HIGH CURRENT POWER INDUCTORS
1. PART NO. EXPRESSION :
SSL1308M SERIES
SSL1308M-R21MF-R32
(a)
(b)
(c)
(d) (e) (f)
(g)
(a) Series code
(b) Dimension code
(c) Material code
(d) Inductance code
(e) Tolerance code : M = ± 20%
(f) F : RoHS Compliant
(g) DCR code
2. CONFIGURATION & DIMENSIONS :
A
E
R21
0939.32
D
B
G
H
G
C
PCB Pattern
Unit:m/m
A
B
C
D
E
G
I
H
I
13.46 Max. 12.95 Max. 8.0 Max.
5.08± 0.25 2.54± 0.25 3.18± 0.25 7.11± 0.25 7.62± 0.25
3. SCHEMATIC :
4. GENERAL SPECIFICATION :
a) Operating temp. : -40° C to +125° C
b) Irms (A) : Will cause coil temp. to rise approximately T=40°C without core loss.
c) Isat (A) : Will cause L
0
to drop approximately 20%
d) Part temperature (ambient + temp. rise) : Should not exceed 125° C under worst case operating conditions.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
08.04.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
HIGH CURRENT POWER INDUCTORS
5. ELECTRICAL CHARACTERISTICS :
Part No.
SSL1308M-R21MF-R32
SSL1308M-R26MF-R32
SSL1308M-R32MF-R32
SSL1308M-R44MF-R32
SSL1308M-R21MF-R53
SSL1308M-R26MF-R53
SSL1308M-R53MF-R53
SSL1308M-R44MF-R53
Inductance L
0
( uH )
0.21 ± 20%
0.26 ± 20%
0.32 ± 20%
0.44 ± 20%
0.21 ± 20%
0.26 ± 20%
0.32 ± 20%
0.44 ± 20%
Test
Freq.
( Hz )
0.25V/1M
0.25V/1M
0.25V/1M
0.25V/1M
0.25V/1M
0.25V/1M
0.25V/1M
0.25V/1M
DCR
(m )
± 9.4%
0.32
0.32
0.32
0.32
0.53
0.53
0.53
0.53
SSL1308M SERIES
Irms
(A)
Max.
45
45
41
30
45
45
41
30
Isat
(A)
Max.
71
60
50
35
71
60
50
35
6. CHARACTERISTICS CURVES :
SSL1308M-R21MF-R32
0 .4
SLPI1308M- R21M-R32
SSL1308M-R26MF-R32
80
70
0.5
SLPI1308M-R26M-R32
80
70
0.4
INDUCTANCE (uH)
INDUCTANCE (uH)
0 .3
60
60
50
40
0.2
30
20
0.1
10
0
0
50
0 .2
40
30
0 .1
20
10
0
0
TEMP. RISE(
o
C)
0.3
0
15
30
45
60
0
15
30
45
60
DC CURRENT(A)
DC CURRENT(A)
SSL1308M-R32MF-R32
0.6
SLPI1308M-R32M-R32
SSL1308M-R44MF-R32
80
70
0.8
SLPI1308M-R44M-R32
80
70
INDUCTANCE (uH)
INDUCTANCE (uH)
0.45
60
0.6
60
50
50
0.3
40
30
0.15
20
10
0
0
TEMP. RISE(
o
C)
0.4
40
30
0.2
20
10
0
0
0
10
20
30
40
50
0
7
14
21
28
35
DC CURRENT(A)
DC CURRENT(A)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
TEMP. RISE(
o
C)
TEMP. RISE(
o
C)
08.04.2011
HIGH CURRENT POWER INDUCTORS
6. CHARACTERISTICS CURVES :
SSL1308M-R21MF-R53
SLPI1308M- R21M-R53
SSL1308M SERIES
SSL1308M-R26MF-R53
80
70
0 .4
0 .5
SLPI1308M-R26M-R53
80
70
0 .4
INDUCTANCE (uH)
INDUCTANCE (uH)
0 .3
60
60
50
40
0 .2
30
20
0 .1
10
0
0
TEMP. RISE(
o
C)
50
0 .2
40
30
0 .1
20
10
0
0
0 .3
0
15
30
45
60
0
12
24
36
48
60
DC CURRENT(A)
SSL1308M-R32MF-R53
SLPI1308M- R32M-R53
DC CURRENT(A)
SSL1308M-R44MF-R53
80
70
0 .6
0 .8
SLPI1308M- R44M-R53
80
70
INDUCTANCE (uH)
INDUCTANCE (uH)
0.45
60
0 .6
60
50
50
0 .3
40
30
0.15
20
10
0
0
TEMP. RISE(
o
C)
0 .4
40
30
0 .2
20
10
0
0
0
10
20
30
40
50
0
7
14
21
28
35
DC CURRENT(A)
DC CURRENT(A)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
08.04.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
TEMP. RISE(
o
C)
TEMP. RISE(
o
C)
HIGH CURRENT POWER INDUCTORS
7. RELIABILITY AND TEST CONDITION :
SSL1308M SERIES
TEST CONDITION
ITEM
Electrical Characteristics Test
Inductance
DCR
Heat Rated Current (Irms)
Saturation Current (Isat)
Mechanical Performance Test
Solderability Test
