Decoder/Driver
| 参数名称 | 属性值 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 包装说明 | DIP, |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 系列 | FCT |
| 输入调节 | STANDARD |
| JESD-30 代码 | R-PDIP-T16 |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 6 ns |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| 54FCT138CP | 54FCT138LB | 54FCT138CSO | 54FCT138AP | 54FCT138ASO | 54FCT138P | 74FCT138ASO | 54FCT138ADB | 54FCT138PB | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Decoder/Driver | LCC-20, Tube | Decoder/Driver | Decoder/Driver | Decoder/Driver | Decoder/Driver | SOIC-16, Tube | CDIP-16, Tube | Decoder/Driver |
| 包装说明 | DIP, | LCC-20 | SOP, | DIP, | SOP, | DIP, | SOP, SOP16,.4 | DIP, DIP16,.3 | DIP, |
| Reach Compliance Code | compliant | not_compliant | compliant | compliant | compliant | compliant | not_compliant | not_compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 系列 | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT |
| 输入调节 | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD |
| JESD-30 代码 | R-PDIP-T16 | S-XQCC-N20 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-CDIP-T16 | R-PDIP-T16 |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 20 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| 封装代码 | DIP | QCCN | SOP | DIP | SOP | DIP | SOP | DIP | DIP |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| 传播延迟（tpd） | 6 ns | 12 ns | 6 ns | 7.8 ns | 7.8 ns | 12 ns | 5.8 ns | 7.8 ns | 12 ns |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | YES | NO | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | NO LEAD | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | - |
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