NSR02F30NXT5G
Schottky Barrier Diode
These Schottky barrier diodes are optimized for low forward
voltage drop and low leakage current. The DSN2 (Dual Silicon
No−lead) package is a chip level package using solderable metal
contacts under the package similar to DFN style packages. The DSN
style package enables 100% utilization of the package area for active
silicon, offering a significant performance per board area advantage
compared to products in plastic molded packages. The low thermal
resistance enables designers to meet the challenging task of achieving
higher efficiency and meeting reduced space requirements.
Features
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30 V SCHOTTKY
BARRIER DIODE
1
CATHODE
2
ANODE
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Very Low Forward Voltage Drop
−
370 mV @ 10 mA
Low Reverse Current
−
7.0
mA
@ 10 V VR
200 mA of Continuous Forward Current
ESD Rating
−
Human Body Model: Class 3B
ESD Rating
−
Machine Model: Class C
Very High Switching Speed
Low Capacitance
−
CT = 7 pF
This is a Halide−Free Device
This is a Pb−Free Device
MARKING
DIAGRAM
DSN2
(0201)
CASE 152AA
V230
YYY
PIN 1
V230
YYY
Typical Applications
= Specific Device Code
= Year Code
LCD and Keypad Backlighting
Camera Photo Flash
Buck and Boost dc−dc Converters
Reverse Voltage and Current Protection
Clamping & Protection
ORDERING INFORMATION
Device
NSR02F30NXT5G
Package
Shipping†
DSN2
5000 / Tape & Reel
(Pb−Free)
Markets
Mobile Handsets
MP3 Players
Digital Camera and Camcorders
Notebook PCs & PDAs
GPS
Rating
Symbol
V
R
I
F
(60 Hz @ 1 cycle)
I
FSM
ESD
Value
30
200
4.0
>8.0
>400
Unit
V
mA
A
kV
V
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MAXIMUM RATINGS
Reverse Voltage
Forward Current (DC)
Forward Surge Current
ESD Rating:
Human Body Model
Machine Model
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
©
Semiconductor Components Industries, LLC, 2010
September, 2010
−
Rev. 2
1
Publication Order Number:
NSR02F30/D
NSR02F30NXT5G
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance
Junction−to−Ambient (Note 1)
Total Power Dissipation @ T
A
= 25°C
Thermal Resistance
Junction−to−Ambient (Note 2)
Total Power Dissipation @ T
A
= 25°C
Storage Temperature Range
Junction Temperature
Symbol
R
qJA
P
D
R
qJA
P
D
T
stg
T
J
Min
Typ
Max
400
312
170
735
−40
to +125
+125
Unit
°C/W
mW
°C/W
mW
°C
°C
1. Mounted onto a 4 in square FR−4 board 10 mm sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
2. Mounted onto a 4 in square FR−4 board 1 in sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Characteristic
Reverse Leakage
(V
R
= 10 V)
(V
R
= 30 V)
Forward Voltage
(I
F
= 10 mA)
(I
F
= 200 mA)
Total Capacitance
(V
R
= 5.0 V, f = 1 MHz)
Symbol
I
R
Min
Typ
Max
7.0
50
0.37
0.55
7.0
Unit
mA
V
F
V
CT
pF
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2
NSR02F30NXT5G
PACKAGE DIMENSIONS
DSN2, 0.6x0.3, 0.4P, (0201)
CASE 152AA−01
ISSUE O
D
A
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
DIM
A
A1
b
D
E
e
L
MILLIMETERS
MIN
MAX
0.24
0.30
0.00
0.01
0.22
0.28
0.30 BSC
0.60 BSC
0.40 BSC
0.12
0.18
2X
0.06 C
2X
E
0.06 C
TOP VIEW
0.05 C
A
MOUNTING FOOTPRINT*
0.28
C
SEATING
PLANE
2X
0.05 C
A1
SIDE VIEW
e
0.75
1
2X
0.28
0.30
DIMENSIONS: MILLIMETERS
L
2
2X
b
0.05 C A B
See Application Note AND8398/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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4
NSR02F30/D
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