GDZ5V1LP3 - GDZ8V2LP3
ULTRA-SMALL LEADLESS SURFACE
MOUNT ZENER DIODE
Features
•
•
•
•
•
•
•
Ultra-Small Leadless Surface Mount Package (0.6 x 0.3mm)
Ultra-Low Profile Package (0.3mm)
Ideally Suited for Automated Assembly Processes
Low Leakage Current, Suitable for Battery-Powered Applications
Lead Free By Design/RoHS Compliant (Note 1)
Halogen and Antimony Free "Green" Device (Notes 2 & 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
•
•
•
•
•
•
Case: X3-DFN0603-2
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: Cathode Bar
Terminals: Finish
−
Matte Tin over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.2 mg (Approximate)
ADVANCE INFORMATION
Top View
Bottom View
Ordering Information
(Note 4)
Part Number
(Type Number)-7*
Notes:
Case
X3-DFN0603-2
Packaging
10,000/Tape & Reel
*Add “-7” to the appropriate type number in Electrical Characteristics Table. Example: 6.2V Zener = GDZ6V2LP3-7.
1. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free
2. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
xx = Product Type Marking Code
(See Electrical Characteristics Table)
Line Denotes Cathode Side
GDZ5V1LP3 - GDZ8V2LP3
Document number: DS35065 Rev. 12 - 2
1 of 4
www.diodes.com
February 2012
© Diodes Incorporated
GDZ5V1LP3 - GDZ8V2LP3
Thermal Characteristics
Characteristic
Power Dissipation (Note 5)
T
A
= 25°C
Thermal Resistance, Junction to Ambient Air (Note 5) T
A
= 25°C
Operating and Storage Temperature Range
Symbol
P
D
R
θ
JA
T
J,
T
STG
Value
250
500
-55 to +150
Unit
mW
°C/W
°C
ADVANCE INFORMATION
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Type
Number
Marking
Code
Nom (V)
5.1
5.6
6.0
6.2
6.8
7.5
8.2
Zener Voltage Range
(Note 6)
V
Z
@ I
ZT
Min (V)
4.840
5.310
5.676
5.860
6.470
7.060
7.760
I
ZT
mA
5
5
5
5
5
5
5
Maximum
Reverse
Current
(Note 6)
I
R
@ V
R
uA
V
0.2
2.0
1.0
2.5
1.0
2.8
1.0
3.0
0.5
3.5
0.5
4.0
0.5
5.0
GDZ5V1LP3
GDZ5V6LP3
GDZ6V0LP3
GDZ6V2LP3
GDZ6V8LP3
GDZ7V5LP3
GDZ8V2LP3
Notes:
KM
KN
KW
KO, KS
KT
KQ
KX
Max (V)
5.370
5.920
6.324
6.530
7.140
7.840
8.640
5. Device mounted on FR-4 PCB with minimum recommended pad layout, as shown in Diodes Incorporated’s Suggested Pad Layout document, which can
be found on our website at http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
0.25
P
D
, POWER DISSIPATION (W)
Note 5
I
F
, INSTANTANEOUS FORWARD CURRENT (mA)
150
0.30
1,000
100
0.20
10
0.15
1
0.10
0.05
0
0
0.1
25
50
75
100
125
T
A
, AMBIENT TEMPERATURE (°C)
Fig. 1 Power Derating Curve
0.01
0.2
0.4
0.6
0.8
1.0
1.2
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
GDZ5V1LP3 - GDZ8V2LP3
Document number: DS35065 Rev. 12 - 2
2 of 4
www.diodes.com
February 2012
© Diodes Incorporated
GDZ5V1LP3 - GDZ8V2LP3
I
R
, INSTANTANEOUS REVERSE CURRENT (nA)
5
b (2x)
20
100
5V1LP3
I
Z
, ZENER CURRENT (mA)
15
6V2LP3
6V8LP3
7V5LP3
8V2LP3
ADVANCE INFORMATION
10
10
5
0
0
4
6
8
10
V
Z
, ZENER VOLTAGE (V)
Fig. 3 Typical Zener Breakdown Characteristics
2
1
1.5
2
2.5
V
R
, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 4 Typical Reverse Characteristics - GDZ5V1LP3
20
f = 1MHz
C
T
, TOTAL CAPACITANCE (pF)
15
10
5
0
0
1
2
3
4
V
R
, REVERSE VOLTAGE (V)
Fig. 5 Typical Total Capacitance
Package Outline Dimensions
A
A1 (2x)
D
e
E
X3-DFN0603-2
Dim
Min
Max
Typ
A
0.27
0.35
0.30
A1
0.00
0.03
0.02
b
0.19
0.29
0.24
D
0.595 0.645
0.62
E
0.295 0.345
0.32
e
-
-
0.355
L
0.14
0.24
0.19
All Dimensions in mm
L (2x)
GDZ5V1LP3 - GDZ8V2LP3
Document number: DS35065 Rev. 12 - 2
3 of 4
www.diodes.com
February 2012
© Diodes Incorporated
GDZ5V1LP3 - GDZ8V2LP3
Suggested Pad Layout
Z
ADVANCE INFORMATION
C
Y (2x)
Dimensions
C
X
Y
Z
X (2x)
Value (in mm)
0.355
0.230
0.300
0.610
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
GDZ5V1LP3 - GDZ8V2LP3
Document number: DS35065 Rev. 12 - 2
4 of 4
www.diodes.com
February 2012
© Diodes Incorporated
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