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SIRA02DP

产品描述N-Channel 30 V (D-S) MOSFET
文件大小514KB,共13页
制造商Vishay(威世)
官网地址http://www.vishay.com
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SIRA02DP概述

N-Channel 30 V (D-S) MOSFET

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New Product
SiRA02DP
Vishay Siliconix
N-Channel 30 V (D-S) MOSFET
PRODUCT SUMMARY
V
DS
(V)
30
R
DS(on)
() (Max.)
0.0020 at V
GS
= 10 V
0.0027 at V
GS
= 4.5 V
I
D
(A)
a, g
50
50
Q
g
(Typ.)
34.3 nC
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET
®
Gen IV Power MOSFET
• 100 % R
g
and UIS Tested
Compliant to RoHS Directive 2002/95/EC
PowerPAK
®
SO-8
APPLICATIONS
Synchronous Rectification
• High Power Density DC/DC
• VRMs and Embedded DC/DC
G
D
6.15 mm
S
1
2
3
S
S
5.15 mm
G
4
D
8
7
6
5
D
D
D
S
N-Channel MOSFET
Bottom View
Ordering Information:
SiRA02DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25 °C, unless otherwise noted)
Parameter
Drain-Source Voltage
Gate-Source Voltage
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
T
C
= 25 °C
T
A
= 25 °C
L =0.1 mH
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
d, e
Symbol
V
DS
V
GS
I
D
Limit
30
+ 20, - 16
50
g
50
g
37.3
b, c
29.8
b, c
100
45
g
4.5
b, c
30
45
50
32
5
b, c
3.2
b, c
- 55 to 150
260
Unit
V
Continuous Drain Current (T
J
= 150 °C)
Pulsed Drain Current (t = 300 µs)
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
I
DM
I
S
I
AS
E
AS
P
D
A
mJ
Maximum Power Dissipation
W
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
T
J
, T
stg
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient
b, f
Maximum Junction-to-Case (Drain)
t
10 s
Steady State
Symbol
R
thJA
R
thJC
Typical
20
2.0
Maximum
25
2.5
Unit
°C/W
Notes:
a. Based on T
C
= 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 70 °C/W.
g. Package limited.
Document Number: 63773
S12-0306-Rev. A, 13-Feb-12
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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