SnapTac Series
Miniature Circular
Connectors
• HyperSpring
®
spring loaded contacts, self-cleaning
wiping action
• 7, 13, or 19 contact configurations
• Combine robust environmental performance with
compact size and light weight
• Easy and fast snap on locking mechanism
• Full line EMI shielding
• IP67 sealing when mated and unmated
• Different hardware coding to avoid mismatching
• Overmolding solutions
• Upgrade commercial high speed Fast Ethernet, USB,
IEEE 1394 interconnect to Mil Spec performances
• Protection cup available on request
General Specifications
General
Number of Contacts
Receptacle Terminations
Plug Termination
Cable Diameter Range
AWG Contact
HyperSpring Force
Connector Unmating Force
7, 13, 19
Solder Cup, Dip Solder
Solder Cup
7 Contacts: 0.236 [6.00] max., 13 Contacts: 0.295 [7.50] max., 19 Contacts: 0.335 [8.50] max.
24 - 28
5.5 oz. max. per contact
140.0 oz. max.
Electrical and Mechanical Characteristics
EMI Shielding
Current Rating
Breakdown Voltage
Dielectric Withstanding Voltage
(between contacts)
Contact Resistance
(low level)
Insulation Resistance
Vibration
Shock
Weight
(Plug and Receptacle – with contacts – without cabling)
Yes
3 Amps at 25° C
625V
500V
< 15 milliohms
5000 Megohms at 500VDC - EIA364.21
EIA364.28 Condition III
EIA364.27 Condition G
7 Contacts: 0.3 oz., 13 Contacts: 0.5 oz., 19 Contacts: 0.56 oz.
Materials and Plating
Housing
– Material
– Plating
Overmolding
(Plug)
Contact
– Material
– Plating
Aluminum alloy
Zinc cobalt conductive – RoHS compliant
Thermoplastic hotmelt
Brass, beryllium copper
Gold
Environmental Characteristics
Temperature Range
Salt Spray
Humidity
IP Level
-65° C to 80° C
EIA364.26 Condition A (mated connectors)
EIA364.31 Method IV
67 mated and unmated
Dimensions are in inches [mm]
www.hypertronics.com
2 / 51
SnapTac Series
13 Contact Receptacle - Dip Solder Termination
13 Contact Receptacle - Solder Cup Termination
A
0.138
[3.50]
M12x0.75
Ø0.433
[11.00]
Ø0.035
[0.90]
Ø0.606
[15.40]
A
SCALE 1:1
0.142
[3.60]
0.098 – 0.118
[2.50] [3.00]
Ø0.606 0.394
[15.40] [10.00]
0.654
[16.60]
0.795
[20.20]
Panel Cutout
Panel thickness 0.118 [3.00] max.
0.465
+0.004
-0.000
-0.00
[11.80
+0.10
]
Ø0.480
+0.004
-0.000
-0.00
[12.20
+0.10
]
Dimensions are in inches [mm]
www.hypertronics.com
2 / 53
SnapTac Series
13 Contact Receptacle - Dip Solder Termination
A
0.020
[0.50]
M15x0.75
Ø0.543
[13.80]
Ø0.724
[18.40]
A
Ø0.024
[0.60]
SCALE 1:1
0.118
[3.00]
0.098 – 0.118
[2.50] [3.00]
Ø0.724
[18.40]
0.512
[13.00]
0.654
[16.60]
0.772
[19.60]
13 Contact Receptacle - Solder Cup Termination
M15x0.75
A
0.138
[3.50]
Ø0.543
[13.80]
Ø0.724
[18.40]
A
Ø0.035
[0.90]
0.142
[3.60]
0.098 – 0.118
[2.50] [3.00]
SCALE 1:1
Ø0.724
[18.40]
0.512
[13.00]
0.654
[16.60]
0.795
[20.20]
Panel Cutout
Panel thickness 0.118 [3.00] max.
0.579
+0.004
-0.000
-0.00
[14.70
+0.10
]
Ø0.598
+0.004
-0.000
-0.00
[15.20
+0.10
]
Dimensions are in inches [mm]
www.hypertronics.com
2 / 55
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
