Freescale Semiconductor
Data Sheet: Advance Information
Document Number: K30P144M100SF2V2
Rev. 1, 6/2012
Supports the following:
MK30DX128VLQ10,
MK30DX128VMD10,
MK30DX256VLQ10,
MK30DX256VMD10,
MK30DN512VLQ10,
MK30DN512VMD10
Features
• Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
• Performance
– Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
• Memories and memory interfaces
– Up to 512 KB program flash memory on non-
FlexMemory devices
– Up to 256 KB program flash memory on
FlexMemory devices
– Up to 256 KB FlexNVM on FlexMemory devices
– 4 KB FlexRAM on FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
• Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
• System peripherals
– Multiple low-power modes to provide power
optimization based on application requirements
– Memory protection unit with multi-master
protection
– 16-channel DMA controller, supporting up to 63
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
• Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
• Human-machine interface
– Segment LCD controller supporting up to 40
frontplanes and 8 backplanes, or 44 frontplanes and
4 backplanes, depending on the package size
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
• Analog modules
– Two 16-bit SAR ADCs
– Programmable gain amplifier (PGA) (up to x64)
integrated into each ADC
– Two 12-bit DACs
– Two transimpedance amplifiers
– Three analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
– Voltage reference
• Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timer
– Two 2-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
K30 Sub-Family
K30P144M100SF2V2
This document contains information on a new product. Specifications and
information herein are subject to change without notice.
© 2012 Freescale Semiconductor, Inc.
Preliminary
General Business Information
• Communication interfaces
– Two Controller Area Network (CAN) modules
– Three SPI modules
– Two I2C modules
– Six UART modules
– Secure Digital host controller (SDHC)
– I2S module
K30 Sub-Family Data Sheet, Rev. 1, 6/2012.
2
Preliminary
General Business Information
Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts...........................................................................4
1.1 Determining valid orderable parts......................................4
2 Part identification......................................................................4
2.1 Description.........................................................................4
2.2 Format...............................................................................4
2.3 Fields.................................................................................4
2.4 Example............................................................................5
3 Terminology and guidelines......................................................5
3.1 Definition: Operating requirement......................................5
3.2 Definition: Operating behavior...........................................6
3.3 Definition: Attribute............................................................6
3.4 Definition: Rating...............................................................7
3.5 Result of exceeding a rating..............................................7
3.6 Relationship between ratings and operating
requirements......................................................................7
3.7 Guidelines for ratings and operating requirements............8
3.8 Definition: Typical value.....................................................8
3.9 Typical value conditions....................................................9
4 Ratings......................................................................................10
4.1 Thermal handling ratings...................................................10
4.2 Moisture handling ratings..................................................10
4.3 ESD handling ratings.........................................................10
4.4 Voltage and current operating ratings...............................10
5 General.....................................................................................11
5.1 AC electrical characteristics..............................................11
5.2 Nonswitching electrical specifications...............................11
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.2.6
5.2.7
5.2.8
Voltage and current operating requirements.........11
LVD and POR operating requirements.................12
Voltage and current operating behaviors..............13
Power mode transition operating behaviors..........14
Power consumption operating behaviors..............15
EMC radiated emissions operating behaviors.......18
Designing with radiated emissions in mind...........19
Capacitance attributes..........................................19
6.8.3
6.8.4
6.8.5
6.8.6
6.8.7
5.4.2
Thermal attributes.................................................21
6 Peripheral operating requirements and behaviors....................22
6.1 Core modules....................................................................22
6.1.1
6.1.2
Debug trace timing specifications.........................22
