HMC292
v06.1007
GaAs MMIC DOUBLE-BALANCED
MIXER, 18 - 32 GHz
Typical Applications
The HMC292 is ideal for:
• Microwave Point-to-Point Radios
• LMDS
• SATCOM
Features
Input IP3: +19 dBm
LO / RF Isolation: 38 dB
Passive: No DC Bias Required
Small Size: 1.04 x 0.58 x 0.1 mm
4
MIXERS - DOUBLE-BALANCED - CHIP
Functional Diagram
General Description
The HMC292 chip is a miniature passive GaAs MMIC
double-balanced mixer which can be used as an
upconverter or downconverter from 18 - 32 GHz in a
small chip area of 0.66 mm
2
. Excellent isolations are
provided by on-chip baluns, which require no exter-
nal components and no DC bias. All data is measured
with the chip in a 50 ohm test fixture connected via
0.076 mm (3 mil) ribbon bonds of minimal length <0.31
mm (<12 mils).
Electrical Specifi cations,
T
A
= +25° C
LO = +13 dBm
Parameter
Min.
Frequency Range, RF & LO
Frequency Range, IF
Conversion Loss
Noise Figure (SSB)
LO to RF Isolation
LO to IF Isolation
RF to IF Isolation
IP3 (Input)
IP2 (Input)
1 dB Gain Compression (Input)
30
31
20
17
45
8
Typ.
20 - 30
DC - 8
7.5
7.5
38
40
24
19
50
12
9.5
9.5
30
28
17
15
42
8
Max.
Min.
Typ.
18 - 32
DC - 8
9
9
38
40
24
19
50
12
11
11
Max.
GHz
GHz
dB
dB
dB
dB
dB
dB
dBm
dBm
LO = +13 dBm
Units
4 - 42
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC292
v06.1007
GaAs MMIC DOUBLE-BALANCED
MIXER, 18 - 32 GHz
Isolation @ LO = +13 dBm
0
LO/RF
LO/IF
RF/IF
Conversion Gain vs.
Temperature @ LO = +13 dBm
0
CONVERSION GAIN (dB)
-5
ISOLATION (dB)
-10
-20
-10
-30
-15
+25 C
+85 C
-55 C
-40
4
15
20
25
FREQUENCY (GHz)
30
35
15
20
25
FREQUENCY (GHz)
30
35
Conversion Gain vs. LO Drive
0
+8 dBm
+10 dBm
+13 dBm
+15 dBm
RF & LO
Return Loss @ LO = +13 dBm
0
LO
RF
-10
RETURN LOSS (dB)
-5
-5
-10
-15
-15
-20
15
20
25
FREQUENCY (GHz)
30
35
-20
15
20
25
FREQUENCY (GHz)
30
35
IF Bandwidth @ LO = +13 dBm
IF CONVERSION GAIN & RETURN LOSS (dB)
0
Upconverter Performance
Conversion Gain @ LO = +13 dBm
0
CONVERSION GAIN (dB)
-5
-5
-10
-10
-15
CONVERSION GAIN (dB)
RETRUN LOSS
-15
-20
0
2
4
6
8
10
IF FREQUENCY (GHz)
-20
15
20
25
FREQUENCY (GHz)
30
35
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
4 - 43
MIXERS - DOUBLE-BALANCED - CHIP
-20
-50
CONVERSION GAIN (dB)
HMC292
v06.1007
GaAs MMIC DOUBLE-BALANCED
MIXER, 18 - 32 GHz
Input IP3 vs.
Temperature @ LO = +13 dBm
25
Input IP3 vs. LO Drive
25
20
15
10
5
0
-5
15
20
25
FREQUENCY (GHz)
30
35
+8 dBm
+10 dBm
+13 dBm
20
IP3 (dBm)
IP3 (dBm)
15
-55C
+25C
+85C
4
MIXERS - DOUBLE-BALANCED - CHIP
10
5
0
15
20
25
FREQUENCY (GHz)
30
35
Input IP2 vs. LO Drive
80
70
60
IP2 (dBm)
Input IP2 vs.
Temperature @ LO = +13 dBm
80
70
60
IP2 (dBm)
50
40
30
20
10
0
-55C
+25C
+85C
50
40
30
20
10
0
15
20
25
FREQUENCY (GHz)
30
35
+8 dB,
+10 dBm
+13 dBm
15
20
25
FREQUENCY (GHz)
30
35
Input P1dB vs.
Temperature @ LO = +13 dBm
15
MxN Spurious Outputs
nLO
mRF
0
xx
17
1
11
0
70
39
77
93
>110
76
69
>110
86
>110
2
3
4
13
0
1
2
P1dB
11
-55C
+25C
+85C
9
3
4
7
RF = 21 GHz @ -10 dBm
LO = 22 GHz @ +13 dBm
All values in dBc below the IF power level.
15
20
25
FREQUENCY (GHz)
30
35
5
4 - 44
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC292
v06.1007
GaAs MMIC DOUBLE-BALANCED
MIXER, 18 - 32 GHz
Absolute Maximum Ratings
RF / IF Input
LO Drive
Channel Temperature
Continuous Pdiss (T=85 °C)
(derate 4 mW/°C above 85 °C)
Thermal Resistance (R
TH
)
(junction to die bottom)
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
+13 dBm
+27 dBm
150 °C
260 mW
250 °C/W
-65 to +150 °C
-55 to +85 °C
Class 1C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
4
MIXERS - DOUBLE-BALANCED - CHIP
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. DIE THICKNESS IS .004”.
3. TYPICAL BOND PAD IS .004” SQUARE.
4. BACKSIDE METALLIZATION: GOLD.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
Outline Drawing
Die Packaging Information
[1]
Standard
GP-5 (Gel Pack)
Alternate
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
4 - 45
HMC292
v06.1007
GaAs MMIC DOUBLE-BALANCED
MIXER, 18 - 32 GHz
Pad Descriptions
Pad Number
Function
Description
Interface Schematic
1
LO
This pin is DC coupled
and matched to 50 Ohms.
4
2
RF
This pin is DC coupled
and matched to 50 Ohms.
MIXERS - DOUBLE-BALANCED - CHIP
3
IF
This pin is DC coupled. For applications not requiring operation
to DC, this port should be DC blocked externally using a series
capacitor whose value has been chosen to pass the necessary IF
frequency range. For operation to DC, this pin must not source/
sink more than 2 mA of current or die non-function and possible
die failure will result.
Die Bottom
GND
Die bottom must be connected to RF/DC ground.
4 - 46
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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