MBM10470A-10ZF概述

Standard SRAM, 4KX1, 10ns, CDFP18

MBM10470A-10ZF规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	FUJITSU(富士通)
零件包装代码	DFP
包装说明	DFP, FL18,.3
针数	18
Reach Compliance Code	unknown
最长访问时间	10 ns
I/O 类型	SEPARATE
JESD-30 代码	R-XDFP-F18
JESD-609代码	e0
内存密度	4096 bit
内存集成电路类型	STANDARD SRAM
内存宽度	1
负电源额定电压	-5.2 V
端子数量	18
字数	4096 words
字数代码	4000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	4KX1
封装主体材料	CERAMIC
封装代码	DFP
封装等效代码	FL18,.3
封装形状	RECTANGULAR
封装形式	FLATPACK
并行/串行	PARALLEL
电源	-5.2 V
认证状态	Not Qualified
最大压摆率	0.2 mA
表面贴装	YES
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	FLAT
端子节距	1.27 mm
端子位置	DUAL

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MBM10470A-10ZF相似产品对比

	MBM10470A-10ZF	MBM10470A-20ZF	MBM10470A-15ZF	MBM10470A-20CZ	MBM10470A-10CZ	MBM10470A-15CV	MBM10470A-15CZ	MBM10470A-20CV	MBM10470A-10CV
描述	Standard SRAM, 4KX1, 10ns, CDFP18	Standard SRAM, 4KX1, 20ns, CDFP18	Standard SRAM, 4KX1, 15ns, CDFP18	4KX1 STANDARD SRAM, 20ns, CDIP18, CERDIP-18	4KX1 STANDARD SRAM, 10ns, CDIP18, CERDIP-18	4KX1 STANDARD SRAM, 15ns, CQCC18, FRIT SEALED, CERAMIC, LCC-18	4KX1 STANDARD SRAM, 15ns, CDIP18, CERDIP-18	4KX1 STANDARD SRAM, 20ns, CQCC18, FRIT SEALED, CERAMIC, LCC-18	4KX1 STANDARD SRAM, 10ns, CQCC18, FRIT SEALED, CERAMIC, LCC-18
厂商名称	FUJITSU(富士通)	FUJITSU(富士通)	FUJITSU(富士通)	FUJITSU(富士通)	FUJITSU(富士通)	FUJITSU(富士通)	FUJITSU(富士通)	FUJITSU(富士通)	FUJITSU(富士通)
零件包装代码	DFP	DFP	DFP	DIP	DIP	LCC	DIP	LCC	LCC
包装说明	DFP, FL18,.3	DFP, FL18,.3	DFP, FL18,.3	DIP,	DIP,	QCCN,	DIP,	QCCN,	QCCN,
针数	18	18	18	18	18	18	18	18	18
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
最长访问时间	10 ns	20 ns	15 ns	20 ns	10 ns	15 ns	15 ns	20 ns	10 ns
JESD-30 代码	R-XDFP-F18	R-XDFP-F18	R-XDFP-F18	R-GDIP-T18	R-GDIP-T18	R-CQCC-N18	R-GDIP-T18	R-CQCC-N18	R-CQCC-N18
内存密度	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bi
内存集成电路类型	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	1	1	1	1	1	1	1	1	1
负电源额定电压	-5.2 V	-5.2 V	-5.2 V	-5.2 V	-5.2 V	-5.2 V	-5.2 V	-5.2 V	-5.2 V
端子数量	18	18	18	18	18	18	18	18	18
字数	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words
字数代码	4000	4000	4000	4000	4000	4000	4000	4000	4000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	75 °C	75 °C	75 °C	75 °C	75 °C	75 °C
组织	4KX1	4KX1	4KX1	4KX1	4KX1	4KX1	4KX1	4KX1	4KX1
封装主体材料	CERAMIC	CERAMIC	CERAMIC	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	DFP	DFP	DFP	DIP	DIP	QCCN	DIP	QCCN	QCCN
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	FLATPACK	FLATPACK	FLATPACK	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	CHIP CARRIER	CHIP CARRIER
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
表面贴装	YES	YES	YES	NO	NO	YES	NO	YES	YES
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
端子形式	FLAT	FLAT	FLAT	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD
端子节距	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD	DUAL	QUAD	QUAD
ECCN代码	-	-	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
长度	-	-	-	22.78 mm	22.78 mm	8.89 mm	22.78 mm	8.89 mm	8.89 mm
功能数量	-	-	-	1	1	1	1	1	1
端口数量	-	-	-	1	1	1	1	1	1
输出特性	-	-	-	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER
可输出	-	-	-	NO	NO	NO	NO	NO	NO
座面最大高度	-	-	-	5.08 mm	5.08 mm	2.54 mm	5.08 mm	2.54 mm	2.54 mm
技术	-	-	-	TTL	TTL	TTL	TTL	TTL	TTL
宽度	-	-	-	7.62 mm	7.62 mm	7.24 mm	7.62 mm	7.24 mm	7.24 mm

MBM10470A-10ZF

MBM10470A-10ZF概述

MBM10470A-10ZF规格参数

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