Freescale Semiconductor
Data Sheet: Product Preview
Document Number: K50P81M100SF2
Rev. 4, 3/2011
K50 Sub-Family Data Sheet
Features
• Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 85°C
• Performance
– Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
• Memories and memory interfaces
– Up to 512 KB program flash memory on non-
FlexMemory devices
– Up to 256 KB program flash memory on
FlexMemory devices
– Up to 256 KB FlexNVM on FlexMemory devices
– 4 KB FlexRAM on FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
• Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
• System peripherals
– 10 low-power modes to provide power optimization
based on application requirements
– Memory protection unit with multi-master
protection
– 16-channel DMA controller, supporting up to 64
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
• Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
K50P81M100SF2
Supports the following:
MK50X256CLK100, MK50X256CMB100
• Human-machine interface
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
• Analog modules
– Two 16-bit SAR ADCs
– Programmable gain amplifier (up to x64) integrated
into each ADC
– Two 12-bit DACs
– Two operational amplifiers
– Two transimpedance amplifiers
– Two analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
– Voltage reference
• Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timer
– Two 2-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
• Communication interfaces
– USB full-/low-speed On-the-Go controller with on-
chip transceiver
– Two SPI modules
– Two I2C modules
– Four UART modules
– I2S module
This document contains information on a product under development. Freescale
reserves the right to change or discontinue this product without notice.
© 2010–2011 Freescale Semiconductor, Inc.
Preliminary
Table of Contents
1 Ordering parts...........................................................................4
1.1 Determining valid orderable parts......................................4
2 Part identification......................................................................4
2.1 Description.........................................................................4
2.2 Format...............................................................................4
2.3 Fields.................................................................................4
2.4 Example............................................................................5
3 Terminology and guidelines......................................................5
3.1 Definition: Operating requirement......................................5
3.2 Definition: Operating behavior...........................................6
3.3 Definition: Attribute............................................................6
3.4 Definition: Rating...............................................................7
3.5 Result of exceeding a rating..............................................7
3.6 Relationship between ratings and operating
requirements......................................................................7
3.7 Guidelines for ratings and operating requirements............8
3.8 Definition: Typical value.....................................................8
3.9 Typical value conditions....................................................9
4 Ratings......................................................................................9
4.1 Thermal handling ratings...................................................10
4.2 Moisture handling ratings..................................................10
4.3 ESD handling ratings.........................................................10
4.4 Voltage and current operating ratings...............................10
5 General.....................................................................................11
5.1 Nonswitching electrical specifications...............................11
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
5.1.6
5.1.7
5.1.8
Voltage and current operating requirements.........11
LVD and POR operating requirements.................12
Voltage and current operating behaviors..............13
Power mode transition operating behaviors..........13
Power consumption operating behaviors..............14
EMC radiated emissions operating behaviors.......17
Designing with radiated emissions in mind...........18
Capacitance attributes..........................................18
6.6.7
6.6.6
6.1 Core modules....................................................................21
6.1.1
6.1.2
Debug trace timing specifications.........................21
JTAG electricals....................................................21
6.2 System modules................................................................25
6.3 Clock modules...................................................................25
6.3.1
6.3.2
6.3.3
MCG specifications...............................................25
Oscillator electrical specifications.........................27
32kHz Oscillator Electrical Characteristics............29
6.4 Memories and memory interfaces.....................................30
6.4.1
6.4.2
6.4.3
Flash (FTFL) electrical specifications....................30
EzPort Switching Specifications............................34
Flexbus Switching Specifications..........................35
6.5 Security and integrity modules..........................................38
6.6 Analog...............................................................................38
6.6.1
6.6.2
6.6.3
6.6.4
6.6.5
ADC electrical specifications.................................38
CMP and 6-bit DAC electrical specifications.........46
12-bit DAC electrical characteristics.....................49
Op-amp electrical specifications...........................52
Transimpedance amplifier electrical
specifications — full range....................................53
Transimpedance amplifier electrical
specifications — limited range..............................54
Voltage reference electrical specifications............55
6.7 Timers................................................................................56
6.8 Communication interfaces.................................................57
6.8.1
6.8.2
6.8.3
6.8.4
6.8.5
6.8.6
6.8.7
6.8.8
USB electrical specifications.................................57
USB DCD electrical specifications........................57
USB VREG electrical specifications......................57
DSPI switching specifications (low-speed mode)..58
DSPI switching specifications (high-speed mode) 59
I2C switching specifications..................................61
UART switching specifications..............................61
I2S switching specifications..................................61
5.2 Switching specifications.....................................................18
5.2.1
5.2.2
Device clock specifications...................................18
General switching specifications...........................19
6.9 Human-machine interfaces (HMI)......................................63
6.9.1
TSI electrical specifications...................................63
7 Dimensions...............................................................................64
7.1 Obtaining package dimensions.........................................64
8 Pinout........................................................................................64
8.1 K50 Signal Multiplexing and Pin Assignments..................65
8.2 K50 Pinouts.......................................................................69
5.3 Thermal specifications.......................................................20
5.3.1
5.3.2
Thermal operating requirements...........................20
Thermal attributes.................................................20
6 Peripheral operating requirements and behaviors....................20
K50 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
2
Preliminary
Freescale Semiconductor, Inc.
9 Revision History........................................................................70
K50 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Freescale Semiconductor, Inc.
Preliminary
3
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to
http://www.freescale.com
and perform a part number
search for the following device numbers: PK50 and MK50.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## M FFF T PP CCC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
K##
M
Qualification status
Kinetis family
Flash memory type
Description
Values
• M = Fully qualified, general market flow
• P = Prequalification
• K50
• N = Program flash only
• X = Program flash and FlexMemory
Table continues on the next page...
K50 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
4
Preliminary
Freescale Semiconductor, Inc.
Terminology and guidelines
Field
FFF
Description
Program flash memory size
•
•
•
•
•
•
32 = 32 KB
64 = 64 KB
128 = 128 KB
256 = 256 KB
512 = 512 KB
1M0 = 1 MB
Values
T
PP
Temperature range (°C)
Package identifier
• V = –40 to 105
• C = –40 to 85
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
FM = 32 QFN (5 mm x 5 mm)
FT = 48 QFN (7 mm x 7 mm)
LF = 48 LQFP (7 mm x 7 mm)
EX = 64 QFN (9 mm x 9 mm)
LH = 64 LQFP (10 mm x 10 mm)
LK = 80 LQFP (12 mm x 12 mm)
MB = 81 MAPBGA (8 mm x 8 mm)
LL = 100 LQFP (14 mm x 14 mm)
MC = 121 MAPBGA (8 mm x 8 mm)
LQ = 144 LQFP (20 mm x 20 mm)
MD = 144 MAPBGA (13 mm x 13 mm)
MF = 196 MAPBGA (15 mm x 15 mm)
MJ = 256 MAPBGA (17 mm x 17 mm)
50 = 50 MHz
72 = 72 MHz
100 = 100 MHz
120 = 120 MHz
150 = 150 MHz
CCC
Maximum CPU frequency (MHz)
N
Packaging type
• R = Tape and reel
• (Blank) = Trays
2.4 Example
This is an example part number:
MK50N512VMD100
3 Terminology and guidelines
3.1 Definition: Operating requirement
An
operating requirement
is a specified value or range of values for a technical
characteristic that you must guarantee during operation to avoid incorrect operation and
possibly decreasing the useful life of the chip.
K50 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Freescale Semiconductor, Inc.
Preliminary
5
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