19-5957; Rev 0; 6/11
MAX14600–MAX14605
USB Host Charger Identification/Adapter Emulators
General Description
The MAX14600–MAX14605 are third-generation USB 2.0 host
charger identification devices that combine USB Hi-Speed
analog switches with a USB adapter emulator circuit.
The devices support pass-through mode and auto mode.
In charging downstream port (CDP) pass-through mode,
the devices emulate the CDP function while supporting
normal USB traffic. The MAX14600/MAX14603/MAX14605
have a pFET open-drain output (CEN), and the MAX14601/
MAX14604 have an nFET open-drain output (CEN) to
restart the peripheral connected to the USB host.
All the devices support the CDP and standard down-
stream port (SDP) charging during the active state (S0)
and support the dedicated charging port (DCP) charg-
ing during the standby state (S3/S4/S5). The MAX14603/
MAX14604/MAX14605 support remote wake-up in stand-
by mode. The MAX14602/MAX14605 offer backward-
compatible CDP emulation upgrade to the MAX14566E.
The MAX14600–MAX14605 are available in an 8-pin
(2mm x 2mm) TDFN package, and are specified over the
-40NC to +85NC extended temperature range.
Benefits and Features
S
Improved Charger Interoperability
USB CDP Emulation in S0 State
Meets New USB Battery Charging (BC) Revision
1.2 Specification
Backward Compatible with Previous USB BC
Revisions
Meets China YD/T1591-2009 Charging Specification
Supports Standby Mode Charging for Apple and
BC Revision 1.2-Compatible Devices
S
Greater User Flexibility
CB0 and CB1 Pins Control Multiple Automatic
and Manual Charger States
S
High Level of Integrated Features
Supports Remote Wake-Up (MAX14603/
MAX14604/MAX14605)
Low-Capacitance USB 2.0 Hi-Speed Switch to
Change Charging Modes
Automatic Current-Limit Switch Control
S
Save Space on Board
2mm x 2mm, 8-Pin TDFN Package
Applications
USB Host Data/Chargers
including:
Laptop and Desktop
Computers
USB Hubs
Flat-Panel Displays with
USB
Media Players
Game Consoles
Ordering Information/Selector Guide
appears at end of data
sheet.
For related parts and recommended products to use with this part,
refer to
www.maxim-ic.com/MAX14600.related.
Typical Operating Circuit
5V
SWITCHING
POWER SUPPLY
Li+
BATTERY
EMBEDDED
CONTROLLER
STANDBY
CDP/FM
CB0
CB1
OVERCURRENT
PROTECTOR
CEN
USB A
APPLE DOCK
CONNECTOR
APPLE
DOCK
iPod
®
OR
iPhone
®
EXTERNAL
POWER
SUPPLY
CEN
DM
DP
V
BUS
D-
USB A
D+ CONNECTOR
USB A
MICRO B
PHONE OR MP3
PLAYER
MICRO-USB
CONNECTOR
MAX14600
LAPTOP CHIPSET
USB
TRANSCEIVER
TDM
TDP
GND
iPhone and iPod are registered trademarks of Apple, Inc.
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
MAX14600–MAX14605
USB Host Charger Identification/Adapter Emulators
ABSOLUTE MAXIMUM RATINGS
All voltages referenced to GND.
V
CC
, TDP, TDM, CB0, CB1, DP, DM,
CEN,
CEN.... -0.3V to +6.0V
Continuous Current into Any Terminal ............................
