Product
Specification
108-1163
12Jan10 Rev E
Modular Plugs, Thru-Hole and Surface Mount Jacks, Data
and Telephone, PCB Mounted
1.
1.1.
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1.2.
SCOPE
Content
This specification covers the performance, tests and quality requirements for the Tyco Electronics
Modular Telephone Plugs and Jacks designed for Printed Circuit Board (PCB) mounting.
Qualification
When tests are performed on the subject product line, procedures specified in Figure 1 shall be used.
All inspections shall be performed using the applicable inspection plan and product drawing.
1.3.
Qualification Test Results
Successful qualification testing on the subject product line was completed on 19May89. The
Qualification Test Report number for this testing is 501-91. This documentation is on file at and
available from Engineering Practices and Standards (EPS).
2.
APPLICABLE DOCUMENTS
The following documents form a part of this specification to the extent specified herein. Unless
otherwise specified, the latest edition of the document applies. In the event of conflict between the
requirements of this specification and the product drawing, the product drawing shall take precedence.
In the event of conflict between the requirements of this specification and the referenced documents,
this specification shall take precedence.
2.1.
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2.3.
2.2.
Tyco Electronics Specifications
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109 Series: Test Specifications as indicated in Figure 1
114-2048: Application Specification (Modular Jacks)
114-6016: Application Specification (Modular Plug Connectors (Standard and Small Conductor))
114-6040: Application Specification (Modular Jack Surface Mount Printed Circuit (PC) Board
Assemblies)
114-6053: Application Specification (High Performance Modular Plug Connectors)
501-91: Qualification Test Report (Modular Plugs, Thru-Hole and Surface Mount Jacks, Data and
Telephone, PCB Mounted)
Industry Document
EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications
Reference Documents
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108-1163-2: Product Specification (High Performance Modular Plugs & Jacks, PCB Mounted)
109-197: Test Specification (AMP Test Specifications vs EIA and IEC Test Methods)
EIA/TIA 568-A: Commercial Building Telecommunications Cabling Standard
FCC Rules for Registration of Telephone Equipment Part 68, Subpart F, Connectors
REA Bulletin 345-81, PE-76: Specification for Modular Telephone Set Hardware
©2010 Tyco Electronics Corporation
Harrisburg, PA
All International Rights Reserved.
* Trademark
| Indicates change
For latest revision, visit our website at www.tycoelectronics.com\documents.
For Regional Customer Service, visit our website at www.tycoelectronics.com
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LOC B
108-1163
3.
3.1.
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3.2.
REQUIREMENTS
Design and Construction
Product shall be of the design, construction and physical dimensions specified on the applicable
Product Drawing.
Materials
Materials used in the construction of this product shall be as specified on the applicable product
drawing.
3.3.
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Ratings
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Current, per pin: 1.5 amperes alternating current maximum at 25°C derated to 0.2 amperes
maximum at 70°C ambient
Derating Curve:
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Voltage: 150 volts AC maximum
Temperature: -40 to 70°C
Shielding Effectiveness: 20 dB minimum reduction from 30 to 400 MHZ
Rev E
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108-1163
3.4.
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3.5.
Performance and Test Description
Product shall be designed to meet the electrical, mechanical and environmental performance
requirements specified in Figure 1.
Test Requirements and Procedures Summary
Test Description
Examination of product.
Requirement
Procedure
Meets requirements of product
EIA-364-18.
drawing and Application
Visual, dimensional and functional
Specifications 114-6016, 114-2048. per applicable inspection plan.
114-6040, and 114-6053.
ELECTRICAL
ΔR
of 30 milliohms.
EIA-364-23.
Subject mated plug and jack to 50
millivolts open circuit at 100
milliamperes maximum.
See Figure 3.
EIA-364-6.
Measure potential drop of mated
plug and jack while carrying 1.5
amperes current.
See Figure 3.
EIA-364-21.
Test between adjacent contacts of
mated plug and jack.
EIA-364-20, Condition I.
1000 volts AC (rms) 60 Hz.
Test between adjacent contacts of
mated plug and jack.
Termination resistance, dry circuit.
