16, Serial, CMOS, PDSO8 | EEPROM, 128X16, Serial, CMOS, PDIP8 | EEPROM, 256X16, Serial, CMOS, PDSO8 | EEPROM, 256X16, Serial, CMOS, PDSO8 | EEPROM, 256X16, Serial, CMOS, PDIP8 | EEPROM, 256X16, Serial, CMOS, PDIP8 | EEPROM, 256X16, Serial, CMOS, PDIP8 | EEPROM, 128X16, Serial, CMOS, PDSO8 | EEPROM, 128X16, Serial, CMOS, PDIP8 | EEPROM, 128X16, Serial, CMOS, PDIP8 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Integrated Circuit Systems（IDT ） | Integrated Circuit Systems（IDT ） | Integrated Circuit Systems（IDT ） | Integrated Circuit Systems（IDT ） | Integrated Circuit Systems（IDT ） | Integrated Circuit Systems（IDT ） | Integrated Circuit Systems（IDT ） | Integrated Circuit Systems（IDT ） | Integrated Circuit Systems（IDT ） | Integrated Circuit Systems（IDT ） |
| 包装说明 | SOP, SOP8,.25 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | SOP, SOP8,.25 | DIP, DIP8,.3 | DIP, DIP8,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 数据保留时间-最小值 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
| 耐久性 | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 2048 bit | 2048 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 2048 bit | 2048 bit | 2048 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 128 words | 128 words | 256 words | 256 words | 256 words | 256 words | 256 words | 128 words | 128 words | 128 words |
| 字数代码 | 128 | 128 | 256 | 256 | 256 | 256 | 256 | 128 | 128 | 128 |
| 最高工作温度 | 85 °C | 125 °C | 70 °C | 85 °C | 70 °C | 125 °C | 85 °C | 70 °C | 70 °C | 85 °C |
| 最低工作温度 | -40 °C | -55 °C | - | -40 °C | - | -55 °C | -40 °C | - | - | -40 °C |
| 组织 | 128X16 | 128X16 | 256X16 | 256X16 | 256X16 | 256X16 | 256X16 | 128X16 | 128X16 | 128X16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | SOP | SOP | DIP | DIP | DIP | SOP | DIP | DIP |
| 封装等效代码 | SOP8,.25 | DIP8,.3 | SOP8,.25 | SOP8,.25 | DIP8,.3 | DIP8,.3 | DIP8,.3 | SOP8,.25 | DIP8,.3 | DIP8,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 串行总线类型 | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
| 最大待机电流 | 0.0001 A | 0.0002 A | 0.00005 A | 0.0001 A | 0.00005 A | 0.0002 A | 0.0001 A | 0.00005 A | 0.00005 A | 0.0001 A |
| 最大压摆率 | 0.006 mA | 0.008 mA | 0.004 mA | 0.006 mA | 0.004 mA | 0.008 mA | 0.006 mA | 0.004 mA | 0.004 mA | 0.006 mA |
| 表面贴装 | YES | NO | YES | YES | NO | NO | NO | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | COMMERCIAL | INDUSTRIAL | COMMERCIAL | MILITARY | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
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