d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 70 °C/W.
g. Package limited.
Document Number: 65271
S11-1647-Rev. B, 22-Aug-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiR172DP
Vishay Siliconix
SPECIFICATIONS
(T
J
= 25 °C, unless otherwise noted)
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
Current
a
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= 10 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= 10 A
0.85
14
5
7
7
T
C
= 25 °C
20
50
1.2
28
10
A
V
ns
nC
ns
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 15 V, R
L
= 1.5
I
D
10 A, V
GEN
= 10 V, R
g
= 1
V
DD
= 15 V, R
L
= 1.5
I
D
10 A, V
GEN
= 4.5 V, R
g
= 1
f = 1 MHz
0.2
V
DS
= 15 V, V
GS
= 10 V, I
D
= 16.1 A
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 16.1 A
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
997
195
120
19.5
9.8
3.7
3.7
1.2
19
19
19
13
9
9
18
8
2.4
29
29
29
20
18
18
27
15
ns
30
15
nC
pF
V
DS
V
DS
/T
J
V
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
V
GS
= 0 V, I
D
= 250 µA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= 30 V, V
GS
= 0 V
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
5
V, V
GS
= 10 V
V
GS
= 10 V, I
D
= 16.1 A
V
GS
= 4.5 V, I
D
= 13.6 A
V
DS
= 15 V, I
D
= 16.1 A
20
0.0074
0.0103
49
0.0089
0.0124
1.2
30
28
- 5.5
2.5
± 100
1
10
V
mV/°C
V
nA
µA
A
S
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; pulse width
300 µs, duty cycle
2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
Document Number: 65271
S11-1647-Rev. B, 22-Aug-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiR172DP
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
50
5
T
C
= - 55 °C
V
GS
= 10
V
thru 5
V
I
D
- Drain Current (A)
40
4
I
D
- Drain Current (A)
30
3
T
C
= 125 °C
2
T
C
= 25 °C
1
20
10
V
GS
= 4
V
0
0.0
0
0.3
0.6
0.9
1.2
V
DS
- Drain-to-Source
Voltage
(V)
1.5
0
2
3
V
GS
- Gate-to-Source
Voltage
(V)
1
4
Output Characteristics
Transfer Characteristics
0.015
1500
C
iss
R
DS(on)
- On-Resistance (W)
1200
0.012
V
GS
= 4.5
V
C - Capacitance (pF)
900
600
C
oss
300
0.009
V
GS
= 10
V
C
rss
0.006
0
10
20
30
I
D
- Drain Current (A)
40
50
0
0
6
12
18
24
30
V
DS
- Drain-to-Source
Voltage
(V)
On-Resistance vs. Drain Current and Gate Voltage
10
R
DS(on)
- On-Resistance (Normalized)
I
D
= 16.1 A
V
GS
- Gate-to-Source
Voltage
(V)
8
V
DS
= 15
V
6
V
DS
= 24
V
4
V
DS
=
8 V
1.7
I
D
= 16.1 A
1.4
Capacitance
V
GS
= 4.5
V
V
GS
= 10
V
1.1
0.8
2
0
0
3
6
9
12
15
18
21
Q
g
- Total Gate Charge (nC)
0.5
- 50
- 25
0
25
50
75
100
T
J
- Junction Temperature (°C)
125
150
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 65271
S11-1647-Rev. B, 22-Aug-11
www.vishay.com
3
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiR172DP
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
100
0.03
10
R
DS(on)
- On-Resistance (W)
I
S
- Source Current (A)
0.02
T
J
= 125 °C
0.01
T
J
= 25 °C
T
J
= 150 °C
1
T
J
= 25 °C
0.1
0.0
0.3
0.6
0.9
1.2
V
SD
- Source-to-Drain
Voltage
(V)
0.00
2
3
4
5
6
7
8
V
GS
- Gate-to-Source
Voltage
(V)
9
10
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
2.5
40
2.2
30
I
D
= 250
µA
V
GS(th)
(V)
1.9
Power (W)
- 25
0
25
50
75
T
J
- Temperature (°C)
100
125
150
20
1.6
10
1.3
1.0
- 50
0
0.01
0.1
1
Time (s)
10
100
1000
Threshold Voltage
100
Limited
by
R
DS(on)
*
Single Pulse Power, Junction-to-Ambient
10
I
D
- Drain Current (A)
100
µs
1 ms
1
10 ms
100 ms
1s
10 s
DC
T
A
= 25 °C
Single Pulse
BVDSS
Limited
0.1
0.01
0.1
1
10
100
V
DS
- Drain-to-Source
Voltage
(V)
*
V
GS
> minimum
V
GS
at
which
R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient
www.vishay.com
4
Document Number: 65271
S11-1647-Rev. B, 22-Aug-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiR172DP
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
50
40
I
D
- Drain Current (A)
30
Package Limited
20
10
0
0
25
50
75
100
T
C
- Case Temperature (°C)
125
150
Current Derating*
40
2.5
2.0
30
Power (W)
Power (W)
0
25
50
75
100
125
150
1.5
20
1.0
10
0.5
0
T
C
- Case Temperature (°C)
0.0
0
25
50
75
100
125
150
T
A
- Ambient Temperature (°C)
Power Derating, Junction-to-Case
Power Derating, Junction-to-Ambient
* The power dissipation P
D
is based on T
J(max)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Document Number: 65271
S11-1647-Rev. B, 22-Aug-11
www.vishay.com
5
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
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