Termination resistance, rated
current.
ΔR
of 30 milliohms.
Insulation resistance.
500 megohms minimum.
Dielectric withstanding voltage.
One minute hold.
Temperature rise vs current.
30°C maximum temperature rise at EIA-364-70, Method 1.
1.5 amperes.
Subject mated plug and jack to
temperature rise at rated current.
No evidence of physical damage.
AMP Spec 109-51, Condition B,
Method 2.
Subject mated plug and jack to 500
cycles at 125% of rated current for
15 minutes ON and 15 minutes
OFF.
AMP Spec 109-90.
Measure radiated response from
unshielded mated jack and plug
terminated with unshielded cable
while conductors are excited
between 30 and 400 MHZ. Repeat
procedure using shielded jack
mated with shielded plug terminated
with aluminum/MYLAR shielded
cable. The difference in response is
shielding effectiveness in dB.
Current cycling.
Shielding effectiveness, thru-hole
jacks only.
Frequency: 30 to 400 MHZ.
Reduction: 20 dB minimum.
Figure 1 (continued)
Rev E
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108-1163
Test Description
Surge.
Requirement
No evidence of physical damage.
Procedure
Subject mated plug and jack
adjacent contacts to 5 surges of
each polarity at 1 minute intervals.
Pulse to have 10/1000 microsecond
shape and 1000 volt peak.
EIA-364-28, Test Condition I.
Subject mated plug and jack
mounted on PCB to sinusoidal
vibration for 15 minutes in each of 3
mutually perpendicular axis.
EIA-364-9.
Subject plug and jack to 750 mating
and unmating cycles at the rate of
500 cycles per hour with latch
inoperative.
EIA-364-13.
Measure force required to mate
plug and jack. Measure force
required to unmate plug and jack
with latch depressed.
EIA-364-98.
Apply axial load of 20 pounds to
plug housing at a rate of 0.5 inch
per minute with plug mated in jack
and latch engaged.
Load cable in mated plug with a 17
pound pull in axial direction, rotate
plug housing 45 degrees from cable
axis, remove load.
See Figure 4.
Apply perpendicular load at a rate of
2 inches per minute to the jack
mounted on a 0.062 inch thick PCB.
See Figure 4.
MECHANICAL
Vibration.
No discontinuities greater than 1
microsecond.
Shall remain mated and show no
evidence of physical damage.
No evidence of physical damage.
Durability.
Mating and unmating forces.
Five pounds maximum for
unshielded plug and jack.
Eight pounds maximum for shielded
plug and jack.
Plug shall not dislodge from jack.
Plug retention in jack.
Pull.
Plug shall remain mated with no
evidence of damage.
Jack retention to PCB.
Jack shall not dislodge from PCB.
One pound minimum before flow
soldering.
Ten pounds minimum after flow
soldering.
ENVIRONMENTAL
No evidence of physical damage.
Thermal shock.
EIA-364-32.
Subject mated plug and jack to 25
cycles between -40 and 60°C.
AMP Spec 109-76-2.
Subject mated plug and jack to 10
humidity/temperature cycles
between 4 and 60°C at 95% RH.
High humidity/temperature cycling.
No evidence of physical damage.
Figure 1 (end)
Rev E
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108-1163
3.6.
Connector Tests and Sequences
Test Group (a)
Test or Examination
Examination of product
Termination resistance, dry circuit
Termination resistance, rated current
Insulation resistance
Dielectric withstanding voltage
Temperature rise vs current
Current cycling
Shielding effectiveness
Surge
Vibration
Durability
Mating force
Unmating force
Plug retention in jack
Pull
Jack retention to PCB
Thermal shock
High humidity/temperature cycling
NOTE
(a)
(b)
See paragraph 4.1.A.
Numbers indicate sequence in which tests are performed.
Figure 2
3
3
3
3
3
5
2
3
2
3
4
2
3
4
2
5
1
1
2
1
2,4
3
1
2,4
4
1
4,6
2,5
5
4
5
1
6
1
7
1
2,6
8
1
2,4
9
1
Test Sequence (b)
Rev E
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