HMC204
v04.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 4 - 8 GHz INPUT
Typical Applications
Features
Conversion Loss: 17 dB
Fo, 3Fo, 4Fo Isolation: 38 dB
Passive: No Bias Required
2
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
The HMC204 is suitable for:
• Wireless Local Loop
• LMDS, VSAT, and Point-to-Point Radios
• Test Equipment
Functional Diagram
General Description
The HMC204 is a passive miniature frequency
doubler in a MMIC die. Suppression of undesired fun-
damental and higher order harmonics is 38 dB typical
with respect to input signal level. The doubler utilizes
the same GaAs Schottky diode/balun technology
found in Hittite MMIC mixers. It features small size,
no DC bias, and no measurable additive phase noise
onto the multiplied signal.
Electrical Specifi cations,
T
A
= +25° C, As a Function of Drive Level
Input = +10 dBm
Parameter
Frequency Range, Input
Frequency Range, Output
Conversion Loss
FO Isolation
(with respect to input level)
3FO Isolation
(with respect to input level)
4FO Isolation
(with respect to input level)
Min.
Typ.
5.5 - 7.5
11.0 - 15.0
17
20
41
42
35
Max.
Min.
Input = +12 dBm
Typ.
5.0 - 8.0
10.0 - 16.0
17
45
46
38
20
Max.
Min.
Input = +15 dBm
Typ.
4.0 - 8.0
8.0 - 16.0
18
21
Max.
Units
GHz
GHz
dB
dB
dB
dB
2 - 10
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC204
v04.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 4 - 8 GHz INPUT
Conversion Gain
vs Temperature @ +15 dBm Drive Level
0
-5
CONVERSION GAIN (dB)
-10
ISOLATION (dB)
-15
-20
-25
-30
-35
-40
3
4
5
6
7
8
9
INPUT FREQUENCY (GHz)
+25 C
-55 C
+85 C
Isolation @ +15 dBm Drive Level*
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
0
5
10
15
20
25
30
35
FREQUENCY (GHz)
Fo
3Fo
4Fo
2
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
2 - 11
*With respect to input level
Input Return Loss vs. Drive Level
0
Output Return Loss for
Several Input Frequencies
0
RETURN LOSS (dB)
-10
RETURN LOSS (dB)
-5
-5
-10
-15
Pin = + 8 dBm
Pin = +10 dBm
Pin = +12 dBm
Pin = +14 dBm
-15
4 GHz In
6 GHz In
8 GHz In
-20
3
4
5
6
7
8
9
INPUT FREQUENCY (GHz)
-20
8
10
12
14
16
OUTPUT FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC204
v04.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 4 - 8 GHz INPUT
Conversion Gain @ 25°C vs. Drive Level
Output Return Loss with 4 GHz Input
0
2
CONVERSION GAIN (dB)
0
-5
RETURN LOSS (dB)
-10
-15
-20
-25
-30
-35
-40
3
4
5
6
7
8
9
INPUT FREQUENCY (GHz)
+10 dBm
+12 dBm
+15 dBm
+8 dBm
-5
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
-10
-15
+8 dBm
+10 dBm
+12 dBm
-20
8
10
12
14
16
OUTPUT FREQUENCY (GHz)
Conversion Gain @ -55°C vs. Drive Level
0
-5
CONVERSION GAIN (dB)
Output Return Loss with 6 GHz Input
0
+8 dBm
+10 dBm
+12 dBm
-15
-20
-25
-30
-35
-40
3
4
5
6
7
8
9
INPUT FREQUENCY (GHz)
+8 dBm
+10 dBm
+12 dBm
+15 dBm
RETURN LOSS (dB)
-10
-5
-10
-15
-20
8
10
12
14
16
OUTPUT FREQUENCY (GHz)
Conversion Gain @ +85°C vs. Drive Level
0
-5
CONVERSION GAIN (dB)
Output Return Loss with 8 GHz Input
0
+8 dBm
+12 dBm
+10 dBm
-15
-20
-25
-30
-35
-40
3
4
5
6
7
8
9
INPUT FREQUENCY (GHz)
+8 dBm
+10 dBm
+12 dBm
+15 dBm
RETURN LOSS (dB)
-10
-5
-10
-15
-20
8
10
12
14
16
OUTPUT FREQUENCY (GHz)
2 - 12
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC204
v04.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 4 - 8 GHz INPUT
Absolute Maximum Ratings
Input Drive
Storage Temperature
Operating Temperature
+27 dBm
-65 to +150 °C
-55 to +85 °C
2
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
NOTES:
1. DIE THICKNESS IS 0.100 [0.004], BACKSIDE IS GROUND
2. BOND PADS ARE 0.100 [0.004] SQUARE
3. BOND PAD SPACING, CTR-CTR: 0.150 [0.006]
4. ALL DIMENSION IN INCHES [MILLIMETERS]
5. ALL TOLERANCES ARE ±0.025 [±0.001]
6. BOND PAD METALLIZATION: GOLD
7. BACKSIDE METALLIZATION: GOLD
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
Die Packaging Information
[1]
Standard
WP-2 (Waffle Pack)
Alternate
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
2 - 13
HMC204
v04.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 4 - 8 GHz INPUT
Pad Description
2
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
Pad Number
Function
Description
Interface Schematic
1
RFIN
Pad is DC coupled
and matched to 50 Ohms.
2
RFOUT
Pad is AC coupled
and matched to 50 Ohms.
Die Bottom
GND
Die bottom must be connected to RF/DC ground.
2 - 14
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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