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SIHFZ14S-GE3

产品描述Power MOSFET
产品类别分立半导体    晶体管   
文件大小339KB,共10页
制造商Vishay(威世)
官网地址http://www.vishay.com
标准
下载文档 详细参数 选型对比 全文预览

SIHFZ14S-GE3概述

Power MOSFET

SIHFZ14S-GE3规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Vishay(威世)
零件包装代码D2PAK
包装说明SMALL OUTLINE, R-PSSO-G2
针数4
Reach Compliance Codeunknow
ECCN代码EAR99
其他特性HIGH RELIABILITY, ULTRA-LOW RESISTANCE
雪崩能效等级(Eas)47 mJ
外壳连接DRAIN
配置SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压60 V
最大漏极电流 (Abs) (ID)10 A
最大漏极电流 (ID)10 A
最大漏源导通电阻0.2 Ω
FET 技术METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码TO-263AB
JESD-30 代码R-PSSO-G2
元件数量1
端子数量2
工作模式ENHANCEMENT MODE
最高工作温度175 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)260
极性/信道类型N-CHANNEL
最大功率耗散 (Abs)43 W
最大脉冲漏极电流 (IDM)40 A
认证状态Not Qualified
表面贴装YES
端子形式GULL WING
端子位置SINGLE
处于峰值回流温度下的最长时间40
晶体管应用SWITCHING
晶体管元件材料SILICON

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IRFZ14S, IRFZ14L, SiHFZ14S, SiHFZ14L
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
V
DS
(V)
R
DS(on)
()
Q
g
(Max.) (nC)
Q
gs
(nC)
Q
gd
(nC)
Configuration
V
GS
= 10 V
11
3.1
5.8
Single
D
FEATURES
60
0.20
Halogen-free According to IEC 61249-2-21
Definition
• Advanced Process Technology
• Surface Mount (IRFZ14S, SiHFZ14S)
• Low-Profile Through-Hole (IRFZ14L, SiHFZ14L)
• 175 °C Operating Temperature
• Fast Switching
• Compliant to RoHS Directive 2002/95/EC
Third generation Power MOSFETs from Vishay utilize
advanced processing techniques to achieve extermely low
on resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
Power MOSFETs are well known for, provides the designer
with an extermely efficient reliabel deviece for use in a wide
variety of applications.
The D
2
PAK is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and lowest possible on-resistance
in any existing surface mount package. The D
2
PAK is
suitable for high current applications because of its low
internal connection resistance and can dissipate up to 2.0 W
in a typical surface mount application.
The through-hole version (IRFZ14L, SiHFZ44L) is available
for low profile applications.
D
2
PAK (TO-263)
SiHFZ14STRL-GE3
a
IRFZ14STRLPbF
a
SiHFZ14STL-E3
a
I
2
PAK (TO-262)
SiHFZ14L-GE3
IRFZ14LPbF
SiHFZ14L-E3
DESCRIPTION
I
2
PAK
(TO-262)
D
2
PAK (TO-263)
G
G
D
S
G
D
S
S
N-Channel MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
Note
a. See device orientation.
D
2
PAK (TO-263)
SiHFZ14S-GE3
IRFZ14SPbF
SiHFZ14S-E3
ABSOLUTE MAXIMUM RATINGS
(T
C
= 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain
Linear Derating Factor
Single Pulse Avalanche Energy
b
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)
e
Peak Diode Recovery dV/dt
c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
Current
a
V
GS
at 10 V
T
C
= 25 °C
T
C
= 100 °C
SYMBOL
V
DS
V
GS
I
D
I
DM
E
AS
T
C
= 25 °C
T
A
= 25 °C
P
D
dV/dt
T
J
, T
stg
for 10 s
LIMIT
60
± 20
10
7.2
40
0.29
47
43
3.7
4.5
- 55 to + 175
300
d
UNIT
V
A
W/°C
mJ
W
V/ns
°C
Notes
b. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
c. V
DD
= 25 V, starting T
J
= 25 °C, L = 548 μH, R
g
= 25
,
I
AS
= 10 A (see fig. 12).
d. I
SD
10 A, dI/dt
90 A/μs, V
DD
V
DS
, T
J
175 °C.
e. 1.6 mm from case.
f. When mounted on 1" square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 90365
S11-1063-Rev. C, 30-May-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000