Q30mA
Continuous Power Dissipation (T
A
= +70NC)
TDFN (derate 11.9mW/NC above +70NC) .................953.5mW
Operating Temperature Range .......................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (B
JA
) ..........84NC/W
Junction-to-Case Thermal Resistance (B
JC
) ...............37NC/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V
CC
= 3.0V to 5.5V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
CC
= 5.0V, T
A
= +25NC.) (Note 2)
PARAMETER
POWER SUPPLY
Power-Supply Range
V
CC
V
CB0
> V
IH
V
CB0
= 0V (Note 3)
V
CB0
= V
CB1
= V
CC
= 5.25V, CM mode
V
CB0
= V
CC
= 5.25V, V
CB1
= 0V, PM mode
V
CB0
= 0V, V
CB1
= V
CC
= 5.25V, FM mode
V
CB0
= V
CB1
= 0V, AM mode
ANALOG SWITCH
Analog-Signal Range
On-Resistance TDP/TDM Switch
On-Resistance Match Between
Channels TDP/TDM Switch
On-Resistance Flatness
TDP/TDM Switch
On-Resistance of DP/DM Short
Off-Leakage Current
On-Leakage Current
DYNAMIC PERFORMANCE (Note 4)
Turn-On Time
t
ON
V
TDP
or V
TDM
= 1.5V, R
L
= 300I,
C
L
= 35pF, V
IH
= V
CC,
V
IL
= 0V, Figure 1
300
800
Fs
V
DP
, V
DM
R
ON
DR
ON
R
FLAT
R
SHORT
I
TDPOFF,
I
TDMOFF
I
DPON
,
I
DMON
V
TDP
= V
TDM
= 0V to V
CC
, I
TDP
= I
TDM
=
10mA
V
CC
= 5.0V, V
DP
= V
DM
= 400mV,
I
DP
= I
DM
= 10mA
V
CC
= 5.0V, V
DP
= V
DM
= 0 to V
CC
,
I
DP
= I
DM
= 10mA
V
CB0
= 0V, V
CB1
= V
CC
, V
DP
= 1V, R
DM
= 20kW
V
CC
= 3.6V, V
DP
= V
DM
= 0.3V to 3.3V,
V
TDP
= V
TDM
= 3.3V to 0.3V
V
CC
= 3.6V, V
DP
= V
DM
= 3.3V to 0.3V,
V
CB_
= V
CC
-250
-250
0
3.5
0.1
0.1
70
120
+250
+250
V
CC
6.5
V
I
I
I
I
nA
nA
3.0
4.75
50
4
10
130
5.5
5.25
100
20
50
200
FA
V
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Current
I
CC
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
Maxim Integrated Products
2
MAX14600–MAX14605
USB Host Charger Identification/Adapter Emulators
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= 3.0V to 5.5V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
CC
= 5.0V, T
A
= +25NC.) (Note 2)
PARAMETER
Turn-Off Time
TDP, TDM Switch Propagation
Delay
Output Skew
TDP, TDM Off-Capacitance
DP, DM On-Capacitance
(Connected to TDP, TDM)
-3dB Bandwidth
Off-Isolation
Crosstalk
DPC INTERNAL RESISTORS
DP/DM Short Pulldown
RP1/RP2 Ratio
RP1 + RP2 Resistance
RM1/RM2 Ratio
RM1 + RM2 Resistance
DPC COMPARATORS (Note 4)
DM1 Comparator Threshold
DM1 Comparator Hysteresis
DM2 Comparator Threshold
DM2 Comparator Hysteresis
DP Comparator Threshold
DP Comparator Hysteresis
CDP INTERNAL RESISTORS
DP Pulldown Resistor
DM Pulldown Resistor
V
DM_SRC
Voltage
V
DAT_REF
Voltage
V
LGC
Voltage
I
DP_SINK
Current
R
DP_DWN
R
DM_DWN
V
DM_SRC
V
DAT_REF
V
LGC
I
DP_SINK
V
DP
= 0.15V to 3.6V
I
LOAD
= 0 to 200FA, T
A
= +25°C
0.5
0.25
0.8
50
14.25
14.25
24.8
24.8
0.7
0.4
2.0
150
kI
kI
V
V
V
FA
V
DPR
DP rising
45
V
DM2F
DM falling
6.31
V
DM1F
DM falling
40
41
1
7
1
46
1
47
7.6
42
%V
CC
%
%V
CC
%
%V
CC
%
R
PD
RT
RP
R
RP
RT
RM
R
RM
320
1.4
85
0.85
60
500
1.5
125
0.86
93
730
1.55
170
0.87
125
kI
—
kI
—
kI
SYMBOL
t
OFF
t
PLH
, t
PHL
t
SK
C
OFF
C
ON
BW
V
ISO
V
CT
CONDITIONS
V
TDP
or V
TDM
= 1.5V, R
L
= 300I,
C
L
= 35pF, V
