HMC205
v03.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 6 - 12 GHz INPUT
Typical Applications
Features
Conversion Loss: 12 to 17 dB
Fo, 3Fo, 4Fo Isolation: 32 dB
Passive: No Bias Required
2
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
The HMC205 is suitable for:
• Wireless Local Loop
• LMDS, VSAT, and Point-to-Point Radios
• Test Equipment
Functional Diagram
General Description
The HMC205 is a passive miniature frequency doubler
in a MMIC die. Suppression of undesired fundamen-
tal and higher order harmonics is 32 dB typical with
respect to input signal level. The doubler utilizes the
same GaAs Schottky diode/balun technology found in
Hittite MMIC mixers. It features small size, no DC bias,
and no measurable additive phase noise onto the mul-
tiplied signal.
Electrical Specifi cations,
T
A
= +25° C, As a Function of Drive Level
Input = +10 dBm
Parameter
Frequency Range, Input
Frequency Range, Output
Conversion Loss
FO Isolation
(with respect to input level)
3FO Isolation
(with respect to input level)
4FO Isolation
(with respect to input level)
Min.
Typ.
7.0 - 12.0
14.0 - 24.0
18
21
28
36
26
Max.
Min.
Input = +12 dBm
Typ.
6.0 - 12.0
12.0 - 24.0
17
32
40
32
20
Max.
Min.
Input = +15 dBm
Typ.
6.0 - 12.0
12.0 - 24.0
15
18
Max.
Units
GHz
GHz
dB
dB
dB
dB
2 - 16
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC205
v03.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 6 - 12 GHz INPUT
Conversion Gain
vs. Temperature @ +15 dBm Drive Level
0
Isolation @ +15 dBm Drive Level*
0
-10
2
F0
2*F0
3*F0
4*F0
CONVERSION GAIN (dB)
-5
ISOLATION (dB)
-30
-40
-50
-60
-70
-10
-15
-20
6
7
8
9
10
11
12
INPUT FREQUENCY (GHz)
-80
6
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40
FREQUENCY (GHz)
*With respect to input level
Input Return Loss vs. Drive Level
0
Output Return Loss for
Several Input Frequencies
0
6 GHz In
8 GHz In
10 GHz In
12 GHz In
RETURN LOSS (dB)
-10
RETURN LOSS (dB)
-5
-5
-10
-15
+8 dBm
+10 dBm
+12 dBm
+13 dBm
-15
-20
6
7
8
9
10
11
12
FREQUENCY (GHz)
-20
12
14
16
18
20
22
24
OUTPUT FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
2 - 17
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
+25 C
-40 C
+85 C
-20
HMC205
v03.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 6 - 12 GHz INPUT
Conversion Gain @ 25°C vs. Drive Level
Output Return Loss with 6 GHz Input
0
2
CONVERSION GAIN (dB)
0
-5
RETURN LOSS (dB)
-10
-15
-20
-25
-30
-35
-40
6
7
8
9
10
11
12
INPUT FREQUENCY (GHz)
+8 dBm
+10 dBm
+12 dBm
+15 dBm
-5
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
-10
-15
+8 dBm
+10 dBm
+12 dBm
+14 dBm
-20
12
14
16
18
20
22
24
OUTPUT FREQUENCY (GHz)
Conversion Gain @ -55°C vs. Drive Level
0
-5
CONVERSION GAIN (dB)
Output Return Loss with 10 GHz Input
0
-15
-20
-25
-30
-35
-40
6
7
8
9
10
11
12
INPUT FREQUENCY (GHz)
+8 dBm
+10 dBm
+12 dBm
+15 dBm
RETURN LOSS (dB)
-10
-5
+8 dBm
-10
+10 dBm
+12 dBm
+14 dBm
-15
-20
12
14
16
18
20
22
24
OUTPUT FREQUENCY (GHz)
Conversion Gain @ +85°C vs. Drive Level
0
-5
CONVERSION GAIN (dB)
Output Return Loss with 12 GHz Input
0
+8 dBm
RETURN LOSS (dB)
-5
-10
-15
-20
-25
-30
-35
-40
6
7
8
9
10
11
12
INPUT FREQUENCY (GHz)
+8 dBm
+10 dBm
+12 dBm
+15 dBm
-10
-15
+10 dBm
+12 dBm
+14 dBm
-20
12
14
16
18
20
22
24
OUTPUT FREQUENCY (GHz)
2 - 18
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC205
v03.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 6 - 12 GHz INPUT
Absolute Maximum Ratings
Input Drive
Storage Temperature
Operating Temperature
+27 dBm
-65 to +150 °C
-55 to +85 °C
2
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. BOND PADS ARE .004” SQUARE
3. TYPICAL BOND PAD SPACING CENTER TO
CENTER IS .006” EXCEPT AS SHOWN.
4. BACKSIDE METALLIZATION: GOLD
5. BACKSIDE METAL IS GROUND.
6. BOND PAD METALLIZATION: GOLD
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
Die Packaging Information
[1]
Standard
WP-2 (Waffle Pack)
Alternate
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
2 - 19
HMC205
v03.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 6 - 12 GHz INPUT
Pad Desciption
2
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
Pad Number
Function
Description
Interface Schematic
1
RFIN
DC coupled and matched to 50 Ohm.
2
RFOUT
DC coupled and matched to 50 Ohm.
Die Bottom
GND
Die bottom must be connected to RF/DC ground.
2 - 20
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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