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5962-8865804XA

产品描述IC 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CDIP32, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32, Analog to Digital Converter
产品类别模拟混合信号IC    转换器   
文件大小166KB,共12页
制造商ADI(亚德诺半导体)
官网地址https://www.analog.com
下载文档 详细参数 选型对比 全文预览

5962-8865804XA概述

IC 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CDIP32, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32, Analog to Digital Converter

5962-8865804XA规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称ADI(亚德诺半导体)
零件包装代码DIP
包装说明HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32
针数32
Reach Compliance Codeunknown
ECCN代码3A001.A.2.C
最大模拟输入电压10 V
最小模拟输入电压-10 V
转换器类型ADC, SUCCESSIVE APPROXIMATION
JESD-30 代码R-CDIP-T32
JESD-609代码e0
长度41.15 mm
最大线性误差 (EL)0.018%
模拟输入通道数量1
位数12
功能数量1
端子数量32
最高工作温度125 °C
最低工作温度-55 °C
输出位码BINARY, OFFSET BINARY, COMPLEMENTARY BINARY, 2\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY
输出格式SERIAL, PARALLEL, WORD
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DIP
封装等效代码DIP32,.6
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)NOT SPECIFIED
电源5,+-12 V
认证状态Not Qualified
筛选级别38535Q/M;38534H;883B
座面最大高度7.112 mm
表面贴装NO
技术HYBRID
温度等级MILITARY
端子面层Tin/Lead (Sn/Pb) - hot dipped
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度15.24 mm

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a
FEATURES
Complete 12-Bit A/D Converter with Reference
and Clock
Fast Conversion: 3 s Max
Buried Zener Reference for Long-Term Stability and
Low Gain TC: 30 ppm/ C Max (AD578)
40 ppm/ C Max (AD579)
Max Nonlinearity: < 0.012%
No Missing Codes over Temperature
Low Power: 555 mW (AD578); 775 mW (AD579)
Available to MIL-STD-883
Positive-True Parallel or Serial Logic Outputs
Short Cycle Capability
Precision +10 V Reference for External Applications
Adjustable Internal Clock
“Z”
Models for 12 V Supplies
Very Fast, Complete
10- or 12-Bit A/D Converters
AD578/AD579
FUNCTIONAL BLOCK DIAGRAM
AD578/AD579
32 –15V
31 +15V
100
20k
20k
5k
30 ANALOG GND
29 ZERO ADJ
28 20V SPAN INPUT
27 10V SPAN INPUT
10k
26 BIPOLAR OFFSET
25 GAIN (REF IN)
24 REF OUT
23 SERIAL OUT
22
SERIAL OUT
21 CONVERT START
20 EOC
SAR
CLOCK
COMPARATOR
19 CLOCK IN
18 CLOCK OUT
17 CLOCK ADJ
(AD578)
BIT 12 1
(AD578) 2
BIT 11
BIT 10 3
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
4
5
6
7
8
9
BIT 3 10
BIT 2 11
BIT 1 12
BIT 1
SHORT
CYCLE
DIGITAL
GND
+5V
13
14
15
16
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The AD578 and AD579 are high speed 12-bit and 10-bit succes-
sive approximation analog-to-digital converters that include an
internal clock, reference, and comparator. Their hybrid design
utilizes MSI digital and linear ICs in conjunction with a 12-bit
or 10-bit monolithic, monotonic DAC to provide superior
performance and versatility with IC size, price, and reliability.
Important performance characteristics of the AD578 include
±
1/2 LSB
12
linearity error maximum at +25∞C, maximum gain
tempco of
±
30 ppm/∞C, and maximum conversion time of 3
ms
at a typical power dissipation of 555 mW. The 10-bit AD579
provides
±1/2
LSB
10
maximum linearity error at 1.8
ms
maximum,
and 775 mW typical P
D
.
Both the AD578 and AD579 include scaling resistors that provide
analog input signal ranges of
±
5 V,
±
10 V, and 0 V to +10 V.
Both are contained in 32-lead ceramic side-brazed DIP pack-
ages, and are available with MIL-STD-883 Class B processing.
The serial output function is no longer supported on this
product after date code 9623.
1. Both the AD578 and AD579 are complete analog-to-digital
converters. No external components are required to perform
a conversion.
2. The fast conversion rates—3
ms
for the AD578, and 1.8
ms
for the AD579—make them ideal candidates for high speed
data acquisition systems requiring high throughput.
3. The internal buried Zener reference is laser trimmed to high
initial accuracy and low TC and is available externally.
4. Precision thin-film scaling resistors on the DAC provide for
excellent thermal tracking.
5. Short cycle and external clock capabilities are provided for
applications requiring faster conversion speeds and/or lower
resolution.
REV. B
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective companies.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
www.analog.com
Fax: 781/326-8703
© 2003 Analog Devices, Inc. All rights reserved.
D/A CONVERTER
5k

