9.0 to 11.2 11.2 to 14 14 to 18 18 to 22.4 22.4 to 28 28 to 35.5 35.5 to 45 45 to 56
SML-811UT(A)
Reverse
Mount Chip 34125
1.1
SML-811DT(A)
LEDs
SML-811WT(A)
AQ
56 to 71
(Ta=25˚C,
I
F
=20mA)
AR
AS
AT
AU
AV
AW
AX
71 to 90 90 to 112 112 to 140 140 to 180 180 to 224 224 to 280 280 to 355
*Please
note that the brightness of some products may fall between ranks (half rank).
Green (M) Blue (B)
Luminous
G
H
J
K
L
M
N
Intensity
Package
size(mm)
Height(mm)
(mcd)
1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25
SML-810MT
※
Reverse
Mount Chip 34125
1.1
LEDs
P
25 to 40
(Ta=25˚C,
I
F
=20mA)
Q
R
S
T
U
V
W
X
40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000 1000 to 1600
SML-812MT
※
SML812BCT
※Brightness
on specification sheet include tolerance of within
±10%.
Part No. Construction
∗
“−”
will be taken out for
emitting color B series.
S M L
Series name
8 1 2
Package type
M
U
D
W
M
B
T
T 8 6
W
MilkyWhite
P
Rank sign (Brightness Rank)
∗
Chip Type Emitting Color Resin Color Taping Specifications
0
1
2
Standard Type
Low Current Type
High Brightness Type
Red:620nm
Orange:605nm
Yellow:590nm
Yellowish-Green:570(572)nm
Blue:470nm
T86
Cathode at sprocket hole side
T87
Reverse of T86
1
For white LED, cathode at sprocket hole side
∗
Concerning the Brightness rank
• Please refer to the rank chart above for luminous intensity classification.
• Part name is individual for each rank.
• When shipped as sample, the part name will be a representative part name.
General products are free of ranks. Please contact sales if rank appointment is needed.
Packing Specification
ROHM LED products are being shipped with desiccant (silica gel) concluded in moisture-proof bags.
Pasting the moisture sensitive label on the outer surface of the moisture-proof bags or enclosing the humidity indication card inside the bag is available upon request.
Please contact the nearest sales office or distributer if necessary.
发送端使用CC1101+MSP430发送数据
while (!(GDO0));
// Wait for GDO0 to be cleared -> end of packet
while (GDO0);
//halSpiStrobe(CCxxx0_SFTX);这条指令 能运行通过,没有卡住,说明发 ......
随着人类对人工智能研究的不断深入, AI 已然成为当下智能产品研发的主流趋势。但是手机行业出现了一个怪现象,即三类“跟风式” AI :即算力无本质提升的包装式 AI 、功能无实质落地的炒作式AI、缺乏生态建设的封闭式AI。下面就随嵌入式小编一起来了解一下相关内容吧。 未来真正的AI手机应该能够在各个领域缩短我们跟专家的差距。而AI荣耀手机核心战略就是人脑协处理器,缩短普通人与专家距离。...[详细]
在电子制造业领域影响力广泛的专业精品展会——第二十八届中国国际电子生产设备暨微电子工业展(NEPCON China 2018)于2018年4月24日在上海世博展览馆盛大开幕。 作为行业久富盛誉的品质强展,NEPCON China 2018依托国内外电子制造领域前沿技术,全面覆盖SMT表面贴装、测试测量、焊接与点胶喷涂、电子新材料、智慧工厂等各环节革新设备、材料和系统集成方案,联手FUJI、P...[详细]