HMC158
v06.0711
GaAs MMIC PASSIVE FREQUENCY
DOUBLER CHIP, 1.3 - 4.0 GHz INPUT
Features
conversion Loss: 15 dB
Fo, 3Fo, 4Fo Isolation: 40 dB
Input Drive Level: 10 to 20 dBm
Die Size: 1.0 x 1.15 x 0.18 mm
2
FREQUEncy MULTIPLIERS - PaSSIvE - cHIP
Typical Applications
The HMc158 is suitable for:
• Wireless Local Loop
• LMDS, VSAT, and Point-to-Point Radios
• UNII & HiperLAN
• Test Equipment
Functional Diagram
General Description
The HMC158 is a miniature frequency doubler in a
MMIc die. Suppression of undesired fundamental
and higher order harmonics is 40 dB typical with
respect to input signal level. The doubler uses the
same diode/balun technology used in Hittite MMIC
mixers, features small size and requires no DC bias.
Electrical Specifications,
T
A
= +25° C, As a Function of Drive Level
Input = +10 dBm
Parameter
Frequency Range, Input
Frequency Range, Output
conversion Loss
FO Isolation
(with respect to input level)
3FO Isolation
(with respect to input level)
4FO Isolation
(with respect to input level)
Min.
Typ.
1.7 - 4.0
3.4 - 8.0
18
22
37
40
32
Max.
Min.
Input = +15 dBm
Typ.
1.7 - 3.5
3.4 - 7.0
15
45
50
40
18
Max.
Min.
Input = +20 dBm
Typ.
1.3 - 4.0
2.6 - 8.0
15
18
Max.
Units
GHz
GHz
dB
dB
dB
dB
2-1
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
HMC158
v06.0711
GaAs MMIC PASSIVE FREQUENCY
DOUBLER CHIP, 1.3 - 4.0 GHz INPUT
Isolation @ +15 dBm Drive Level*
Conversion Gain vs. Drive Level
CONVERSION GAIN (dB)
2
FREQUEncy MULTIPLIERS - PaSSIvE - cHIP
2-2
*With respect to input level
Input Return Loss vs. Drive Level
Output Return Loss vs. Drive Level
Absolute Maximum Ratings
Input Drive
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
+27 dBm
-65 to +150 °c
-55 to +85 °c
class 1a
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
HMC158
v06.0711
GaAs MMIC PASSIVE FREQUENCY
DOUBLER CHIP, 1.3 - 4.0 GHz INPUT
Outline Drawing
2
FREQUEncy MULTIPLIERS - PaSSIvE - cHIP
Die Packaging Information
[1]
Standard
WP-2 (Waffle Pack)
alternate [2]
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] Reference this suffix only when ordering alternate die
packaging.
NOTES:
1. THREE PADS ON EACH CORNER MUST BE
BONDED TO GROUND (12 TOTAL).
2. ALL DIMENSIONS IN INCHES [MILLIMETERS]
3. ALL TOLERANCES ARE 0.001 [0.025]
4. DIE THICKNESS IS 0.007 [0.178]
5. BOND PADS ARE 0.004 [0.100] SQUARE
6. EQUALLY SPACED AT 0.006 [0.150] CENTERS
7. BACKSIDE METALLIZATION: NONE
8. BOND PAD METALLIZATION: GOLD
Pad Description
Pad number
1
Function
RFIn
Description
Pad is DC coupled
and matched to 50 ohms.
Pad is DC coupled
and matched to 50 ohms.
Interface Schematic
2
RFOUT
Die Bottom
GnD
Dc / RF Ground
2-3
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
HMC158
v06.0711
GaAs MMIC PASSIVE FREQUENCY
DOUBLER CHIP, 1.3 - 4.0 GHz INPUT
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage:
All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD
protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry
nitrogen environment.
Cleanliness:
Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning
systems.
Static Sensitivity:
Follow ESD precautions to protect against ESD strikes.
Transients:
Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias
cables to minimize inductive pick-up.
General Handling:
Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The
surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
2
FREQUEncy MULTIPLIERS - PaSSIvE - cHIP
2-4
Mounting
Epoxy Die Attach:
Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the
perimeter of the chip once it is placed into position.
Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of
150 °c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use
the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and
terminated on the package. RF bonds should be as short as possible.
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
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