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1 SCOPE
This specification shall cover the characteristics of the ceramic
fliter with the type LTCV10.7MS3. The LTCV10.7MS3 filters are small,
high performance and very thin (1.5mm) chip devices consisting of 2
ceramic elements for communication equipment. They are designed on
MgTiO3 ceramic cap package.
2 PART NO.
PART NUMBER
CUSTOMER PART NO.
SPECIFICATION NO.
LTCV10.7MS3
3 OUTLINE DRAWING AND STRUCTURE
3.1 Appearance
No visible damage and dirt.
3.2 Dimensions
7.
1
3
3
3. ±0.3
S3
①
②
③
range of frequency
2
3
2
3
2
3
①:Input
②:Ground
③:output
Unit:mm
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3.3 STRUCTURE
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O u tp u t/In p u t
E le c t ro d e
C e rm ic
C over
O s c il la tio n
E le c tro d e
g lu e
C e r m ic
S u b s tra te
4 ELECTRICAL SPECIFICATIONS
4.1 RATING
Items
Withstanding Voltage (V)
Insulation Resistance Ri,（MΩ）min.
Operating Temperature Range (℃)
Storage Temperature Range (℃)
Content
50 (DC，1min)
100
（100V，1min）
-25½+85
-40½+85
4.2 ELECTRICAL SPECIFICATIONS
Items
Center Frequency(fo)(MHz)
The center point of 3dB band width is defined as
the center frequency and identified by the
letters:A,B,C,D or E.
Content
A:10.700±0.030
C:10.730±0.030
E:10.760±0.030
B:10.670±0.030
D:10.640±0.030
3dB Bandwidth(kHz)
20dB Bandwidth(kHz) max
Insertion Loss (dB)
Ripple (dB) max
Spurious Response (dB) min
Input/Output Impedance(Ω)
180±40
470
4.0±2.0 (at minimum loss point)
1.0
35
330
(within 3dB Bandwidth)
(9MHz-12MHz)
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5 TEST
5.1 Test Conditions
Parts shall be tested under a condition (Temperature:+20℃±15℃，
Humidity:65%±20%R.H.)unless
the
standard
condition(Temperature:+25℃±3℃,Humidity:65%±5% R.H.) is regulated
to test.
5.2 Test Circuit:
1
Rg
3
2
R2
R1=280Ω±5%,R2=330Ω±5%,Rg=50Ω
C2=10 Pf (Including stray capacitance
and capacitance of RF Voltmeter)
S.S.G:Output Voltmeter
C2
RF
Voltmeter
S.S.G.
①:Input
②:Ground
③:Output
6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS
NO.
6.1
6.2
6.3
6.4
Item
Low Temp
Storage
High Temp
Storage
Humidity
Thermal
Shock
Soldering
Test
Condition of Test
Stored in -40℃±3℃ for 96h，and left at room
temp. for 1h before measurement.
Stored in 85℃±2℃ for 96h，and left at room
temp. for 1h before measurement.
Stored at 40℃±2℃，in 90%½95%R.H. for 96h,
and left at room temp. for 1h before measurement
After temp. cycling of -40℃(30 minutes) to +85℃
(30min) was performed 5 times, filter shall be
measured after being placed in natural condition
for 1h.
Passed through the reflow oven under the
following condition for 2 times, and left at room
temp. for 24h before measurement.
Dipped in 235℃±5℃ solder bath for 3s±0.5s
with rosin flux.
Temp. at the surface of
Time
the substrate
Preheat 150℃±5℃
60s±10s
Peak
235℃±5℃
10s±3s
Performance
Requirment
Meet Table 1
Meet Table 1
Meet Table 1
Meet Table 1
6.5
Meet Table 1
The terminals
shall be at
least 95%
covered by
solder
6.6
Solderability
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6.7
6.8
Drop test
Vibration
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Free drop to the wood plate from the height of 70
Meet Table 1
cm for 3 times.
Apply the vibration of sweep frequency 10 to
55Hz/minutes, amplitude 1.5mm, duration 2h in Meet Table 1
each direction of 3 planes.
Mount on a glass-epoxy board( width=50 mm,
thickness=1.6mm),then
bend
it
to
1mm
displacement(velocity 1mm/sec) and keep it for 5s.
Press
6.9
Board
Bending
Support bar
5
20
Press Head
D.U.T
1.0± 0.2
R10
Mechanical
damage such
as break shall
not occur
45± 2
45± 2
TABLE 1
SPECIFICATION AFTER TEST ABOUT CHARACTERISTICS
Item
Insertion Loss Drift (dB) max
3dB Bandwidth Drift (kHz) max
20dB Bandwidth Drift (kHz) max
Specification after test
±2
±25
±60
Note
：
The limits in the above table are referenced to the initial measurements.
7
RECOMMENDED LAND PATTERN AND REFLOW SOLDERING
STANDARD CONDITIONS
7.1Recommended land pattern
2.9± 0.3
2.9± 0.3
1.5± 0.3
1.5± 0.3
1.5± 0.3
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4.0± 0.3
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7.2Recommended reflow soldering standard conditions
within 10 sec
Temperature(
℃
)
220~230℃
200
150
100
Pre-heating
within
80-120sec.
within
20-40sec
8 PACKAGE
To protect the products in storage and transportation
，it
is
necessary to pack them（outer and inner package）.On paper pack, the
following requirements are requested.
Dimensions and Mark
At the end of package, the warning (moisture proof, upward put)
should be stick to it.
Dimensions and Mark (see below)
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