电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

PFB8553200E336MB

产品描述New High Speed Decoupling Device Proadlizer® PF/B Series
文件大小557KB,共2页
制造商NEC ( Renesas )
官网地址https://www2.renesas.cn/zh-cn/
下载文档 选型对比 全文预览

PFB8553200E336MB概述

New High Speed Decoupling Device Proadlizer® PF/B Series

文档预览

下载PDF文档
Vol.
02
Proadlizer PF/B Series
APPLICATION
• High speed and high power CPU decoupling
• EMI solution for 10 MHz range or above
• High switching frequency DC/DC converter output
capacitor
New High Speed Decoupling Device
®
FEATURES
• Excellent noise absorption performance at GHz
frequency
• High Capacitance and very low ESR based on
our Conductive Polymer technology
• Reduction of passive components for decoupling circuit
PERFORMANCE
No
1
2
3
4
5
6
7
8
Test Item
Operating
Temperature
Rated Voltage
Capacitance
Capacitance
Tolerance
LC
Dissipation
Factor
ESR
Surge Voltage
Performance
55∼+125
Test Condition
DIMENSIONS [mm]
L2
L1
Z2
Z1
Z1
2.5V,4V
22µF∼100µF
±20%
Refer Rating table
Refer Rating table
Refer Rating table
Capacitance Change Within ±20% of Initial specification
LC Lower than initial specification
Dissipation Factor Lower than 2times initial specification
ESR Lower than 2times initial specification
120Hz
120Hz
Applied Rating Voltage,5min
W1
OE 107
B8J00001
120Hz
100kHz
Applied 115% of Rating
Voltage at 125 1000 cycles
H
Case Code
855320
L1
8.5±0.2
L2
8.2±0.2
W1
5.3±0.2
H
2.0Max
Z1
1.2±0.2
Z2
4.6±0.2
9
Temperature
Stability
Capacitance
Change
LC
tanδ
ESR
−55℃
Within 0% to -20%
Lower than initial
specification
Lower than initial
specification
Lower than initial
specification
125℃
Within +50% to 0%
Lower than 10 times
initial specification
Lower than 1.5times
initial specification
Lower than 1.5times
initial specification
LAYOUT LAND PATTERN (Tentative)
-55 to 125 5cycles
10
Temperature
Cycling
Capacitance Change Within ±20% of initial specification
LC Lower than initial specification
Dissipation Factor Lower than 2times initial specification
ESR Lower than 2times initial specification
Capacitance Change Within ±20% of initial specification
LC Lower than initial specification
Dissipation Factor Lower than initial specification
ESR Lower than initial specification
Capacitance Change Within +30% to –20%
of initial specification
LC Lower than initial specification
Dissipation Factor Lower than 2times initial specification
ESR Lower than 2times initial specification
Capacitance Change Within ±20% of initial specification
LC Lower than initial specification
Dissipation Factor Lower than 2times initial specification
ESR Lower than 2times initial specification
11
Resistance to
Soldering Heat
Reflow soldering
240 ,10sec. Peak
12
Dump Heat
65 90 to 95%RH
500hour
13
Endurance
125 Applied Rating Voltage
1000hour
●All specifications in this catalog and production status of products are subject to change without notice. Prior to the purchase, please contact NEC TOKIN for updated product data.
●Please request for a specification sheet for detailed product data prior to the purchase.
●Before using the product in this catalog, please read "Precautions" and other safety precautions listed in the printed version catalog.
9653PFBVOL02E0912E1

PFB8553200E336MB相似产品对比

PFB8553200E336MB PFB8553200D277MB PFB8553200E107MB PFB8553200G226MB PFB8553200G476MB
描述 New High Speed Decoupling Device Proadlizer® PF/B Series New High Speed Decoupling Device Proadlizer® PF/B Series New High Speed Decoupling Device Proadlizer® PF/B Series New High Speed Decoupling Device Proadlizer® PF/B Series New High Speed Decoupling Device Proadlizer® PF/B Series
【Silicon Labs BG22-EK4108A 蓝牙开发评测】 II. 进展与障碍
本帖最后由 zhang1gong 于 2022-1-8 10:49 编辑 1生成范例(EXAMPLE PROJECT)项目的代码并运行 运行“Bluetooth - SoC Blinky”成功,在手机端通过app “EFR Connect&rdq ......
zhang1gong Silicon Labs测评专区
请问vs2008的ppc模拟器主程序在哪个目录
exe,不是bin...
wenhanbin 嵌入式系统
用了一个乘法器和3个除法器,代码量不多,但是map步骤跑得特别慢,这是什么原因呢?
用了一个乘法器和3个除法器,代码量不多,但是map步骤跑得特别慢,这是什么原因呢?eeworldpostqq...
Grizabella FPGA/CPLD
是选择数字集成电路设计还是模拟?还是混合Or射频IC?
小弟研究生被西安电子科技大学 集成电路设计方向录取了 但是我对数字,模拟,数模混合,射频,这些集成电路设计的区别与难易程度不是太了解? 大神们能不能给指点一下,从将来前景及选择上, ......
伤城岁月 FPGA/CPLD
我的风火轮触摸板初体验
在与MSP-EXP430G2 LaunchPad 实验板初体验之后,我又在TI官网看到一个关于LaunchPad实验板很好玩的视频,哪就是将风火轮触摸板置于LaunchPad 实验板之上进行触摸操作,不仅能实验风火轮演示, ......
zdhm_Web 微控制器 MCU
各位大神FVRCON是哪个寄存器里面的
FVRCON=0B11000001;这个什么意思不太懂 ...
嘻嘻嘻嘻啊啊 Microchip MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1570  304  2242  2157  2279  33  3  36  6  53 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved