For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
3W Primary-Side Transformer H-Bridge Driver
for Isolated Supplies
MAX256
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND, unless otherwise noted.)
Supply Voltage V
CC
..................................................-0.3V to +6V
ST1, ST2, CK_RS, MODE (Note 1)................-0.3V to V
CC
+ 0.3V
ST1, ST2 Maximum Continuous Current (T
A
< +125°C) ....±0.6A
ST1, ST2 Maximum Continuous Current (T
A
< +100°C) ....±0.9A
ST1, ST2 Maximum Continuous Current (T
A
< +85°C) ......±1.0A
Continuous Power Dissipation (T
A
= +70°C)
8-Pin SO (derate 18.9mW/°C above +70°C)..............1509mW
Operating Temperature Range .........................-40°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Note 1:
ST1 and ST2 are not protected against short circuits. Damage to the device may result from a short-circuit fault.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
SO-EP
Junction-to-Ambient Thermal Resistance (θ
JA
)...............53°C/W
Junction-to-Case Thermal Resistance (θ
JC
)......................5°C/W
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
便携式数字数据采集系统(PDDAS)使用了LabVIEW实时模块和PXI,以控制风洞测试和采集记录来自128个不同通道的空气压力数据 "通过LabVIEW实时模块,可以在各种操作情况下获得采集空气压力数据及向风洞提供反馈控制信号所需的确定性响应时间。" – Dave Scheibenhoffer, G Systems 挑战: 用一个可采集、分析和存储来自下一代喷气式战斗机引擎设计的动...[详细]
从全球来看,智能电视在设备互联接口、内容服务接口、应用程序开发接口、系统安全可信技术等方面的标准尚未统一,厂商采用不同的操作系统和内容接口,各自的应用互不兼容,对产业整体发展造成障碍,在应用丰富度上也很欠缺。近日国内一些家电厂商主办智能电视开发论坛,力图吸引更多的开发者参与进来,从这一点来看,目前还是家电厂商较为主动地在推动智能电视标准化以及各类应用的开发。 TV OS成产业角逐焦点 ...[详细]