Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
MAX16904
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (θ
JA
) ...........41°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ..................9°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (θ
JA
) ........38.3°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ..................3°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V
SUP
= +14V, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C, unless otherwise noted.)
PARAMETER
Supply Voltage Range
SYMBOL
V
SUP
(Note 2)
t < 1s
EN = low
Supply Current
I
SUP
V
UVLO
V
UVLO,HYS
V
BIAS
I
BIAS
V
OUT
= 5V, fixed frequency
V
OUT,5V
Voltage Accuracy
V
OUT,3.3V
V
OUT
= 5V, SKIP mode
(Note 3)
V
OUT
= 3.3V, fixed frequency
V
OUT
= 3.3V, SKIP mode
(Note 3)
6V V
SUP
18V,
I
LOAD
= 0 to 600mA,
T
A
= -40°C to
+125°C
EN = high, no load
EN = high, continuous, no switching
UV Lockout
Bias Voltage
Bias Current Limit
BUCK CONVERTER
-2.0%
-2.0%
-2.0%
-2.0%
5
5
3.3
3.3
+2.5%
+4%
+2.5%
+4%
V
Bias rising
Hysteresis
+5.5V
V
SUP
+42V
10
2.8
4
25
1
3
0.4
5
3.2
CONDITIONS
MIN
3.5
TYP
MAX
28
42
8
35
UNITS
V
µA
mA
V
V
mA
3
2.1MHz, High-Voltage,
600mA Mini-Buck Converter
MAX16904
ELECTRICAL CHARACTERISTICS (continued)
(V
SUP
= +14V, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C, unless otherwise noted.)
PARAMETER
SKIP-Mode Peak Current
High-Side DMOS RDS
ON
Low-Side DMOS RDS
ON
DMOS Peak Current-Limit
Threshold
Soft-Start Ramp Time
LX Rise Time
Minimum On-Time
PWM Switching Frequency
SYNC Input Frequency Range
Spread-Spectrum Range
PGOOD
PGOOD Threshold
PGOOD Debounce
PGOOD High Leakage Current
PGOOD Output Low Level
LOGIC LEVELS
EN Level
EN Input Current
SYNC Switching Threshold
SYNC Internal Pulldown
THERMAL PROTECTION
Thermal Shutdown
Thermal Shutdown Hysteresis
T
SHDN
T
SHDN,HYS
175
15
°C
°C
V
IH,EN
V
IL,EN
I
IN,EN
V
IH,SYNC
V
IL,SYNC
R
PD,SYNC
200
V
EN
= V
SUP
= +42V, T
A
= +25°C
1.4
0.4
2.4
0.6
1
V
µA
V
k
V
THR,PGD
V
THF,PGD
t
DEB
I
LEAK,PGD
V
OUT,PGD
T
A
= +25°C
Sinking 1mA
V
OUT
rising
V
OUT
falling
88
93
91
10
1
0.4
94
%
µs
µA
V
SYMBOL
I
SKIP
R
ON,HS
R
ON,LS
I
MAX
t
SS
t
RISE,LX
t
ON
f
SW
f
SYNC
SS
Spread-spectrum option only
Internally generated
1.925
1.8
+6
0.85
7
V
BIAS
= 5V
CONDITIONS
MIN
TYP
350
400
250
1.05
8
5
80
2.1
2.275
2.6
800
450
1.22
9
MAX
UNITS
mA
m
m
A
ms
ns
ns
MHz
MHz
%
Note 2:
When the typical minimum on-time of 80ns is violated, the device skips pulses.
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