5962-8865804XA相似产品对比

5962-8865804XA 5962-8865802XA 5962-8865803XC 5962-8865802XC 5962-8865804XC 5962-8865801XC 5962-8865801XA 5962-8865803XA
描述 IC 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CDIP32, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32, Analog to Digital Converter IC 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CDIP32, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32, Analog to Digital Converter IC 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CDIP32, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32, Analog to Digital Converter IC 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CDIP32, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32, Analog to Digital Converter IC 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CDIP32, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32, Analog to Digital Converter IC 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CDIP32, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32, Analog to Digital Converter IC 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CDIP32, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32, Analog to Digital Converter IC 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CDIP32, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32, Analog to Digital Converter
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 DIP DIP DIP DIP DIP DIP DIP DIP
包装说明 HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32
针数 32 32 32 32 32 32 32 32
Reach Compliance Code unknown _compli compliant compliant compliant compliant not_compliant not_compliant
ECCN代码 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
最大模拟输入电压 10 V 10 V 10 V 10 V 10 V 10 V 10 V 10 V
最小模拟输入电压 -10 V -10 V -10 V -10 V -10 V -10 V -10 V -10 V
转换器类型 ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION
JESD-30 代码 R-CDIP-T32 R-CDIP-T32 R-CDIP-T32 R-CDIP-T32 R-CDIP-T32 R-CDIP-T32 R-CDIP-T32 R-CDIP-T32
长度 41.15 mm 41.15 mm 41.15 mm 41.15 mm 41.15 mm 41.15 mm 41.15 mm 41.15 mm
最大线性误差 (EL) 0.018% 0.018% 0.018% 0.018% 0.018% 0.018% 0.018% 0.018%
模拟输入通道数量 1 1 1 1 1 1 1 1
位数 12 12 12 12 12 12 12 12
功能数量 1 1 1 1 1 1 1 1
端子数量 32 32 32 32 32 32 32 32
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
输出位码 BINARY, OFFSET BINARY, COMPLEMENTARY BINARY, 2\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY BINARY, OFFSET BINARY, COMPLEMENTARY BINARY, 2\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY BINARY, OFFSET BINARY, COMPLEMENTARY BINARY, 2\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY BINARY, OFFSET BINARY, COMPLEMENTARY BINARY, 2\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY BINARY, OFFSET BINARY, COMPLEMENTARY BINARY, 2\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY BINARY, OFFSET BINARY, COMPLEMENTARY BINARY, 2'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY BINARY, OFFSET BINARY, COMPLEMENTARY BINARY, 2'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY BINARY, OFFSET BINARY, COMPLEMENTARY BINARY, 2'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY
输出格式 SERIAL, PARALLEL, WORD SERIAL, PARALLEL, WORD SERIAL, PARALLEL, WORD SERIAL, PARALLEL, WORD SERIAL, PARALLEL, WORD SERIAL, PARALLEL, WORD SERIAL, PARALLEL, WORD SERIAL, PARALLEL, WORD
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 DIP DIP DIP DIP DIP DIP DIP DIP
封装等效代码 DIP32,.6 DIP32,.6 DIP32,.6 DIP32,.6 DIP32,.6 DIP32,.6 DIP32,.6 DIP32,.6
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 5,+-12 V 5,+-15 V 5,+-12 V 5,+-15 V 5,+-12 V 5,+-15 V 5,+-15 V 5,+-12 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
筛选级别 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
座面最大高度 7.112 mm 7.112 mm 7.112 mm 7.112 mm 7.112 mm 7.112 mm 7.112 mm 7.112 mm
表面贴装 NO NO NO NO NO NO NO NO
技术 HYBRID HYBRID HYBRID HYBRID HYBRID HYBRID HYBRID HYBRID
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子形式 THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
端子节距 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm
是否无铅 含铅 - 含铅 - 含铅 含铅 含铅 含铅
厂商名称 ADI(亚德诺半导体) - ADI(亚德诺半导体) ADI(亚德诺半导体) ADI(亚德诺半导体) ADI(亚德诺半导体) ADI(亚德诺半导体) -
JESD-609代码 e0 e0 - e0 - - e0 e0
端子面层 Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped - TIN LEAD - - Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped
Base Number Matches - 1 1 1 1 1 1 1
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