d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 65 °C/W.
Document Number: 65738
S10-0637-Rev. A, 22-Mar-10
www.vishay.com
1
Symbol
R
thJA
Typical
19
1.2
Maximum
24
1.8
Unit
New Product
SiR800DP
Vishay Siliconix
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
a
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= 10 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= 5 A
0.65
30
17
16
14
T
C
= 25 °C
50
80
1.1
60
34
A
V
ns
nC
ns
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 10 V, R
L
= 1
Ω
I
D
≅
10 A, V
GEN
= 4.5 V, R
g
= 1
Ω
V
DD
= 10 V, R
L
= 1
Ω
I
D
≅
10 A, V
GEN
= 10 V, R
g
= 1
Ω
f = 1 MHz
0.4
V
DS
= 10 V, V
GS
= 10 V, I
D
= 10 A
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 10 A
V
DS
= 10 V, V
GS
= 0 V, f = 1 MHz
5125
1050
510
89
41
7.4
7.6
1.2
13
8
54
10
27
15
70
27
2.4
25
16
100
20
50
30
120
50
ns
Ω
133
62
nC
pF
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
V
GS
= 0 V, I
D
= 250 µA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 12 V
V
DS
= 20 V, V
GS
= 0 V
V
DS
= 20 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≥
5 V, V
GS
= 10 V
V
GS
= 10 V, I
D
= 15 A
V
GS
= 4.5 V, I
D
= 12 A
V
GS
= 2.5 V, I
D
= 10 A
V
DS
= 10 V, I
D
= 15 A
40
0.0019
0.0021
0.0028
96
0.0023
0.0026
0.0034
S
Ω
0.6
20
18
- 4.1
1.5
± 100
1
10
V
mV/°C
V
nA
µA
A
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
Document Number: 65738
S10-0637-Rev. A, 22-Mar-10
New Product
SiR800DP
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
80
V
GS
= 10 V thru 2 V
10
64
I
D
- Drain Current (A)
I
D
- Drain Current (A)
8
48
6
T
C
= 25 °C
32
4
16
2
T
C
= 125 °C
T
C
= - 55 °C
0
0
0.5
1.0
1.5
2.0
2.5
V
DS
- Drain-to-Source Voltage (V)
0
0
0.6
1.2
1.8
2.4
3.0
V
GS
- Gate-to-Source Voltage (V)
Output Characteristics
0.0034
6800
Transfer Characteristics
C
iss
0.0030
R
DS(on)
- On-Resistance (Ω)
C - Capacitance (pF)
V
GS
= 2.5 V
5440
0.0026
4080
0.0022
V
GS
= 4.5 V
2720
C
oss
0.0018
V
GS
= 10 V
1360
C
rss
0.0014
0
16
32
48
64
80
I
D
- Drain Current (A)
0
0
4
8
12
16
20
V
DS
- Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
10
I
D
= 15 A
V
GS
- Gate-to-Source Voltage (V)
8
R
DS(on)
- On-Resistance
(Normalized)
Capacitance
1.6
I
D
= 15 A
1.4
V
GS
= 10 V
6
V
DS
= 5 V
V
DS
= 10 V
4
V
DS
= 15 V
2
1.2
V
GS
= 2.5 V
1.0
0.8
0
0
19
38
57
76
95
0.6
- 50
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge
T
J
- Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 65738
S10-0637-Rev. A, 22-Mar-10
www.vishay.com
3
New Product
SiR800DP
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
100
0.0080
I
D
= 15 A
10
T
J
= 150 °C
R
DS(on)
- On-Resistance (Ω)
I
S
- Source Current (A)
0.0064
1
T
J
= 25 °C
0.0048
0.1
0.0032
T
J
= 125 °C
0.01
0.0016
T
J
= 25 °C
0.001
0.0
0
0.2
0.4
0.6
0.8
1.0
1.2
0
2
4
6
8
10
V
SD
- Source-to-Drain Voltage (V)
V
GS
- Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
0.3
200
On-Resistance vs. Gate-to-Source Voltage
0.1
V
GS(th)
- Variance (V)
160
- 0.3
I
D
= 250 μA
Power (W)
- 0.1
I
D
= 5 mA
120
80
- 0.5
40
- 0.7
- 50
- 25
0
25
50
75
100
125
150
0
0.001
0.01
0.1
Time (s)
1
10
T
J
- Junction Temperature (°C)
Threshold Voltage
100
Limited by R
DS(on)
*
Single Pulse Power, Junction-to-Ambient
1 ms
10
I
D
- Drain Current (A)
10 ms
100 ms
1
1s
10 s
0.1
T
A
= 25 °C
Single Pulse
BVDSS Limited
DC
0.01
0.01
0.1
1
10
100
V
DS
- Drain-to-Source Voltage (V)
* V
GS
> minimum V
GS
at which R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient
www.vishay.com
4
Document Number: 65738
S10-0637-Rev. A, 22-Mar-10
New Product
SiR800DP
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
150
120
I
D
- Drain Current (A)
90
60
Package Limited
30
0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
Current Derating*
90
2.5
72
2.0
Power (W)
36
Power (W)
54
1.5
1.0
18
0.5
0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
0
0
25
50
75
100
125
150
T
A
- Ambient Temperature (°C)
Power, Junction-to-Case
Power, Junction-to-Ambient
* The power dissipation P
D
is based on T
J(max)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
Yamaha Motor Group旗下的i-PULSE有限公司日前已与华尔莱科技（Valor）结为合作伙伴关系，基于Valor的vPlan生产规划工具向i-PULSE组装设备的使用者提供完整的从设计到制造的NPI解决方案。在近期日本东京举办的Protec展会（6/11-6/13）上，i-PULSE首度展出了该新产品并将直接向其客户进行销售。 新产品的名称为“iPlan”，它将提供一系...[详细]
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