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89H48T12G2ZCBLI

产品描述FCBGA-676, Tray
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小513KB,共44页
制造商IDT (Integrated Device Technology)
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89H48T12G2ZCBLI概述

FCBGA-676, Tray

89H48T12G2ZCBLI规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码FCBGA
包装说明FCBGA-676
针数676
制造商包装代码BL676
Reach Compliance Codenot_compliant
ECCN代码EAR99
地址总线宽度
总线兼容性I2C; ISA; PCI; SMBUS; VGA
最大时钟频率125 MHz
最大数据传输速率48000 MBps
外部数据总线宽度
JESD-30 代码S-PBGA-B676
JESD-609代码e0
长度27 mm
湿度敏感等级4
端子数量676
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA676,26X26,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)225
电源1,2.5/3.3 V
认证状态Not Qualified
座面最大高度3.22 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度27 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI

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48-Lane 12-Port PCIe® Gen2
System Interconnect Switch
®
89HPES48T12G2
Data Sheet
Device Overview
The 89HPES48T12G2 is a member of the IDT PRECISE™ family of
PCI Express® switching solutions. The PES48T12G2 is a 48-lane, 12-
port system interconnect switch optimized for PCI Express Gen2 packet
switching in high-performance applications, supporting multiple simulta-
neous peer-to-peer traffic flows. Target applications include servers,
storage, communications, embedded systems, and multi-host or intelli-
gent I/O based systems with inter-domain communication.
• De-emphasis
• Receive equalization
• Drive strength
Initialization / Configuration
Features
High Performance Non-Blocking Switch Architecture
48-lane 12-port PCIe switch
• Six x8 ports switch ports each of which can bifurcate to two
x4 ports (total of twelve x4 ports)
Integrated SerDes supports 5.0 GT/s Gen2 and 2.5 GT/s
Gen1 operation
Delivers up to
48 GBps (384 Gbps)
of switching capacity
Supports 128 Bytes to 2 KB maximum payload size
Low latency cut-through architecture
Supports one virtual channel and eight traffic classes
Standards and Compatibility
PCI Express Base Specification 2.0 compliant
Implements the following optional PCI Express features
• Advanced Error Reporting (AER) on all ports
• End-to-End CRC (ECRC)
• Access Control Services (ACS)
• Power Budgeting Enhanced Capability
• Device Serial Number Enhanced Capability
• Sub-System ID and Sub-System Vendor ID Capability
• Internal Error Reporting ECN
• Multicast ECN
• VGA and ISA enable
• L0s and L1 ASPM
• ARI ECN
Port Configurability
x4 and x8 ports
• Ability to merge adjacent x4 ports to create a x8 port
Automatic per port link width negotiation
(x8
x4
x2
x1)
Crosslink support
Automatic lane reversal
Autonomous and software managed link width and speed
control
Per lane SerDes configuration
Supports Root (BIOS, OS, or driver), Serial EEPROM, or
SMBus switch initialization
Common switch configurations are supported with pin strap-
ping (no external components)
Supports in-system Serial EEPROM initialization/program-
ming
Quality of Service (QoS)
Port arbitration
• Round robin
• Weighted Round Robin (WRR)
Request metering
• IDT proprietary feature that balances bandwidth among
switch ports for maximum system throughput
High performance switch core architecture
• Combined Input Output Queued (CIOQ) switch architecture
with large buffers
Multicast
Compliant to the PCI-SIG multicast ECN
Supports arbitrary multicasting of Posted transactions
Supports 64 multicast groups
Multicast overlay mechanism support
ECRC regeneration support
Clocking
Supports 100 MHz and 125 MHz reference clock frequencies
Flexible clocking modes
• Common clock
• Non-common clock
Hot-Plug and Hot Swap
Hot-plug controller on all ports
• Hot-plug supported on all downstream switch ports
All ports support hot-plug using low-cost external I
2
C I/O
expanders
Configurable presence detect supports card and cable appli-
cations
GPE output pin for hot-plug event notification
• Enables SCI/SMI generation for legacy operating system
support
Hot swap capable I/O
Power Management
Supports D0, D3hot and D3 power management states
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 43
November 28, 2011

89H48T12G2ZCBLI相似产品对比

89H48T12G2ZCBLI 89H48T12G2ZCBLG 89H48T12G2ZCBLGI8 89H48T12G2ZCBL
描述 FCBGA-676, Tray FCBGA-676, Tray FCBGA-676, Reel FCBGA-676, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 含铅 不含铅 不含铅 含铅
是否Rohs认证 不符合 符合 符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 FCBGA FCBGA FCBGA FCBGA
包装说明 FCBGA-676 BGA, BGA676,26X26,40 BGA, BGA676,26X26,40 FCBGA-676
针数 676 676 676 676
制造商包装代码 BL676 BLG676 BLG676 BL676
Reach Compliance Code not_compliant compliant compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99
总线兼容性 I2C; ISA; PCI; SMBUS; VGA I2C; ISA; PCI; SMBUS; VGA I2C; ISA; PCI; SMBUS; VGA I2C; ISA; PCI; SMBUS; VGA
最大时钟频率 125 MHz 125 MHz 125 MHz 125 MHz
最大数据传输速率 48000 MBps 48000 MBps 48000 MBps 48000 MBps
JESD-30 代码 S-PBGA-B676 S-PBGA-B676 S-PBGA-B676 S-PBGA-B676
JESD-609代码 e0 e1 e1 e0
长度 27 mm 27 mm 27 mm 27 mm
湿度敏感等级 4 4 4 4
端子数量 676 676 676 676
最高工作温度 85 °C 70 °C 85 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA
封装等效代码 BGA676,26X26,40 BGA676,26X26,40 BGA676,26X26,40 BGA676,26X26,40
封装形状 SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 225 245 245 225
电源 1,2.5/3.3 V 1,2.5/3.3 V 1,2.5/3.3 V 1,2.5/3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 3.22 mm 3.22 mm 3.22 mm 3.22 mm
最大供电电压 1.1 V 1.1 V 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V 0.9 V 0.9 V
标称供电电压 1 V 1 V 1 V 1 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb)
端子形式 BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 27 mm 27 mm 27 mm 27 mm
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