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1 SCOPE
This specification shall cover the characteristics of the ceramic
fliter with the type LTCV10.7MJ. The LTCV10.7MJ filters are small,
high performance and very thin (1.5mm) chip devices consisting of 2
ceramic elements for communication equipment. They are designed on
MgTiO3 ceramic cap package.
2 PART NO.
PART NUMBER
CUSTOMER PART NO.
SPECIFICATION NO.
LTCV10.7MJ
3 OUTLINE DRAWING
3.1 Appearance
No visible damage and dirt.
3.2 Dimensions
7.0± 0.3
4.1± 0.4
1.2± 0.3
1.2± 0.3
1.2± 0.3
1.5± 0.2
3.0± 0.3
MJ
①
②
③
range of frequency
①
:Input
②
:Ground
③
:output
1.2± 0.3
1.2± 0.3
1.2± 0.3 Unit:mm
1.5± 0.2
DRAWING 1
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3.3
STRUCTURE
Email: lge@luguang.cn
Output/Input
Electrode
Cermic
Cover
Oscillation
Electrode
glue
Cermic
Substrate
4 ELECTRICAL SPECIFICATIONS
TABLE 1
Items
Requirements
Center Frequency(fo)(MHz)
A:10.700±0.030
B:10.670±0.030
The center point of 3dB band width is C:10.730±0.030
D:10.640±0.030
defined as the center frequency and E:10.760±0.030
identified by the letters:A,B,C,D or E.
3dB Bandwidth(kHz)
20dB Bandwidth(kHz) max
Insertion Loss (dB) max
Ripple (dB) max
Spurious Response (dB) min
Input/Output Impedance(Ω)
Withstanding Voltage
Insulation Resistance (MΩ) min
Operating temperature range(℃)
Storage temperature range(℃)
1.0
150±40
380
5.5
±2.0
(within 3dB Bandwidth)
35
(9MHz-12MHz)
330
50V DC
100
1 min
(DC 10V)
-25½+85
-40½+85
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5 TEST
5.1 Test Conditions
Parts shall be tested under a condition (Temperature:+20℃±15℃，
Humidity:65%±20%R.H.)unless
the
standard
condition
(Temperature:+25℃±3℃, Humidity:65%±5% R.H.) is regulated to test.
5.2 Test Circuit:
1
Rg
3
2
R2
S.S.G.
C2
RF
Voltmeter
DRAWING 2
R1=280Ω(1±5%),R2=330Ω(1±5%),Rg=50Ω
C2=10 PF (Including stray capacitance
and capacitance of RF Voltmeter)
S.S.G:Output Voltmeter
①:Input
②:Ground
③:Output
6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS
TABLE 2
No
2.1
Item
Humidity
High
Temperature
Exposure
Low
Temperature
Exposure
Temperature
Cycling
Soldering
Test
Performance
Requirements
Stored at 40℃±2℃，in 90%½95%R.H. for It shall fulfill the
96h, and left at room temp. for 1h before specifications in
measurement.。
Table 3.
It shall fulfill the
Stored in 85℃±2℃ for 96h，and left at
specifications in
room temp. for 1h before measurement.
Table 3.
It shall fulfill the
Stored in -40℃±3℃ for 96h，and left at
specifications in
room temp. for 1h before measurement.
Table 3.
After temp. cycling of -40℃(30 min) to
+85℃(30 min) was performed 5 times, filter
shall be measured after being placed in
natural condition for 1h .
Passed through the reflow oven under the
following condition for 2 times, and left at
room temp. for 24h before measurement.
Condition of Test
2.2
2.3
2.4
2.5
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The
terminals
shall be at least
95% covered by
solder
the
in
the
in
2.6
Solderability
Dipped in 235℃±5℃ solder bath for 3s±
0.5s with rosin flux.
Temperature at the surface of
Time
the substrate
Preheat 150℃±5℃
60s±10s
Peak
235℃±5℃
10s±3s
2.7
Drop test
2.8
Vibration
It shall fulfill
Free drop to the wood plate from the height of
specifications
70 cm for 3 times.
Table 3.
Apply the vibration of sweep frequency 10 to It shall fulfill
55Hz/minutes, amplitude 1.5mm, duration 2h specifications
in each direction of 3 planes.
Table 3.
Mount a glass-epoxy board (Width=40mm,
thickness=1.6mm),then bend it to 1mm
displacement and keep it for 5s. (See the
following figure)
PRESS
2.9
Board
Bending
PRESS HEAD
Mechanical
damage such as
breaks shall not
occur.
SUPPORT BAR
TABLE 3
SPECIFICATION AFTER TEST ABOUT CHARACTERISTICS
No.
3.1
Item
Insertion Loss Drift (dB) max
3dB Bandwidth Drift (kHz) max
20dB Bandwidth Drift (kHz) max
Specification after test
±2
±25
±60
3.2
Note
：
The limits in the above table are referenced to the initial measurements.
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7 RECOMMENDED LAND PATTERN AND REFLOW SOLDERING
STANDARD CONDITIONS
7.1 Recommended land pattern
2.9± 0.3
2.9± 0.3
1.5± 0.3
1.5± 0.3
1.5± 0.3
DRAWING 4
7.2 Recommended reflow soldering standard conditions
℃
w ithin 10s
℃
Pre-heating
within
80s-120s.
within
20s-40s
DRAWING 5
8 PACKAGE
To protect the products in storage and transportation，it is necessary to
pack them（outer and inner package）.On paper pack, the following
requirements are requested.
8.1 Dimensions and Mark
At the end of package, the warning (moisture proof, upward put) should
be stick to it.
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4.0±0.3
嵌入式系统
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