IH
= V
CC,
V
IL
= 0V, Figure 1
(Note 5)
R
L
= R
S
= 50I
Skew between DP and DM when
connected to TDP and TDM,
R
L
= R
S
= 50I, Figure 2
f = 1MHz, V
BIAS
= 0V
,
V
IN
= 500mV
P-P
f = 240MHz, V
BIAS
= 0V
,
V
IN
= 500mV
P-P
R
L
= R
S
= 50I
V
TDP
or V
DP
= 0dBm, R
L
= R
S
= 50I,
f = 250MHz, Figure 3
V
TDP
or V
DP
= 0dBm, R
L
= R
S
= 50I,
f = 250MHz, Figure 3
MIN
TYP
1
MAX
5
UNITS
Fs
60
ps
40
2.0
4.0
1000
-20
-25
5.5
ps
pF
pF
MHz
dB
dB
CDP LOW-SPEED COMPARATORS
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
Maxim Integrated Products
3
MAX14600–MAX14605
USB Host Charger Identification/Adapter Emulators
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= 3.0V to 5.5V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
CC
= 5.0V, T
A
= +25NC.) (Note 2)
PARAMETER
LOGIC INPUTS (CB0, CB1)
CB0/CB1 Input Logic-High
CB0/CB1 Input Logic-Low
CB0/CB1 Input Leakage Current
CEN/CEN
OUTPUTS
V
BUS
Toggle Time
CEN
Output Logic-High Voltage
CEN
Output Leakage Current
CEN Output Logic-Low Voltage
CEN Output Leakage Current
ESD PROTECTION
ESD Protection Level
V
ESD
HBM
Q2
kV
Note 2:
All units are 100% production tested at T
A
= +25NC. Specifications over temperature are guaranteed by design.
Note 3:
The device is operational from 3.0V to 5.5V. However, to have the valid Apple resistor-divider network, the V
CC
supply
must stay within 4.75V to 5.25V.
Note 4:
Guaranteed by design.
Note 5:
Does not include the delay by the state machine.
t
VBT
CB0 = V
IL
to V
IH
or V
IH
to V
IL
CB0 = V
IL
to V
IH
, I
SOURCE
= 2mA
V
CC
= 5.5V, V
CEN
= 0V,
CEN
deasserted
CB0 = V
IL
to V
IH
, I
SINK
= 2mA
V
CC
= V
CEN
= 5.5V, CEN deasserted
1
V
CC
-
0.4
1
0.4
1
2
3
s
V
FA
V
FA
V
IH
V
IL
I
IN
V
CC
= 5.5V, 0V
P
V
IN
P
V
IL
or
V
IH
P
V
IN
P
V
CC
-1
1.4
0.4
+1
V
V
FA
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Test Circuits/Timing Diagrams
V
CC
V
CC
MAX14600–
MAX14605
V
IN
TD_
CB0
LOGIC
INPUT
CB1*
D_
R
L
GND
V
OUT
C
L
SWITCH
OUTPUT
0V
t
ON
IN DEPENDS ON SWITCH CONFIGURATION;
INPUT POLARITY DETERMINED BY SENSE OF SWITCH.
*NOT AVAILABLE ON MAX14602/MAX14605.
V
OUT
LOGIC
INPUT
V
IH
V
IL
50%
t
r
< 5ns
t
f
< 5ns
t
OFF
0.9 x V
0UT
0.9 x V
OUT
C
L
INCLUDES FIXTURE AND STRAY CAPACITANCE.
V
OUT
= V
IN
R
L
R
L
+ R
ON
Figure 1. Switching Time
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
Maxim Integrated Products
4
MAX14600–MAX14605
USB Host Charger Identification/Adapter Emulators
Test Circuits/Timing Diagrams (continued)
MAX14600–
MAX14605
IN+
R
S
TDP
DP
R
L
R
S
TDM
DM
R
L
CB0
V
CC
CB1*
*NOT AVAILABLE ON MAX14602/MAX14605.
OUT+
RISE-TIME PROPAGATION DELAY = t
PLHX
OR t
PLHY
FALL-TIME PROPAGATION DELAY = t
PHLX
OR t
PHLY
t
SK
= |t
PLHX
- t
PLHY
| OR |t
PHLX
- t
PHLY
|
IN-
OUT-
t
INRISE
V+
V
IN+
0V
V+
V
IN-
0V
t
OUTRISE
t
PLHX
V+
V
OUT+
0V
V+
V
OUT-
0V
t
PHLY
t
PLHY
50%
50%
50%
50%
10%
t
PHLX
90%
50%
50%
50%
50%
10%
t
INFALL
90%
90%
10%
t
OUTFALL
90%
10%
Figure 2. Output Signal Skew
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
Maxim Integrated Products
5
FPGA/CPLD
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