SIHFZ14S-GE3相似产品对比

SIHFZ14S-GE3 IRFZ14LPBF SIHFZ14L-E3 SIHFZ14L-GE3 SIHFZ14S SIHFZ14S-E3 SIHFZ14STL-E3 SIHFZ14STRL-GE3
描述 Power MOSFET Power MOSFET Power MOSFET Power MOSFET Power MOSFET Power MOSFET Power MOSFET Power MOSFET
是否无铅 不含铅 不含铅 不含铅 不含铅 含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 不符合 符合 符合 符合
零件包装代码 D2PAK TO-262AA TO-262AA TO-262AA D2PAK D2PAK D2PAK D2PAK
包装说明 SMALL OUTLINE, R-PSSO-G2 IN-LINE, R-PSIP-T3 IN-LINE, R-PSIP-T3 IN-LINE, R-PSIP-T3 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2
针数 4 3 3 3 4 4 4 4
Reach Compliance Code unknow unknown unknow unknow unknow unknow unknow unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
其他特性 HIGH RELIABILITY, ULTRA-LOW RESISTANCE HIGH RELIABILITY, ULTRA-LOW RESISTANCE HIGH RELIABILITY, ULTRA-LOW RESISTANCE HIGH RELIABILITY, ULTRA-LOW RESISTANCE HIGH RELIABILITY, ULTRA-LOW RESISTANCE HIGH RELIABILITY, ULTRA-LOW RESISTANCE HIGH RELIABILITY, ULTRA-LOW RESISTANCE HIGH RELIABILITY, ULTRA-LOW RESISTANCE
雪崩能效等级(Eas) 47 mJ 47 mJ 47 mJ 47 mJ 47 mJ 47 mJ 47 mJ 47 mJ
配置 SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压 60 V 60 V 60 V 60 V 60 V 60 V 60 V 60 V
最大漏极电流 (Abs) (ID) 10 A 10 A 10 A 10 A 10 A 10 A 10 A 10 A
最大漏极电流 (ID) 10 A 10 A 10 A 10 A 10 A 10 A 10 A 10 A
最大漏源导通电阻 0.2 Ω 0.2 Ω 0.2 Ω 0.2 Ω 0.2 Ω 0.2 Ω 0.2 Ω 0.2 Ω
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码 TO-263AB TO-262AA TO-262AA TO-262AA TO-263AB TO-263AB TO-263AB TO-263AB
JESD-30 代码 R-PSSO-G2 R-PSIP-T3 R-PSIP-T3 R-PSIP-T3 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2
元件数量 1 1 1 1 1 1 1 1
端子数量 2 3 3 3 2 2 2 2
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE
最高工作温度 175 °C 175 °C 175 °C 175 °C 175 °C 175 °C 175 °C 175 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE IN-LINE IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
峰值回流温度(摄氏度) 260 260 260 260 240 260 260 260
极性/信道类型 N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL
最大功率耗散 (Abs) 43 W 43 W 43 W 43 W 43 W 43 W 43 W 43 W
最大脉冲漏极电流 (IDM) 40 A 40 A 40 A 40 A 40 A 40 A 40 A 40 A
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 YES NO NO NO YES YES YES YES
端子形式 GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING
端子位置 SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
处于峰值回流温度下的最长时间 40 40 40 40 30 40 40 40
晶体管应用 SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING
晶体管元件材料 SILICON SILICON SILICON SILICON SILICON SILICON SILICON SILICON
厂商名称 Vishay(威世) - Vishay(威世) Vishay(威世) Vishay(威世) Vishay(威世) Vishay(威世) Vishay(威世)
外壳连接 DRAIN - - - DRAIN DRAIN DRAIN DRAIN
JESD-609代码 - e3 e3 - e0 e3 e3 -
端子面层 - Matte Tin (Sn) Matte Tin (Sn) - Tin/Lead (Sn/Pb) Matte Tin (Sn) Matte Tin (Sn) -

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