SML10SIC03NC
SMD1 (TO-276AB) PACKAGE
SiC SCHOTTKY DIODE
V
R
300V
I
F
2x10A
Semelab’s Silicon Carbide (SiC) Schottky
diodes exhibit low forward voltage, zero
reverse recovery, and superb high-
temperature performance.
The devices employ Semelab’s proven
hermetic packaging technology and are
suitable
for
high-frequency
hard-
switching applications, where system
efficiency and reliability are paramount.
1
2
3
ABSOLUTE MAXIMUM RATINGS
at T
J
= 25°C unless otherwise stated (per leg)
Symbol
V
R
V
RRM
V
RSM
I
F
I
FRM
I
FSM
P
D
T
J
, T
stg
Parameter
DC Reverse Voltage
Repetitive Peak Reverse Voltage
Surge Peak Reverse Voltage
DC Forward Current T
C
= 100°
C
Repetitive Peak Forward Current T
J
= 150° T
C
= 100° D = 0.1
C,
C,
Surge Peak Forward Current T
C
= 25° tp = 10 s
C,
Power Dissipation T
C
= 25°C
Operating Junction and Storage Temperature
Rating
300
300
300
10
45
100
70W
-55 to +175
Units
V
V
V
A
A
A
W
°
C
Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by
Semelab is believed to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or
omissions discovered in its use. Semelab encourages customers to verify that datasheets are current before placing orders.
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: sales@semelab.co.uk Website: http://www.semelab.co.uk
Document Number 6010
Issue 1
SML10SIC03NC
ELECTRICAL CHARACTERISTICS
at T
J
= 25°C unless otherwise stated (per leg)
Symbol
V
F
I
R
Parameter
Forward Voltage
Test Conditions
I
F
= 10A
I
F
= 10A, T
J
= 150°
C
V
R
= 300V
V
R
= 300V, T
J
= 150°
C
V
R
= 200V, I
F
= 10A,
C
di/dt = 200A/µs, T
J
= 150°
V
R
= 0V, f = 1MHz
V
R
= 150V, f = 1MHz
V
R
= 300V, f = 1MHz
Min
Typ
1.5
1.5
15
20
23
n.a.
600
55
40
Max
1.7
1.9
200
1000
Units
V
V
µA
µA
nC
ns
pF
pF
pF
Static Characteristics
Reverse Current
Dynamic Characteristics
Q
c
t
rr
C
Total Capacitive Charge
Reverse Recovery Time
Total Capacitance
THERMAL CHARACTERISTICS
(per leg)
Symbol
R
th
Parameter
Thermal Resistance,
Junction to Case
Test Conditions
TO276AB Package
Min
Typ
2.1
Max
Units
°
C/W
PACKAGE DIMENSIONS
mm (in)
0 .8 9
(0 .0 3 5 )
m in .
3 .7 0 (0 .1 4 6 )
3 .7 0 (0 .1 4 6 )
3 .4 1 (0 .1 3 4 )
3 .4 1 (0 .1 3 4 )
3 .6 0 (0 .1 4 2 )
M a x .
4 .1 4 (0 .1 6 3 )
3 .8 4 (0 .1 5 1 )
1
3
0 .7 6
(0 .0 3 0 )
m in .
1 0 .6 9 (0 .4 2 1 )
1 0 .3 9 (0 .4 0 9 )
2
9 .6
9 .3
1 1 .5
1 1 .2
7 (
8 (
8 (
8 (
0 .3
0 .3
0 .4
0 .4
8 1
6 9
5 6
4 4
)
)
)
)
1 6 .0 2 (0 .6 3 1 )
1 5 .7 3 (0 .6 1 9 )
0 .5 0 (0 .0 2 0 )
0 .2 6 (0 .0 1 0 )
Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by
Semelab is believed to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or
omissions discovered in its use. Semelab encourages customers to verify that datasheets are current before placing orders.
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: sales@semelab.co.uk Website: http://www.semelab.co.uk
Document Number 6010
Issue 1
微控制器 MCU
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