16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Winbond(华邦电子) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP8,.3 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 50 MHz |
| 数据保留时间-最小值 | 20 |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDIP-T8 |
| 长度 | 9.27 mm |
| 内存密度 | 16777216 bi |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 2097152 words |
| 字数代码 | 2000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 2MX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 2.5/3.3 V |
| 编程电压 | 2.7 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.33 mm |
| 串行总线类型 | SPI |
| 最大待机电流 | 0.00001 A |
| 最大压摆率 | 0.018 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 类型 | NOR TYPE |
| 宽度 | 7.62 mm |
| 写保护 | HARDWARE/SOFTWARE |
| W25X16ALDAIZ | W25X16A | W25X16ALSFIG | W25X16ALSNIG | W25X16ALSSIG | W25X16ALZPIG | W25X16AVZPIG | W25X16_08 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI | 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI | 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI | 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI | 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI | 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI | 16M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI | 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | - |
| 厂商名称 | Winbond(华邦电子) | - | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | - |
| 零件包装代码 | DIP | - | SOIC | SOIC | SOIC | SON | SON | - |
| 包装说明 | DIP, DIP8,.3 | - | SOP, SOP16,.4 | 0.150 INCH, GREEN, PLASTIC, SOIC-8 | 0.208 INCH, GREEN, PLASTIC, SOIC-8 | HVSON, SOLCC8,.25 | WSON-8 | - |
| 针数 | 8 | - | 16 | 8 | 8 | 8 | 8 | - |
| Reach Compliance Code | compli | - | compliant | unknow | compli | compli | unknow | - |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 最大时钟频率 (fCLK) | 50 MHz | - | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 75 MHz | - |
| 数据保留时间-最小值 | 20 | - | 20 | 20 | 20 | 20 | 20 | - |
| 耐久性 | 100000 Write/Erase Cycles | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | - |
| JESD-30 代码 | R-PDIP-T8 | - | R-PDSO-G16 | R-PDSO-G8 | S-PDSO-G8 | R-PDSO-N8 | R-PDSO-N8 | - |
| 长度 | 9.27 mm | - | 10.285 mm | 4.85 mm | 5.28 mm | 6 mm | 6 mm | - |
| 内存密度 | 16777216 bi | - | 16777216 bit | 16777216 bi | 16777216 bi | 16777216 bi | 16777216 bi | - |
| 内存集成电路类型 | FLASH | - | FLASH | FLASH | FLASH | FLASH | FLASH | - |
| 内存宽度 | 8 | - | 8 | 8 | 8 | 8 | 8 | - |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 8 | - | 16 | 8 | 8 | 8 | 8 | - |
| 字数 | 2097152 words | - | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | - |
| 字数代码 | 2000000 | - | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | - |
| 工作模式 | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 组织 | 2MX8 | - | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | - |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | DIP | - | SOP | SOP | SOP | HVSON | VSON | - |
| 封装等效代码 | DIP8,.3 | - | SOP16,.4 | SOP8,.25 | SOP8,.3 | SOLCC8,.25 | SOLCC8,.25 | - |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | IN-LINE | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | - |
| 并行/串行 | SERIAL | - | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | - |
| 电源 | 2.5/3.3 V | - | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 3/3.3 V | - |
| 编程电压 | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 5.33 mm | - | 2.64 mm | 1.72 mm | 2.16 mm | 0.8 mm | 0.8 mm | - |
| 串行总线类型 | SPI | - | SPI | SPI | SPI | SPI | SPI | - |
| 最大待机电流 | 0.00001 A | - | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | - |
| 最大压摆率 | 0.018 mA | - | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.02 mA | - |
| 最大供电电压 (Vsup) | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - |
| 最小供电电压 (Vsup) | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - |
| 标称供电电压 (Vsup) | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V | - |
| 表面贴装 | NO | - | YES | YES | YES | YES | YES | - |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子形式 | THROUGH-HOLE | - | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD | - |
| 端子节距 | 2.54 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | - |
| 类型 | NOR TYPE | - | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | - |
| 宽度 | 7.62 mm | - | 7.49 mm | 3.9 mm | 5.28 mm | 5 mm | 5 mm | - |
| 写保护 | HARDWARE/SOFTWARE | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - |
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