JTAG electricals....................................................23
6.2 System modules................................................................26
6.3 Clock modules...................................................................26
6.3.1
6.3.2
6.3.3
MCG specifications...............................................26
Oscillator electrical specifications.........................28
32 kHz Oscillator Electrical Characteristics...........31
6.4 Memories and memory interfaces.....................................31
6.4.1
6.4.2
6.4.3
Flash electrical specifications................................31
EzPort Switching Specifications............................36
Flexbus Switching Specifications..........................37
6.5 Security and integrity modules..........................................40
6.6 Analog...............................................................................40
6.6.1
6.6.2
6.6.3
6.6.4
ADC electrical specifications.................................40
CMP and 6-bit DAC electrical specifications.........48
12-bit DAC electrical characteristics.....................51
Voltage reference electrical specifications............54
6.7 Timers................................................................................55
6.8 Communication interfaces.................................................55
6.8.1
6.8.2
CAN switching specifications................................55
DSPI switching specifications (limited voltage
range)....................................................................56
DSPI switching specifications (full voltage range).57
I2C switching specifications..................................59
UART switching specifications..............................59
SDHC specifications.............................................59
I2S/SAI Switching Specifications..........................60
6.9 Human-machine interfaces (HMI)......................................66
6.9.1
6.9.2
TSI electrical specifications...................................66
LCD electrical characteristics................................67
7 Dimensions...............................................................................68
7.1 Obtaining package dimensions.........................................69
8 Pinout........................................................................................69
8.1 K30 Signal Multiplexing and Pin Assignments..................69
8.2 K30 Pinouts.......................................................................75
5.3 Switching specifications.....................................................19
5.3.1
5.3.2
Device clock specifications...................................19
General switching specifications...........................20
5.4 Thermal specifications.......................................................21
5.4.1
Thermal operating requirements...........................21
K30 Sub-Family Data Sheet, Rev. 1, 6/2012.
Freescale Semiconductor, Inc.
Preliminary
General Business Information
3
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to
http://www.freescale.com
and perform a part number
search for the following device numbers: PK30 and MK30 .
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## A M FFF R T PP CC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
K##
A
M
Qualification status
Kinetis family
Key attribute
Flash memory type
Description
Values
• M = Fully qualified, general market flow
• P = Prequalification
• K30
• D = Cortex-M4 w/ DSP
• F = Cortex-M4 w/ DSP and FPU
• N = Program flash only
• X = Program flash and FlexMemory
Table continues on the next page...
K30 Sub-Family Data Sheet, Rev. 1, 6/2012.
4
Preliminary
General Business Information
Freescale Semiconductor, Inc.
Terminology and guidelines
Field
FFF
Description
Program flash memory size
•
•
•
•
•
•
32 = 32 KB
64 = 64 KB
128 = 128 KB
256 = 256 KB
512 = 512 KB
1M0 = 1 MB
Values
R
Silicon revision
• Z = Initial
• (Blank) = Main
• A = Revision after main
• V = –40 to 105
• C = –40 to 85
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
FM = 32 QFN (5 mm x 5 mm)
FT = 48 QFN (7 mm x 7 mm)
LF = 48 LQFP (7 mm x 7 mm)
LH = 64 LQFP (10 mm x 10 mm)
MP = 64 MAPBGA (5 mm x 5 mm)
LK = 80 LQFP (12 mm x 12 mm)
MB = 81 MAPBGA (8 mm x 8 mm)
LL = 100 LQFP (14 mm x 14 mm)
ML = 104 MAPBGA (8 mm x 8 mm)
MC = 121 MAPBGA (8 mm x 8 mm)
LQ = 144 LQFP (20 mm x 20 mm)
MD = 144 MAPBGA (13 mm x 13 mm)
MJ = 256 MAPBGA (17 mm x 17 mm)
5 = 50 MHz
7 = 72 MHz
10 = 100 MHz
12 = 120 MHz
15 = 150 MHz
T
PP
Temperature range (°C)
Package identifier
CC
Maximum CPU frequency (MHz)
N
Packaging type
• R = Tape and reel
• (Blank) = Trays
2.4 Example
This is an example part number:
MK30DN512ZVMD10
3 Terminology and guidelines
3.1 Definition: Operating requirement
An
operating requirement
is a specified value or range of values for a technical
characteristic that you must guarantee during operation to avoid incorrect operation and
possibly decreasing the useful life of the chip.
K30 Sub-Family Data Sheet, Rev. 1, 6/2012.
Freescale Semiconductor, Inc.
Preliminary
General Business Information
5
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