PERFORMANCE
Refer to standard electrical characteristics list
HP4284A
HIOKI3540
Irms(A) will cause the coil temperature rise
approximately T=40°C without core loss
Isat(A) will cause Lo to drop approximately 20%
More than 90% of the terminal electrode
should be covered with solder.
Preheating Dipping
245° C
Natural
cooling
150° C
60
seconds
5± 0.5
seconds
After fluxing, component shall be dipped in a melted
solder bath at 245± 5° C for 5 secs
Solder Heat Resistance
1. Appearance : No significant abnormality
2. Inductance change : Within ± 20% of initial value
Preheat : 150° C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 260± 5° C
Flux : rosin
260° C
Dip Time : 10± 0.5sec.
150° C
Preheating
Dipping
Natural
cooling
60
seconds
10± 0.5
seconds
Reliability Test
High Temperature
Life Test
Temperature : 125± 5° C
Time : 500± 12 hours
Recovery : 4 to 24hrs of recovery under the standard
condition after the removal from test chamber.
1. Appearance : No damage
2. Inductance : Within ± 20% of initial value.
No disconnection or short circuit.
Thermal Shock
Temperature : -40± 5° C
Time : 500± 12 hours
Recovery : 4 to 24hrs of recovery under the standard
condition after the removal from test chamber.
Conditions of 1 cycle.
Step
1
2
3
4
Temperature (° C)
-25± 3
Room Temperature
85± 3
Room Temperature
Times (min.)
30± 3
Within 3
30± 3
Within 3
Low Temperature
Life Test
Total : 5 cycles
Recovery : 4 to 24hrs of recovery under the standard
condition after the removal from test chamber.
Humidity Resistance
1. Appearance : No damage
2. Inductance : Within ± 20% of initial value.
No disconnection or short circuit.
Temperature : 40± 5° C
Humidity : 90% to 95%
Applied Current : Rated Current
Time : 500± 12 hours
Recovery : 4 to 24hrs of recovery under the standard
condition after the removal from test chamber.
Frequency : 10-55-10Hz for 1 min.
Amplitude : 1.52mm
Directions and times : X, Y, Z directions for 2 hours.
A period of 2 hours in each of 3 mutually perpendicular
directions (Total 6 hours).
Random Vibration Test
Appearance : Cracking, chipping and any other
defects harmful to the characteristics should not
be allowed.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
08.04.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
HIGH CURRENT POWER INDUCTORS
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
G
H
G
SSL1308M SERIES
Unit:m/m
G
I
H
I
3.18± 0.25 7.11± 0.25 7.62± 0.25
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
8-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
8-2.1 Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
8-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150° C.
b) 280° C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Preheating
TEMPERATURE ° C
Soldering
20~40s max.
TP(260° C/10s max.)
217
200
150
60~180s
480s max.
25
60~150s
TEMPERATURE ° C
Natural
cooling
Preheating
350
300
150
Soldering
Natural
cooling
TIME(sec.)
Over 1min.
Gradual
Cooling
Within 3secs.
Figure 1. Re-flow Soldering
Figure 2. Iron Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
08.04.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
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