HMC365
v05.0109
GaAs HBT MMIC
DIVIDE-BY-4, DC - 13 GHz
1
FREQUENCY DIVIDERS - CHIP
Typical Applications
Prescaler for DC to Ku Band PLL Applications:
• Satellite Communication Systems
• Fiber Optic
• Piont-to-Point and Point-to-Multi-Point Radios
• VSAT
Features
Ultra Low SSB Phase Noise: -151 dBc/Hz
Wide Bandwidth
Output Power: 5 dBm
Single DC Supply: +5V
Small Size: 1.30 x 0.69 x 0.1 mm
Functional Diagram
General Description
The HMC365 is a low noise Divide-by-4 Static Divider
with InGaP GaAs HBT technology that has a small
size of 1.30 x 0.69 mm. This device operates from
DC (with a square wave input) to 13 GHz input
frequency with a single +5V DC supply. The low
additive SSB phase noise of -151 dBc/Hz at 100 kHz
offset helps the user maintain good system noise
performance.
Electrical Specifi cations,
T
A
= +25° C, 50 Ohm System, Vcc = 5V
Parameter
Maximum Input Frequency
Minimum Input Frequency
Input Power Range
Sine Wave Input.
[1]
Fin = 1 to 10 GHz
Fin = 10 to 12 GHz
Fin = 12 to 13 GHz
Output Power
[2]
Reverse Leakage
SSB Phase Noise (100 kHz offset)
Output Transition Time
Supply Current (Icc)
[2]
[1] Divider will operate down to DC for square-wave input signal.
[2] When operated in high power mode (pin 8 connected to ground).
Fin = 13 GHz
Both RF Outputs Terminated
Pin = 0 dBm, Fin = 6 GHz
Pin = 0 dBm, Fout = 882 MHz
-15
-10
-5
2
Conditions
Min.
13
Typ.
14
0.2
>-20
>-15
>-8
5
45
-151
100
110
0.5
+10
+3
+3
Max.
Units
GHz
GHz
dBm
dBm
dBm
dBm
dB
dBc/Hz
ps
mA
1 - 26
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC365
v05.0109
GaAs HBT MMIC
DIVIDE-BY-4, DC - 13 GHz
Input Sensitivity Window, T= 25 °C
20
Input Sensitivity Window vs. Temperature
20
1
FREQUENCY DIVIDERS - CHIP
1 - 27
10
INPUT POWER (dBm)
INPUT POWER (dBm)
10
0
Recommended
Operating Window
0
-10
-10
Min Pin +25 C
Max Pin +25 C
Min Pin +85 C
Max Pin +85 C
Min Pin -55 C
Max Pin -55 C
-20
-20
-30
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
INPUT FREQUENCY (GHz)
-30
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
INPUT FREQUENCY (GHz)
Output Power vs. Temperature
10
SSB Phase Noise
Performance, Pin= 0 dBm, T= 25 °C
0
SSB PHASE NOISE (dBc/Hz)
-20
-40
-60
-80
OUTPUT POWER (dBm)
7
4
+25 C
+85 C
-55 C
1
-100
-120
-140
-160
2
10
-2
-5
0
3
6
9
12
15
INPUT FREQUENCY (GHz)
10
3
10
4
10
5
10
6
10
7
OFFSET FREQUENCY (Hz)
Output Harmonic
Content, Pin= 0 dBm, T= 25 °C
0
3rd Harmonic
Reverse Leakage, Pin= 0 dBm, T= 25 °C
0
-10
POWER LEVEL (dBm)
-20
-30
-40
-50
-60
Both Output Ports Terminated
One Output Port Terminated
OUTPUT LEVEL (dBm)
-10
-20
Pfeedthru
-30
-40
2nd Harmonic
-50
0
3
6
9
12
15
INPUT FREQUENCY (GHz)
0
3
6
9
12
15
INPUT FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC365
v05.0109
GaAs HBT MMIC
DIVIDE-BY-4, DC - 13 GHz
1
FREQUENCY DIVIDERS - CHIP
Output Voltage Waveform,
Pin= 0 dBm, Fout= 882 MHz, T= 25 °C
700
500
AMPLITUDE (mV)
300
100
-100
-300
-500
-700
22.7
Absolute Maximum Ratings
RF Input (Vcc = +5V)
Vcc
VLogic
Storage Temperature
Operating Temperature
+13 dBm
+5.5V
Vcc -1.6V to Vcc -1.2V
-65 to +150 °C
-55 to +85 °C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
23.1
23.5
23.9
24.3
24.7
TIME (nS)
Typical Supply Current vs. Vcc
Vcc (V)
4.75
5.0
5.25
Icc (mA)
94
110
118
Note: Divider will operate over full voltage range shown above
Outline Drawing
Die Packaging Information
[1]
Standard
WP-8 (Waffle Pack)
Alternate
[2]
NOTES:
1. ALL DIMENSIONS IN INCHES (MILLIMETERS)
2. ALL TOLERANCES ARE ±0.001 (0.025)
3. DIE THICKNESS IS 0.004 (0.100) BACKSIDE IS GROUND
4. BOND PADS ARE 0.004 (0.100) SQUARE
5. BOND PAD SPACING, CTR-CTR: 0.006 (0.150)
6. BACKSIDE METALLIZATION: GOLD
7. BOND PAD METALLIZATION: GOLD
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
1 - 28
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC365
v05.0109
GaAs HBT MMIC
DIVIDE-BY-4, DC - 13 GHz
Pad Description
Pad Number
Function
Description
Interface Schematic
1
RF Input 180° out of phase with pad 3 for differential operation.
AC ground for single ended operation.
1
IN
2
IN
RF Input must be DC blocked.
3, 4, 5
Vcc
Supply Voltage 5V ±0.25V can be applied to pad 3, 4, or 5.
6
OUT
Divided Output
7
OUT
Divided output 180° out of phase with OUT.
8
PWR SEL
In the low power mode, the power select pin is left floating.
By grounding this pin, the output power is increased by
approximately 10 dB.
9
PWR DWN
The power down pin is grounded for normal operation.
Applying 5 volts to this pin will power down this device.
10
DISABLE
The disable pin is grounded for normal operation.
Applying 5 volts to this pin will disable the input buffer amplifier.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
1 - 29
FREQUENCY DIVIDERS - CHIP
HMC365
v05.0109
GaAs HBT MMIC
DIVIDE-BY-4, DC - 13 GHz
1
FREQUENCY DIVIDERS - CHIP
Truth Table
Function
DISABLE
PWR
DWN
PWR
SEL
Pin
10
9
5V
Output Off
Power
Down
X
GND
Output On
Power Up
High
Power
Output
Float
X
X
Low
Power
Output
8
X = State not permitted.
Assembly Diagrams
To +5V Vcc Supply
(Bypassed via 10 uF Capacitor).
AC coupling capacitors.
AC coupling capacitors.
Optional AC coupled
differential input. Should
be AC grounded for
single ended operation.
Optional AC coupled
differential output. For best
single ended reverse leakage
performance, this port should
be terminated into 50 ohm.
This port should be grounded
for normal operation. Applying
+5V to this port will disable the
input buffer amplifier.
This port should be grounded
for normal operation. Applying
+5V to this port will power down
the device.
For high power output, this
port should be bonded to
ground. For low power output,
this port should be floating.
1 - 30
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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