UT8CR512K32 16 Megabit SRAM
参数名称 | 属性值 |
厂商名称 | Aeroflex |
包装说明 | , |
Reach Compliance Code | unknow |
UT8CR512K32-17VPX | UT8CR512K32 | UT8CR512K32-17VCA | UT8CR512K32-17VCC | UT8CR512K32-17VCX | UT8CR512K32-17VPA | UT8CR512K32-17VPC | UT8CR512K32-17VWA | UT8CR512K32-17VWC | UT8CR512K32-17VWX | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | UT8CR512K32 16 Megabit SRAM | UT8CR512K32 16 Megabit SRAM | UT8CR512K32 16 Megabit SRAM | UT8CR512K32 16 Megabit SRAM | UT8CR512K32 16 Megabit SRAM | UT8CR512K32 16 Megabit SRAM | UT8CR512K32 16 Megabit SRAM | UT8CR512K32 16 Megabit SRAM | UT8CR512K32 16 Megabit SRAM | UT8CR512K32 16 Megabit SRAM |
厂商名称 | Aeroflex | - | Aeroflex | Aeroflex | Aeroflex | Aeroflex | Aeroflex | Aeroflex | Aeroflex | Aeroflex |
包装说明 | , | - | GQFF, TPAK68,2.8SQ | GQFF, TPAK68,2.8SQ | GQFF, TPAK68,2.8SQ | , | , | GQFF, TPAK68,2.8SQ | GQFF, TPAK68,2.8SQ | GQFF, TPAK68,2.8SQ |
Reach Compliance Code | unknow | - | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
最长访问时间 | - | - | 17 ns | 17 ns | 17 ns | - | - | 17 ns | 17 ns | 17 ns |
I/O 类型 | - | - | COMMON | COMMON | COMMON | - | - | COMMON | COMMON | COMMON |
JESD-30 代码 | - | - | S-XQFP-F68 | S-XQFP-F68 | S-XQFP-F68 | - | - | S-XQFP-F68 | S-XQFP-F68 | S-XQFP-F68 |
内存密度 | - | - | 16777216 bi | 16777216 bi | 16777216 bi | - | - | 16777216 bi | 16777216 bi | 16777216 bi |
内存集成电路类型 | - | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | - | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | - | - | 32 | 32 | 32 | - | - | 32 | 32 | 32 |
端子数量 | - | - | 68 | 68 | 68 | - | - | 68 | 68 | 68 |
字数 | - | - | 524288 words | 524288 words | 524288 words | - | - | 524288 words | 524288 words | 524288 words |
字数代码 | - | - | 512000 | 512000 | 512000 | - | - | 512000 | 512000 | 512000 |
工作模式 | - | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | - | - | 125 °C | 125 °C | 125 °C | - | - | 125 °C | 125 °C | 125 °C |
最低工作温度 | - | - | -55 °C | -55 °C | -55 °C | - | - | -40 °C | -40 °C | -40 °C |
组织 | - | - | 512KX32 | 512KX32 | 512KX32 | - | - | 512KX32 | 512KX32 | 512KX32 |
输出特性 | - | - | 3-STATE | 3-STATE | 3-STATE | - | - | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | - | - | CERAMIC | CERAMIC | CERAMIC | - | - | CERAMIC | CERAMIC | CERAMIC |
封装代码 | - | - | GQFF | GQFF | GQFF | - | - | GQFF | GQFF | GQFF |
封装等效代码 | - | - | TPAK68,2.8SQ | TPAK68,2.8SQ | TPAK68,2.8SQ | - | - | TPAK68,2.8SQ | TPAK68,2.8SQ | TPAK68,2.8SQ |
封装形状 | - | - | SQUARE | SQUARE | SQUARE | - | - | SQUARE | SQUARE | SQUARE |
封装形式 | - | - | FLATPACK, GUARD RING | FLATPACK, GUARD RING | FLATPACK, GUARD RING | - | - | FLATPACK, GUARD RING | FLATPACK, GUARD RING | FLATPACK, GUARD RING |
并行/串行 | - | - | PARALLEL | PARALLEL | PARALLEL | - | - | PARALLEL | PARALLEL | PARALLEL |
电源 | - | - | 1.8,3.3 V | 1.8,3.3 V | 1.8,3.3 V | - | - | 1.8,3.3 V | 1.8,3.3 V | 1.8,3.3 V |
认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
筛选级别 | - | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
最大待机电流 | - | - | 0.0007 A | 0.0007 A | 0.0007 A | - | - | 0.0007 A | 0.0007 A | 0.0007 A |
最小待机电流 | - | - | 1 V | 1 V | 1 V | - | - | 1 V | 1 V | 1 V |
最大压摆率 | - | - | 0.15 mA | 0.15 mA | 0.15 mA | - | - | 0.15 mA | 0.15 mA | 0.15 mA |
表面贴装 | - | - | YES | YES | YES | - | - | YES | YES | YES |
技术 | - | - | CMOS | CMOS | CMOS | - | - | CMOS | CMOS | CMOS |
温度等级 | - | - | MILITARY | MILITARY | MILITARY | - | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | - | - | FLAT | FLAT | FLAT | - | - | FLAT | FLAT | FLAT |
端子节距 | - | - | 1.27 mm | 1.27 mm | 1.27 mm | - | - | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | - | - | QUAD | QUAD | QUAD | - | - | QUAD | QUAD | QUAD |
总剂量 | - | - | 300k Rad(Si) V | 300k Rad(Si) V | 300k Rad(Si) V | - | - | 300k Rad(Si) V | 300k Rad(Si) V | 300k Rad(Si) V |
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