Standard SRAM, 256KX1, 20ns, BICMOS, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24
| 参数名称 | 属性值 |
| Objectid | 1401378483 |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 20 ns |
| JESD-30 代码 | R-PDIP-T24 |
| 长度 | 29.72 mm |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 1 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 24 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX1 |
| 可输出 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.36 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | BICMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| MB82B81-20PSK | MB82B81-15PJ | MB82B81-15P-SK | MB82B81-15PSK | MB82B81-20P-SK | |
|---|---|---|---|---|---|
| 描述 | Standard SRAM, 256KX1, 20ns, BICMOS, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24 | Standard SRAM, 256KX1, 15ns, PDSO24 | Standard SRAM, 256KX1, 15ns, PDIP24 | 256KX1 STANDARD SRAM, 15ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24 | IC,SRAM,256KX1,BICMOS-TTL,DIP,24PIN,PLASTIC |
| 包装说明 | DIP, | SOJ, SOJ24,.34 | DIP, DIP24,.3 | DIP, | DIP, DIP24,.3 |
| Reach Compliance Code | unknown | compliant | compliant | unknown | compliant |
| 最长访问时间 | 20 ns | 15 ns | 15 ns | 15 ns | 20 ns |
| JESD-30 代码 | R-PDIP-T24 | R-PDSO-J24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOJ | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | NO |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| ECCN代码 | EAR99 | - | - | EAR99 | EAR99 |
| 是否Rohs认证 | - | 不符合 | 不符合 | - | 不符合 |
| 零件包装代码 | - | SOJ | DIP | DIP | - |
| 针数 | - | 24 | 24 | 24 | - |
| I/O 类型 | - | SEPARATE | SEPARATE | - | SEPARATE |
| JESD-609代码 | - | e0 | e0 | - | e0 |
| 输出特性 | - | 3-STATE | 3-STATE | - | 3-STATE |
| 封装等效代码 | - | SOJ24,.34 | DIP24,.3 | - | DIP24,.3 |
| 最大待机电流 | - | 0.015 A | 0.015 A | - | 0.015 A |
| 最小待机电流 | - | 4.5 V | 4.5 V | - | 4.5 V |
| 最大压摆率 | - | 0.12 mA | 0.12 mA | - | 0.12 mA |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
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