Stacked Film Capacitor Chips
FEATURES
• STACKED METALLIZED ACRYLIC RESIN FILM (THERMO-CURE TYPE)
• STANDARD EIA 0805, 1206 AND 1210 SIZES
• HIGH HEAT AND MOISTURE RESISTANT
• STABLE TEMPERATURE, FREQUENCY & BIAS CHARACTERISTICS
• REFLOW SOLDERING ONLY
• TAPE AND REEL PACKAGING
Case Sizes
0805
1206
1210
Capacitance Range
0.1μF
0.15μF ~ 0.068μF
1.0μF
Voltage Ratings
16Vdc
Capacitance Tolerance
±20% (M)
Temperature Range
-40°C ~ +85°C
Dissipation Factor (20°C)
1.5% @ 1KHz/25°C
Insulation Resistance (20°C)
C < 0.33μF = 1000MΩ, C > 0.47μF = 300MΩ/μF @ 10Vdc
175% of Rated Voltage (5 seconds)
Dielectric Withstanding Voltage
150% of Rated Voltage (60 seconds)
Temperature Characteristic
-20% ~ +5%
ΔC
Maximum Over Temperature Range
SPECIFICATIONS
NSPU IS
RECOMMENDED
FOR NEW DESIGNS
NSPU Series
RoHS
Compliant
includes all homogeneous materials
*See Part Number System for Details
ENVIRONMENTAL CHARACTERISTICS
Life Test At +85°C
1,000 Hours at 125% of
Rated Voltage
Resistance to Soldering Heat
Reflow: 240°C Peak
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Withstanding Voltage
Humidity Load Life
+40°C & 90% ~ 95% RH
500 Hours @ rated voltage
Solderability with
25% Wt Rosin-Methanol Flux
Capacitance Change
Dissipation Factor
Insulation Resistance
Withstanding Voltage
Within +7% ~ -20% of Initial Value
1.65% Maximum @ 1KHz
C < 0.33μF = 300MΩ Min., C > 0.47μF = 100MΩ/μF
Within +3% ~ -15% of Initial Value
1.65% Maximum ~ 1KHz
C < 0.33μF = 500MΩ Min., C > 0.47μF = 150MΩ/μF
150% of rated voltage for 60 seconds
175% of rated voltage for 5 seconds
Within +20%/-3% of Initial value
2.25% Maximum
C < 0.33μF = 100MΩ Min., C > 0.47μF = 30MΩ/μF
130% of rated voltage for 60 seconds
90% Minimum Coverage After 2.5 Second Dip into 245°C Solder Pot
PART NUMBER SYSTEM
NSPU 104 M 16 TR A3 F
RoHS compliant
Size Code
Tape & Reel
Voltage
Tolerance Code: M=±20%
Capacitance in pF, 1st two digits are
significant, 3rd digit is no. of zeros
Series
®
68
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Stacked Film Capacitor Chips
STANDARD VALUES AND CASE SIZES (mm)
Part Number
NSPU104M16TRA3F
NSPU154M16TRB4F
NSPU224M16TRB4F
NSPU334M16TRB5F
NSPU474M16TRB6F
NSPU684M16TRB6F
NSPU105M16TRC4F
Capacitance Value
0.1μF
0.15μF
0.22μF
0.33μF
0.47μF
0.68μF
1.0μF
L ± 0.2
2.0
Dimensions (mm)
W ± 0.2
H ± 0.2
1.25
1.0
0.8
0.8
1.6
1.0
1.4
1.4
2.5
1.4
P
0.45 ± 0.25
NSPU Series
EIA
Size
0805
1206
1206
1206
1206
1206
1210
B ± 0.1
2.3
3.5
3.5
Reel
Qty
3,000
3,000
3,000
3,000
2,000
2,000
2,000
C ± 0.2
1.3
1.5
1.9
3.2
0.65 ± 0.30
Stacked Element Terminations:
95.5% Sn, 4% Ag and
0.5% Cu over phenolic
resin/Ag/Ni/Cu barrier over
Cu base.
LAND PATTERN DIMENSIONS (mm)
EIA Size
0805
1206
1210
A ± 0.1
1.55
1.9
1.9
H
C
p
L
2
L
1
p
W
RECOMMENDED REFLOW PROFILE
300
A
B
Temperature - Deg. C
250
200
150
Peak Temperature
240°C
Cool Down
100
50
25
Pre-heat
150°C ~ 180°C
120 sec. max.
Time above 220°C
30 sec. max.
0
Ramp-up
25°C ~ 150°C
90 sec. max.
Time
Note: These capacitors are sensitive to moisture. Capacitors should be stored in moisture barrier packaging at
+25°C and a relative humidity of <70% (six months maximum). The components should be soldered within 72
hours of breaking the moisture barrier packaging seal and stored during those 72 hours at <+25°C and <70%
relative humidity. If the parts are to be storage outside of the moisture barrier packaging the conditions should
be <+20°C and relative humidity of less then 50%.
TAPE AND REEL DIMENSIONS (mm)
Case Code
A3
B4, B5
B6
C4
A ± 0.1
1.55
1.9
1.9
2.8
B ± 0.1
2.3
3.5
3.5
3.5
C ± 0.2
1.3
1.5
1.9
1.9
t ± 0.05
0.25
W ± 0.3
8.0
F ± 0.05
3.5
P ± 0.1
4.0
D +0.2/-0
1.0
REEL
13
.0
2.0 +/- 0.5
4.0 ±0.1
1.5 +0.1
-0
P
1
1.75 ±0.1
t
+/
−
0.
5
2.0
+/−
0.5
F
D1
D3
W
B
D
o
D2
t
A
P
C
W
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
69
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