Datasheet> 器件分类 > 连接器> 插座> HCS156-04TG

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HCS156-04TG: 产品描述IC Socket, PGA156, 156 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,; 产品类别连接器插座; 文件大小146KB，共2页; 制造商Advanced Interconnections Corp

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HCS156-04TG概述

IC Socket, PGA156, 156 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,

HCS156-04TG规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Advanced Interconnections Corp
Reach Compliance Code	compliant
ECCN代码	EAR99
其他特性	2.5 OZ. AVG. INSERTION FORCE
主体宽度	1.5 inch
主体深度	0.12 inch
主体长度	1.5 inch
触点的结构	15X15
联系完成配合	AU ON NI
联系完成终止	Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
触点材料	BE-CU
触点样式	RND PIN-SKT
设备插槽类型	IC SOCKET
使用的设备类型	PGA156
外壳材料	GLASS FILLED THERMOPLASTIC
JESD-609代码	e0
插接触点节距	0.1 inch
安装方式	STRAIGHT
触点数	156
最高工作温度	260 °C
最低工作温度	-60 °C
PCB接触模式	RECTANGULAR
PCB触点行间距	0.1 mm
端子节距	2.54 mm
端接类型	SOLDER

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Low Insertion Force

PGA Sockets

5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com

Molded & FR-4 Low Insertion Force PGA Sockets

.100

(2.54)

.062

(1.57)

Molded

PC Board

FR-4

PC Board

Features:

• As low as 1 oz.(28.34 g) average insertion

force per pin.

• Multiple finger contacts for reliability.

• Over 500 PGA footprints available.

• Closed bottom terminal for 100% anti-

wicking of solder.

• Tapered entry for ease of insertion.

• To fit .100” (2.54 mm) grid.

• Easily customized to fit your application.

How To Order

1 oz. (28.34 g) Average Insertion Force Sockets

Footprint Dash #

If Applicable*

Body Type

CIS - Standard Molded

HCIS - High Temp. Molded

FIS - FR-4

Number of Pins

004 to 484

*See pages 37 - 64

for PGA footprints

CIS

068

-01

Contact Plating

G - Gold

T - Tin-Lead

Terminal Plating

G - Gold

T - Tin-Lead

Terminal Type

See next page

for terminal types

Terminals and Contacts:

Terminal: Brass - Copper Alloy (C36000)

ASTM-B-16

Contact: Beryllium Copper (C17200)

ASTM-B-194

How To Order

2.5 oz. (70.85 g) Average Insertion Force Sockets

Footprint Dash #

If Applicable*

Body Type

CS - Standard Molded

HCS - High Temp. Molded

FS - FR-4

Number of Pins

004 to 484

*See pages 37 - 64

for PGA footprints

Solder Preform:

63% Tin, 37% Lead

068

-01

Contact Plating

G - Gold

T - Tin-Lead

Terminal Plating

G - Gold

T - Tin-Lead

Plating:

Terminal: Gold over Nickel or

Tin-Lead over Nickel

Contact: Gold over Nickel or

Tin-Lead over Nickel

Gold per MIL-G-45204

Tin-Lead per MIL-P-81728

Nickel per QQ-N-290

Terminal Type

See next page

for terminal types

Sealant Options

RTV

Seal

Body Material:

CS/CIS -

Glass Filled Thermoplastic

Polyester (P.B.T.), U.L. Rated 94V-O,

-60˚C to 140˚C (-76˚F to 284˚F)

HCS/HCIS -

High Temp. Glass Filled

Thermoplastic (P.P.S.) , U.L. Rated 94V-O,

-60˚C to 260˚C (-76˚F to 500˚F)

FS/FIS -

FR-4 Fiberglass Epoxy Board,

U.L. Rated 94V-O, Index 140˚C (284˚F)

RTV Sealed

To order: Add RTV to end of part #

Note: RTV not available with HCS or HCIS Insulators

Tape Sealed

To order: Add 3M to end of part #

Page 32

Products shown covered by patents issued and/or pending. Specifications subject to change without notice.

inch/(mm)

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