EEPROM, 256X16, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Fairchild |
| 零件包装代码 | SOIC |
| 包装说明 | PLASTIC, TSSOP-8 |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 其他特性 | DATA RETENTION=40 YEARS |
| 最大时钟频率 (fCLK) | 0.25 MHz |
| 数据保留时间-最小值 | 40 |
| 耐久性 | 1000000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e0 |
| 长度 | 4.4 mm |
| 内存密度 | 4096 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 256 words |
| 字数代码 | 256 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 组织 | 256X16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 串行总线类型 | MICROWIRE |
| 最大待机电流 | 0.000001 A |
| 最大压摆率 | 0.001 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| 最长写入周期时间 (tWC) | 15 ms |
| 写保护 | HARDWARE/SOFTWARE |
| NM93CS66LZVMT8 | NM93CS66LMT8 | NM93CS66VMT8 | NM93CS66LVM8 | NM93CS66LEMT8 | NM93CS66LZVM8 | |
|---|---|---|---|---|---|---|
| 描述 | EEPROM, 256X16, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 | EEPROM, 256X16, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 | EEPROM, 256X16, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 | EEPROM, 256X16, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SO-8 | EEPROM, 256X16, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 | EEPROM, 256X16, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SO-8 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | PLASTIC, TSSOP-8 | PLASTIC, TSSOP-8 | PLASTIC, TSSOP-8 | 0.150 INCH, PLASTIC, SO-8 | PLASTIC, TSSOP-8 | 0.150 INCH, PLASTIC, SO-8 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | DATA RETENTION=40 YEARS | DATA RETENTION=40 YEARS | DATA RETENTION=40 YEARS | DATA RETENTION=40 YEARS | DATA RETENTION=40 YEARS | DATA RETENTION=40 YEARS |
| 最大时钟频率 (fCLK) | 0.25 MHz | 0.25 MHz | 1 MHz | 0.25 MHz | 0.25 MHz | 0.25 MHz |
| 数据保留时间-最小值 | 40 | 40 | 40 | 40 | 40 | 40 |
| 耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 4.4 mm | 4.4 mm | 4.4 mm | 4.9 mm | 4.4 mm | 4.9 mm |
| 内存密度 | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
| 字数代码 | 256 | 256 | 256 | 256 | 256 | 256 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 70 °C | 125 °C | 125 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 256X16 | 256X16 | 256X16 | 256X16 | 256X16 | 256X16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | TSSOP | SOP | TSSOP | SOP |
| 封装等效代码 | TSSOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | SOP8,.25 | TSSOP8,.25 | SOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3/5 V | 3/5 V | 5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.75 mm | 1.2 mm | 1.75 mm |
| 串行总线类型 | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
| 最大待机电流 | 0.000001 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.000001 A |
| 最大压摆率 | 0.001 mA | 0.001 mA | 0.001 mA | 0.001 mA | 0.001 mA | 0.001 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 4.5 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 5 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | COMMERCIAL | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3 mm | 3 mm | 3 mm | 3.9 mm | 3 mm | 3.9 mm |
| 最长写入周期时间 (tWC) | 15 ms | 15 ms | 10 ms | 15 ms | 15 ms | 15 ms |
| 写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
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