POWER, FET
POWER, 场效应晶体管
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Vishay(威世) |
| 零件包装代码 | TO-252 |
| 包装说明 | SMALL OUTLINE, R-PSSO-G2 |
| 针数 | 3 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 雪崩能效等级（Eas） | 27.4 mJ |
| 外壳连接 | DRAIN |
| 配置 | SINGLE WITH BUILT-IN DIODE |
| 最小漏源击穿电压 | 60 V |
| 最大漏极电流 (Abs) (ID) | 7.7 A |
| 最大漏极电流 (ID) | 7.7 A |
| 最大漏源导通电阻 | 0.2 Ω |
| FET 技术 | METAL-OXIDE SEMICONDUCTOR |
| JEDEC-95代码 | TO-252 |
| JESD-30 代码 | R-PSSO-G2 |
| JESD-609代码 | e3 |
| 湿度敏感等级 | 1 |
| 元件数量 | 1 |
| 端子数量 | 2 |
| 工作模式 | ENHANCEMENT MODE |
| 最高工作温度 | 150 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 极性/信道类型 | N-CHANNEL |
| 最大功率耗散 (Abs) | 25 W |
| 最大脉冲漏极电流 (IDM) | 31 A |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子位置 | SINGLE |
| 处于峰值回流温度下的最长时间 | 40 |
| 晶体管应用 | SWITCHING |
| 晶体管元件材料 | SILICON |
| SIHLR014TRL-GE3 | SIHLR014-GE3 | SIHLU014-GE3 | SIHLR014 | SIHLR014-E3 | SIHLR014T-E3 | SIHLR014TL-E3 | SIHLU014 | SIHLU014-E3 | IRLR014_10 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | POWER, FET | POWER, FET | POWER, FET | POWER, FET | POWER, FET | POWER, FET | POWER, FET | POWER, FET | POWER, FET | POWER, FET |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 不符合 | 符合 | 符合 | 符合 | 不符合 | 符合 | - |
| 厂商名称 | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | - |
| 零件包装代码 | TO-252 | TO-252 | TO-251 | TO-252 | TO-252 | TO-252 | TO-252 | TO-251 | TO-251 | - |
| 包装说明 | SMALL OUTLINE, R-PSSO-G2 | SMALL OUTLINE, R-PSSO-G2 | IN-LINE, R-PSIP-T3 | SMALL OUTLINE, R-PSSO-G2 | SMALL OUTLINE, R-PSSO-G2 | SMALL OUTLINE, R-PSSO-G2 | SMALL OUTLINE, R-PSSO-G2 | IN-LINE, R-PSIP-T3 | IN-LINE, R-PSIP-T3 | - |
| 针数 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | - |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 雪崩能效等级（Eas） | 27.4 mJ | 27.4 mJ | 27.4 mJ | 27.4 mJ | 27.4 mJ | 27.4 mJ | 27.4 mJ | 27.4 mJ | 27.4 mJ | - |
| 外壳连接 | DRAIN | DRAIN | DRAIN | DRAIN | DRAIN | DRAIN | DRAIN | DRAIN | DRAIN | - |
| 配置 | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | - |
| 最小漏源击穿电压 | 60 V | 60 V | 60 V | 60 V | 60 V | 60 V | 60 V | 60 V | 60 V | - |
| 最大漏极电流 (Abs) (ID) | 7.7 A | 7.7 A | 7.7 A | 7.7 A | 7.7 A | 7.7 A | 7.7 A | 7.7 A | 7.7 A | - |
| 最大漏极电流 (ID) | 7.7 A | 7.7 A | 7.7 A | 7.7 A | 7.7 A | 7.7 A | 7.7 A | 7.7 A | 7.7 A | - |
| 最大漏源导通电阻 | 0.2 Ω | 0.2 Ω | 0.2 Ω | 0.2 Ω | 0.2 Ω | 0.2 Ω | 0.2 Ω | 0.2 Ω | 0.2 Ω | - |
| FET 技术 | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | - |
| JEDEC-95代码 | TO-252 | TO-252 | TO-251 | TO-252 | TO-252 | TO-252 | TO-252 | TO-251 | TO-251 | - |
| JESD-30 代码 | R-PSSO-G2 | R-PSSO-G2 | R-PSIP-T3 | R-PSSO-G2 | R-PSSO-G2 | R-PSSO-G2 | R-PSSO-G2 | R-PSIP-T3 | R-PSIP-T3 | - |
| JESD-609代码 | e3 | e3 | e3 | e0 | e3 | e3 | e3 | e0 | e3 | - |
| 湿度敏感等级 | 1 | 1 | - | - | 1 | 1 | 1 | - | 1 | - |
| 元件数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 2 | 2 | 3 | 2 | 2 | 2 | 2 | 3 | 3 | - |
| 工作模式 | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | - |
| 最高工作温度 | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | - |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 240 | 260 | 260 | 260 | 240 | 260 | - |
| 极性/信道类型 | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | - |
| 最大功率耗散 (Abs) | 25 W | 25 W | 25 W | 25 W | 25 W | 25 W | 25 W | 25 W | 25 W | - |
| 最大脉冲漏极电流 (IDM) | 31 A | 31 A | 31 A | 31 A | 31 A | 31 A | 31 A | 31 A | 31 A | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 表面贴装 | YES | YES | NO | YES | YES | YES | YES | NO | NO | - |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | - |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | - |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 30 | 40 | 40 | 40 | 30 | 40 | - |
| 晶体管应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | - |
| 晶体管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | - |
| 其他特性 | - | - | - | LOGIC LEVEL COMPATIBLE | LOGIC LEVEL COMPATIBLE | LOGIC LEVEL COMPATIBLE | LOGIC LEVEL COMPATIBLE | LOGIC LEVEL COMPATIBLE | LOGIC LEVEL COMPATIBLE | - |
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