d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 54 °C/W.
Document Number: 64815
S09-0873-Rev. A, 18-May-09
www.vishay.com
1
Symbol
R
thJA
Typical
15
0.9
Maximum
20
1.2
Unit
New Product
SiR404DP
Vishay Siliconix
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
a
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= 10 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= 5 A
0.65
38
36
21
17
T
C
= 25 °C
60
100
1.1
75
72
A
V
ns
nC
ns
C
iss
C
oss
C
rss
V
DS
= 10 V, V
GS
= 2.5 V, I
D
= 20 A
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 10 V, R
L
= 1.0
Ω
I
D
≅
10 A, V
GEN
= 4.5 V, R
g
= 1
Ω
V
DD
= 10 V, R
L
= 1.0
Ω
I
D
≅
10 A, V
GEN
= 10 V, R
g
= 1
Ω
f = 1 MHz
0.2
V
DS
= 10 V, V
GS
= 3.3 V, I
D
= 20 A
V
DS
= 10 V, V
GS
= 4.5 V, I
D
= 20 A
V
DS
= 10 V, V
GS
= 0 V, f = 1 MHz
8130
1570
735
36.5
47.5
64.5
11.4
12.1
1.0
14
9
68
9
35
20
123
26
2
28
18
120
18
60
40
210
50
ns
Ω
97
nC
pF
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
V
GS
= 0 V, I
D
= 250 µA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 12 V
V
DS
= 20 V, V
GS
= 0 V
V
DS
= 20 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≥
5 V, V
GS
= 10 V
V
GS
= 10 V, I
D
= 20 A
V
GS
= 4.5 V, I
D
= 20 A
V
GS
= 2.5 V, I
D
= 15 A
V
DS
= 10 V, I
D
= 20 A
30
0.0013
0.0014
0.0018
150
0.00160
0.00175
0.00225
S
Ω
0.6
20
17
- 4.4
1.5
± 100
1
10
V
mV/°C
V
nA
µA
A
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
Document Number: 64815
S09-0873-Rev. A, 18-May-09
New Product
SiR404DP
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
80
V
GS
= 10
V
thru 3
V
64
I
D
- Drain Current (A)
I
D
- Drain Current (A)
8
10
48
6
32
4
T
C
= 25 °C
2
T
C
= 125 °C
T
C
= - 55 °C
1.5
2.0
2.5
16
0
0.0
0.5
1.0
1.5
2.0
2.5
0
0.0
0.5
1.0
V
DS
- Drain-to-Source
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Output Characteristics
0.0025
10 000
Transfer Characteristics
C
iss
R
DS(on)
- On-Resistance (Ω)
0.0021
C - Capacitance (pF)
V
GS
= 2.5
V
0.0017
V
GS
= 4.5
V
0.0013
V
GS
= 10
V
0.0009
8000
6000
4000
2000
C
rss
C
oss
0.0005
0
16
32
48
64
80
0
0
4
8
12
16
20
I
D
- Drain Current (A)
V
DS
- Drain-to-Source
Voltage
(V)
On-Resistance vs. Drain Current and Gate Voltage
10
I
D
= 20 A
V
GS
- Gate-to-Source
Voltage
(V)
8
R
DS(on)
- On-Resistance
1.5
1.8
I
D
= 20 A
Capacitance
V
GS
= 10
V
(Normalized)
6
V
DS
= 10
V
V
DS
= 5
V
1.2
V
GS
= 2.5
V
4
V
DS
= 15
V
2
0.9
0
0
30
60
90
120
150
0.6
- 50
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge (nC)
T
J
- Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 64815
S09-0873-Rev. A, 18-May-09
www.vishay.com
3
New Product
SiR404DP
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
100
T
J
= 150 °C
R
DS(on)
- On-Resistance (Ω)
10
I
S
- Source Current (A)
T
J
= 25 °C
0.004
0.005
I
D
= 20 A
1
0.003
T
J
= 125 °C
0.1
0.002
0.01
0.001
T
J
= 25 °C
0.001
0.0
0.000
0.2
0.4
0.6
0.8
1.0
1.2
0
1
2
3
4
5
6
7
8
9
10
V
SD
- Source-to-Drain
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Source-Drain Diode Forward Voltage
0.5
200
On-Resistance vs. Gate-to-Source Voltage
0.2
V
GS(th)
Variance
(V)
160
Power (W)
- 0.1
I
D
= 5 mA
- 0.4
I
D
= 250
µA
- 0.7
120
80
40
- 1.0
- 50
- 25
0
25
50
75
100
125
150
0
0.001
0.01
0.1
Time (s)
1
10
T
J
- Temperature (°C)
Threshold Voltage
100
Limited
by
R
DS(on)
*
Single Pulse Power, Junction-to-Ambient
1 ms
10
I
D
- Drain Current (A)
10 ms
100 ms
1
1s
10 s
0.1
T
A
= 25 °C
Single Pulse
0.01
0.01
BVDSS Limited
DC
0.1
1
10
100
V
DS
- Drain-to-Source
Voltage
(V)
*
V
GS
> minimum
V
GS
at
which
R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient
www.vishay.com
4
Document Number: 64815
S09-0873-Rev. A, 18-May-09
New Product
SiR404DP
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
210
168
I
D
- Drain Current (A)
126
84
Package Limited
42
0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
Current Derating*
125
3.0
100
2.4
Power (W)
Power (W)
75
1.8
50
1.2
25
0.6
0
0
25
50
75
100
125
150
0.0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
T
A
- Ambient Temperature (°C)
Power, Junction-to-Case
Power, Junction-to-Ambient
* The power dissipation P
D
is based on T
J(max)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
便携式医疗设备的特殊性决定了它们应该是对用户友好的、必须工作在无菌环境下，并且空间占用小、耗能低。 同时，便携式医疗设备还需要足够的计算能力以便处理医疗数据，能够连接到无线或有线接口以便记录和发送数据。从设计人员的角度考虑，上述需求需要低功耗的单片机（MCU）和数字信号控制器（Digital Signal Controller，DSC）。 正是有了嵌入式处理器，设计人员才有可能设...[详细]
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