Microcontroller, 8-Bit, MROM, 40MHz, CMOS, PQCC44, PLASTIC, LCC-44
| 参数名称 | 属性值 |
| 厂商名称 | Macronix |
| 零件包装代码 | LCC |
| 包装说明 | QCCJ, |
| 针数 | 44 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A991.A.2 |
| 具有ADC | NO |
| 地址总线宽度 | 16 |
| 位大小 | 8 |
| 最大时钟频率 | 40 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | S-PQCC-J44 |
| JESD-609代码 | e0 |
| 长度 | 16.5862 mm |
| I/O 线路数量 | 32 |
| 端子数量 | 44 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| PWM 通道 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 认证状态 | Not Qualified |
| ROM可编程性 | MROM |
| 座面最大高度 | 4.7 mm |
| 速度 | 40 MHz |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 2.7 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 16.5862 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| MX10L8050QC | MX10L8050PC | MX10L8050PI | MX10L8050QI | MX10L8050FC | |
|---|---|---|---|---|---|
| 描述 | Microcontroller, 8-Bit, MROM, 40MHz, CMOS, PQCC44, PLASTIC, LCC-44 | Microcontroller, 8-Bit, MROM, 40MHz, CMOS, PDIP40, PLASTIC, DIP-40 | Microcontroller, 8-Bit, MROM, 40MHz, CMOS, PDIP40, PLASTIC, DIP-40 | Microcontroller, 8-Bit, MROM, 40MHz, CMOS, PQCC44, PLASTIC, LCC-44 | Microcontroller, 8-Bit, MROM, 40MHz, CMOS, PQFP44, PLASTIC, QFP-44 |
| 厂商名称 | Macronix | Macronix | Macronix | Macronix | Macronix |
| 零件包装代码 | LCC | DIP | DIP | LCC | QFP |
| 包装说明 | QCCJ, | DIP, | DIP, | QCCJ, | QFP, |
| 针数 | 44 | 40 | 40 | 44 | 44 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
| 具有ADC | NO | NO | NO | NO | NO |
| 地址总线宽度 | 16 | 16 | 16 | 16 | 16 |
| 位大小 | 8 | 8 | 8 | 8 | 8 |
| 最大时钟频率 | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| DAC 通道 | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | S-PQCC-J44 | R-PDIP-T40 | R-PDIP-T40 | S-PQCC-J44 | S-PQFP-G44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| I/O 线路数量 | 32 | 32 | 32 | 32 | 32 |
| 端子数量 | 44 | 40 | 40 | 44 | 44 |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C |
| PWM 通道 | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | DIP | DIP | QCCJ | QFP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM |
| 速度 | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | GULL WING |
| 端子位置 | QUAD | DUAL | DUAL | QUAD | QUAD |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
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