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MJF6388_08

产品描述Complementary Power Darlingtons
文件大小151KB,共8页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
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MJF6388_08概述

Complementary Power Darlingtons

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MJF6388 (NPN),
MJF6668 (PNP)
Preferred Device
Complementary Power
Darlingtons
For Isolated Package Applications
Designed for general−purpose amplifiers and switching
applications, where the mounting surface of the device is required to
be electrically isolated from the heatsink or chassis.
Features
http://onsemi.com
Isolated Overmold Package, TO−220 Type
Electrically Similar to the Popular 2N6388, 2N6668, TIP102, and
TIP107
100 V
CEO(sus)
10 A Rated Collector Current
No Isolating Washers Required
Reduced System Cost
High DC Current Gain
1000 (Min) @ I
C
= 5.0 Adc
High Isolation Voltage (up to 4500 VRMS)
Case 221D is UL Recognized at 3500 VRMS: File #E69369
Pb−Free Packages are Available*
Rating
Symbol
V
CEO
V
CB
V
EB
Value
100
100
5.0
COMPLEMENTARY SILICON
POWER DARLINGTONS
10 AMPERES
100 VOLTS, 40 WATTS
NPN
COLLECTOR 2
PNP
COLLECTOR 2
BASE
1
BASE
1
EMITTER 3
MJF6388
EMITTER 3
MJF6668
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
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MAXIMUM RATINGS
Unit
Vdc
Vdc
Vdc
V
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
RMS Isolation Voltage (Note 1)
(t = 0.3 sec, R.H.
30%, T
A
= 25_C)
Per Figure 14
Collector Current
Continuous
Peak (Note 2)
V
ISOL
I
C
I
B
4500
10
15
Adc
Adc
Base Current
Continuous
1.0
Total Power Dissipation (Note 3) @ T
C
= 25_C
Derate above 25_C
Total Power Dissipation @ T
A
= 25_C
Derate above 25_C
P
D
P
D
40
0.31
W
W/_C
W
W/_C
_C
2.0
0.016
Operating and Storage Temperature Range
Characteristic
T
J
, T
stg
–65 to +150
Max
4.0
MARKING
DIAGRAM
TO−220 FULLPACK
CASE 221D
STYLE 2
UL RECOGNIZED
= Specific Device Code
x = 3 or 6
y = 6 or 8
= Pb−Free Package
= Assembly Location
= Year
= Work Week
MJF6xy8G
AYWW
1
2
3
MJF6xy8
G
A
Y
WW
THERMAL CHARACTERISTICS
ORDERING INFORMATION
Device
MJF6388
MJF6388G
MJF6668
MJF6668G
Package
TO−220 FULLPACK
TO−220 FULLPACK
(Pb−Free)
TO−220 FULLPACK
TO−220 FULLPACK
(Pb−Free)
Shipping
50 Units/Rail
50 Units/Rail
50 Units/Rail
50 Units/Rail
Symbol
R
qJC
R
qJA
Unit
Thermal Resistance, Junction−to−Case (Note 3)
Thermal Resistance, Junction−to−Ambient
_C/W
_C/W
62.5
Lead Temperature for Soldering Purposes
T
L
260
_C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Proper strike and creepage distance must be provided.
2. Pulse Test: Pulse Width = 5.0 ms, Duty Cycle
v
10%.
3. Measurement made with thermocouple contacting the bottom insulated
surface (in a location beneath the die), the devices mounted on a heatsink with
thermal grease and a mounting torque of
6 in. lbs.
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
Publication Order Number:
MJF6388/D
©
Semiconductor Components Industries, LLC, 2008
September, 2008
Rev. 10
1
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