Datasheet> 器件分类 > 连接器> 插座> KSX131-210MG3M

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KSX131-210MG3M: 产品描述IC Socket, PGA131, 131 Contact(s),; 产品类别连接器插座; 文件大小129KB，共1页; 制造商Advanced Interconnections Corp; 标准

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KSX131-210MG3M概述

IC Socket, PGA131, 131 Contact(s),

KSX131-210MG3M规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	Advanced Interconnections Corp
Reach Compliance Code	compliant
ECCN代码	EAR99
联系完成配合	GOLD OVER NICKEL
联系完成终止	Matte Tin (Sn) - with Nickel (Ni) barrier
触点材料	BERYLLIUM COPPER
设备插槽类型	IC SOCKET
使用的设备类型	PGA131
外壳材料	POLYIMIDE
JESD-609代码	e3
触点数	131

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.100" (2.54mm) Staggered

(Interstitial) PGA Sockets

5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com

.100" (2.54mm) Staggered (Interstitial) PGA Sockets

Standard Quick Turn Terminals

Type -210

Peel-A-Way

Only

Type -176

Peel-A-Way

Only

.058 Dia.

(1.47)

Type -234

Molded Only

.059 Dia.

(1.50)

.165

(4.19)

.058 Dia.

(1.47)

.015

(.38)

.155

(3.94)

.031

(.79)

.155

(3.95)

.180

(4.57)

Features:

• Available in high temperature molded or

Peel-A-Way

removable terminal carrier.

• .100” (2.54mm) centers pin to pin.

• Multiple finger contact for reliability.

• Tapered entry for ease of insertion.

• Closed end construction for 100% anti-

wicking of solder.

• Low insertion force socket.

• Available with solder preforms.

.034 Dia.

(.86)

.034 Dia.

(.86)

.018 Dia.

(.46)

Type -235

4 standoffs per socket

Type -234 used in remaining positions

Molded Only

.059 Dia.

(1.50)

Type -82

Molded Only

.059 Dia.

(1.50)

Patented Solder

Preform Terminal

Type -311

Molded Only

.059 Dia.

(1.50)

.209

(5.31)

.165

(4.19)

.136

(3.45)

.018 Dia.

(.46)

.125

(3.18)

.018 Dia.

(.46)

.165

(4.19)

Solder

Preform

.180

(4.57)

Terminals and Contacts:

Terminal: Brass - Copper Alloy (C36000)

ASTM-B-16

Contact: Beryllium Copper (C17200)

ASTM-B-194

.018 Dia.

(.46)

Quick turn delivery available on standard terminal types.

Additional terminal types available.

See terminal section for detailed terminal information.

Solder Preform:

63% Tin, 37% Lead

Plating:

Terminal: Gold over Nickel or

Tin-Lead over Nickel

Contact: Gold over Nickel or

Tin-Lead over Nickel

Gold per MIL-G-45204

Tin-Lead per MIL-P-81728

Nickel per QQ-N-290

Footprint Dash #

If Applicable*

Body Type

CSX - Standard Molded

KSX - Peel-A-Way

How To Order

CSX

503

-234

Contact Plating

G - Gold T - Tin-Lead

Terminal Plating

G - Gold

T - Tin-Lead

Terminal Type

Body Material:

CSX

- L.C.P. - Liquid

Crystal Polymer

-35˚C to 255˚C

(-31˚F to 491˚F)

KSX

- Polyimide Film

-269˚C to 400˚C

(-452˚F to 752˚F)

.100

(2.54)

Number of Pins

*See pages 67 - 73 for PGA footprints.

Molded

Body

Sealant Options

RTV

Seal

Type -235

Shown

.005 Typ.

(.13)

Type -210

Shown

RTV Sealed

To order: Add RTV to end of part #

Peel-A-Way

covered by patent rights issued and/or pending.

Tape Sealed

To order: Add 3M to end of part #

inch/(mm)

Products shown covered by patents issued and/or pending. Specifications subject to change without notice.

Page 66

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