D Flip-Flop, S Series, 1-Func, Positive Edge Triggered, 6-Bit, True Output, TTL, HERMETIC SEALED, DFP-16
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | AMD(超微) |
零件包装代码 | DFP |
包装说明 | DFP, FL16,.3 |
针数 | 16 |
Reach Compliance Code | unknown |
系列 | S |
JESD-30 代码 | R-XDFP-F16 |
JESD-609代码 | e0 |
逻辑集成电路类型 | D FLIP-FLOP |
位数 | 6 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | TRUE |
封装主体材料 | UNSPECIFIED |
封装代码 | DFP |
封装等效代码 | FL16,.3 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
传播延迟(tpd) | 17 ns |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 Class C |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
触发器类型 | POSITIVE EDGE |
最小 fmax | 75 MHz |
SN54S174W | SN54S175J | SN74S174N | SN54S174J | SN74S175N | SN74S175J | SN54S175W | SN74S174J | |
---|---|---|---|---|---|---|---|---|
描述 | D Flip-Flop, S Series, 1-Func, Positive Edge Triggered, 6-Bit, True Output, TTL, HERMETIC SEALED, DFP-16 | D Flip-Flop, S Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, CDIP16, DIP-16 | D Flip-Flop, S Series, 1-Func, Positive Edge Triggered, 6-Bit, True Output, TTL, PDIP16, DIP-16 | D Flip-Flop, 6-Func, Positive Edge Triggered, TTL, CDIP16 | D Flip-Flop, S Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, PDIP16, DIP-16 | D Flip-Flop, S Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, PDIP16, DIP-16 | D Flip-Flop, S Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, CDFP16, DFP-16 | D Flip-Flop, S Series, 1-Func, Positive Edge Triggered, 6-Bit, True Output, TTL, CDIP16, DIP-16 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-XDFP-F16 | R-GDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-GDFP-F16 | R-GDIP-T16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
功能数量 | 1 | 1 | 1 | 6 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C |
封装主体材料 | UNSPECIFIED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | DFP | DIP | DIP | DIP | DIP | DIP | DFP | DIP |
封装等效代码 | FL16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 | DIP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | IN-LINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | NO | NO | NO | YES | NO |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
是否无铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | - | 含铅 | 含铅 |
厂商名称 | AMD(超微) | - | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
零件包装代码 | DFP | DIP | DIP | - | DIP | - | DFP | DIP |
针数 | 16 | 16 | 16 | - | 16 | - | 16 | 16 |
系列 | S | S | S | - | S | S | S | S |
位数 | 6 | 4 | 6 | - | 4 | 4 | 4 | 6 |
输出极性 | TRUE | COMPLEMENTARY | TRUE | - | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | TRUE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
传播延迟(tpd) | 17 ns | 17 ns | 17 ns | - | 17 ns | 17 ns | 17 ns | 17 ns |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.25 V | - | 5.25 V | 5.25 V | 5.5 V | 5.25 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.75 V | - | 4.75 V | 4.75 V | 4.5 V | 4.75 V |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
最小 fmax | 75 MHz | 75 MHz | 75 MHz | - | 75 MHz | 75 MHz | 75 MHz | 75 MHz |
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