is the ambient or operating temperature, P is the power dissipation and R
th
is
a fixed thermal resistance value which depends on the package and circuit board mounting conditions.
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only. Functional
operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
V
DD
= 5V
±
5%, Operating temperature range (unless otherwise noted). Positive currents flow into the IC.
LIMITS
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
V
DD
Supply Current
VIO Supply Current
I
DD
I
IO
Recessive: V
TXD
= V
DD
Dominant: V
TXD
= 0 V
Standby Mode: V
TXD
= V
DD
6
50
15
10
70
30
100
mA
mA
μA
μA
DIGITAL INPUTS (Pins TXD, STB)
HIGH-level input voltage (see Note 1)
LOW-level input voltage
HIGH-level input current
LOW-level input current
V
IH
V
IL
I
IH
I
IL
V
TXD
= V
DD
or VIO
V
TXD
= 0 V
70%V
DD
− 0.5
−5
0
− 50
V
DD
+ 0.5
30%V
DD
+5
− 150
V
V
μA
μA
DIGITAL OUTPUTS
HIGH-level output voltage (RXD Pin) (see Note 1)
LOW-level output voltage (RXD Pin)
Output voltage (SPLIT Pin)
Standby leakage current (SPLIT Pin)
V
OH
V
OL
V
SPLIT
I
STB
I
OH
= 1mA
I
OL
= 1mA
− 100 μA < I
SPLIT
< 100 μA
90%V
DD
0
0.45V
DD
-5
0.1
0.5V
DD
10%V
DD
0.55V
DD
+5
V
V
V
μA
DRIVER
CANH dominant output voltage
CANL dominant output voltage
Recessive output voltage
Bus output voltage in standby
Dominant differential output voltage
Recessive differential output voltage
Matching of dominant output voltage,
V
DD
− V
O(CANH)
− V
O(CANL)
Steady state common mode output voltage
V
O(CANH)
V
O(CANL)
V
CANH(r)
,
V
CANL(r)
V
STB
V
DIFF(d)(o)
V
DIFF(r)(o)
V
OM
V
OC(ss)
V
TXD
= 0 V
V
TXD
= 0 V (See Fig. 2)
V
TXD
= V
DD
, R
L
= 0 (See Fig. 2)
V
TXD
= V
DD
, R
L
= 0 (See Fig. 2)
V
TXD
= 0 V, 45 Ω < R
L
< 65 Ω
V
TXD
= V
DD
, no load (See Fig. 2)
(See Fig. 4)
V
STB
= 0V, R
L
= 60 Ω (See Fig. 5)
3
0.5
2
-0.1
1.5
− 50
− 100
2
1.8
0
-40
0.5V
DD
3.6
1.4
0.5V
DD
4.25
1.75
3
0.1
3
50
150
3
V
V
V
V
V
mV
mV
V
NOTE:
1. When VIO is connected (HI-5001 or HI-5002), limits are referenced wrt VIO rather than V
SMT贴片机是表面贴装技术（Surface Mount Technology）中的重要设备，它的性能状态对电子制造的质量和效率有着决定性的影响。因此，对SMT贴片机的主要指标性能进行定期检测非常重要。以下是一些主要的检测项目： 定位精度：定位精度是SMT贴片机的核心性能指标，它直接影响到贴片的准确性。通常，我们通过重复测量贴片机在X、Y轴上的移动误差来检测其定位精度。 贴片速度：贴片速度...[详细]
编译自semiengineering 业界越来越关注人工智能的功耗问题，但这个问题并没有简单的解决方案。这需要深入了解应用、半导体和系统层面的软件和硬件架构，以及所有这些的设计和实现方式。每个环节都会影响总功耗和提供的效用。这是最终必须做出的权衡。 但首先，必须解决效用问题。电力是否被浪费了？“我们将电力用于有价值的用途，”Ansys（现为新思科技旗下公司）产品营销总监 Marc Swi...[详细]
stm32/stm8
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
