Fixed-Point Digital Signal Processor 532-FCBGA
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | HFBGA, BGA532,26X26,32 |
| 针数 | 532 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.3 |
| Factory Lead Time | 1 week |
| 其他特性 | ALSO REQUIRES 3.3VI/O SUPPLY |
| 地址总线宽度 | 32 |
| 桶式移位器 | NO |
| 位大小 | 32 |
| 边界扫描 | YES |
| 最大时钟频率 | 75.18 MHz |
| 外部数据总线宽度 | 64 |
| 格式 | FIXED POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B532 |
| JESD-609代码 | e0 |
| 长度 | 23 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 4 |
| 端子数量 | 532 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HFBGA |
| 封装等效代码 | BGA532,26X26,32 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
| 峰值回流温度（摄氏度） | 220 |
| 电源 | 1.2,3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 4096 |
| 座面最大高度 | 3.3 mm |
| 最大供电电压 | 1.26 V |
| 最小供电电压 | 1.14 V |
| 标称供电电压 | 1.2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 23 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| TMS32C6415DGLZW5E0 | TMS32C6414DGLZW5E0 | TMS32C6414DGLZ6E3 | TMS32C6414DGLZW6E3 | |
|---|---|---|---|---|
| 描述 | Fixed-Point Digital Signal Processor 532-FCBGA | Fixed-Point Digital Signal Processor 532-FCBGA | Fixed-Point Digital Signal Processor 532-FCBGA | Fixed-Point Digital Signal Processor 532-FCBGA |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA | BGA | BGA | BGA |
| 包装说明 | HFBGA, BGA532,26X26,32 | HFBGA, BGA532,26X26,32 | HFBGA, BGA532,26X26,32 | HFBGA, BGA532,26X26,32 |
| 针数 | 532 | 532 | 532 | 532 |
| Reach Compliance Code | not_compliant | compliant | compliant | not_compliant |
| ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
| 其他特性 | ALSO REQUIRES 3.3VI/O SUPPLY | ALSO REQUIRES 3.3VI/O SUPPLY | ALSO REQUIRES 3.3VI/O SUPPLY | ALSO REQUIRES 3.3VI/O SUPPLY |
| 地址总线宽度 | 32 | 32 | 32 | 32 |
| 桶式移位器 | NO | NO | NO | NO |
| 位大小 | 32 | 32 | 32 | 32 |
| 边界扫描 | YES | YES | YES | YES |
| 最大时钟频率 | 75.18 MHz | 75.18 MHz | 75.18 MHz | 75.18 MHz |
| 外部数据总线宽度 | 64 | 64 | 64 | 64 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PBGA-B532 | S-PBGA-B532 | S-PBGA-B532 | S-PBGA-B532 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 23 mm | 23 mm | 23 mm | 23 mm |
| 低功率模式 | YES | YES | YES | YES |
| 湿度敏感等级 | 4 | 4 | 4 | 4 |
| 端子数量 | 532 | 532 | 532 | 532 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HFBGA | HFBGA | HFBGA | HFBGA |
| 封装等效代码 | BGA532,26X26,32 | BGA532,26X26,32 | BGA532,26X26,32 | BGA532,26X26,32 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
| 峰值回流温度（摄氏度） | 220 | 220 | 220 | 220 |
| 电源 | 1.2,3.3 V | 1.2,3.3 V | 1.4,3.3 V | 1.4,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字数） | 4096 | 4096 | 16384 | 4096 |
| 座面最大高度 | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm |
| 最大供电电压 | 1.26 V | 1.26 V | 1.44 V | 1.44 V |
| 最小供电电压 | 1.14 V | 1.14 V | 1.36 V | 1.36 V |
| 标称供电电压 | 1.2 V | 1.2 V | 1.4 V | 1.4 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 23 mm | 23 mm | 23 mm | 23 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| Factory Lead Time | 1 week | 1 week | - | 1 week |
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