Digital Media Processor 361-NFBGA 0 to 90
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | NFBGA-361 |
| 针数 | 361 |
| Reach Compliance Code | compli |
| ECCN代码 | 3A991.A.2 |
| Factory Lead Time | 1 week |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 32 |
| 桶式移位器 | NO |
| 位大小 | 32 |
| 边界扫描 | YES |
| 最大时钟频率 | 27 MHz |
| 外部数据总线宽度 | 32 |
| 格式 | FIXED POINT |
| 集成缓存 | YES |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B361 |
| JESD-609代码 | e1 |
| 长度 | 16 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 3 |
| DMA 通道数量 | 72 |
| 端子数量 | 361 |
| 计时器数量 | 5 |
| 片上数据RAM宽度 | 8 |
| 片上程序ROM宽度 | 8 |
| 最高工作温度 | 90 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFBGA |
| 封装等效代码 | BGA361,19X19,32 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.2,1.8,3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 20480 |
| ROM可编程性 | MROM |
| 座面最大高度 | 1.4 mm |
| 最大供电电压 | 1.26 V |
| 最小供电电压 | 1.14 V |
| 标称供电电压 | 1.2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 16 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| TMS320DM6433ZWT6 | TMS320DM6433ZDU6 | TMS320DM6433ZDU7 | TMS320DM6433ZDUL | TMS320DM6433ZWT4 | TMS320DM6433ZWT5 | TMS320DM6433ZWT7 | TMS320DM6433ZWTL | TMS320DM6433ZWTQ5 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Digital Media Processor 361-NFBGA 0 to 90 | Digital Media Processor 376-BGA 0 to 90 | Digital Media Processor 376-BGA | Digital Signal Processors & Controllers - DSP, DSC Dig Media Proc | Digital Media Processor 361-NFBGA 0 to 90 | Digital Media Processor 361-NFBGA 0 to 90 | Digital Media Processor 361-NFBGA | Digital Media Processor 361-NFBGA | Digital Media Processor 361-NFBGA -40 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 不符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | NFBGA-361 | BGA-376 | HBGA, BGA376,22X22,40 | BGA-376 | LFBGA, BGA361,19X19,32 | LFBGA, BGA361,19X19,32 | NFBGA-361 | NFBGA-361 | LFBGA, BGA361,19X19,32 |
| 针数 | 361 | 376 | 376 | 376 | 361 | 361 | 361 | 361 | 361 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli | compli |
| ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
| Factory Lead Time | 1 week | 1 week | 6 weeks | 10 weeks | 1 week | 1 week | 16 weeks | 12 weeks | 12 weeks |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 桶式移位器 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 边界扫描 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 最大时钟频率 | 27 MHz | 27 MHz | 27 MHz | 27 MHz | 27 MHz | 27 MHz | 27 MHz | 27 MHz | 27 MHz |
| 外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PBGA-B361 | S-PBGA-B376 | S-PBGA-B376 | S-PBGA-B376 | S-PBGA-B361 | S-PBGA-B361 | S-PBGA-B361 | S-PBGA-B361 | S-PBGA-B361 |
| JESD-609代码 | e1 | e1 | e1 | e1 | e1 | e1 | e1 | e1 | e1 |
| 长度 | 16 mm | 23 mm | 23 mm | 23 mm | 16 mm | 16 mm | 16 mm | 16 mm | 16 mm |
| 低功率模式 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 361 | 376 | 376 | 376 | 361 | 361 | 361 | 361 | 361 |
| 最高工作温度 | 90 °C | 90 °C | 90 °C | 70 °C | 90 °C | 90 °C | 70 °C | 70 °C | 125 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | HBGA | HBGA | HBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA |
| 封装等效代码 | BGA361,19X19,32 | BGA376,22X22,40 | BGA376,22X22,40 | BGA376,22X22,40 | BGA361,19X19,32 | BGA361,19X19,32 | BGA361,19X19,32 | BGA361,19X19,32 | BGA361,19X19,32 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字数） | 20480 | 20480 | 20480 | 20480 | 20480 | 20480 | 20480 | 20480 | 20480 |
| 座面最大高度 | 1.4 mm | 2.48 mm | 2.48 mm | 2.48 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
| 最大供电电压 | 1.26 V | 1.26 V | 1.26 V | 1.26 V | 1.26 V | 1.26 V | 1.26 V | 1.26 V | 1.26 V |
| 最小供电电压 | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V |
| 标称供电电压 | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | COMMERCIAL | OTHER | OTHER | COMMERCIAL | COMMERCIAL | AUTOMOTIVE |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 1 mm | 1 mm | 1 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 16 mm | 23 mm | 23 mm | 23 mm | 16 mm | 16 mm | 16 mm | 16 mm | 16 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | - | 不含铅 | 不含铅 | 不含铅 | - |
| 集成缓存 | YES | YES | YES | - | YES | YES | YES | YES | YES |
| DMA 通道数量 | 72 | 72 | 72 | - | 72 | 72 | 72 | 72 | 72 |
| 计时器数量 | 5 | 5 | 5 | - | 5 | 5 | 5 | 5 | 5 |
| 片上数据RAM宽度 | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 |
| 片上程序ROM宽度 | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 |
| ROM可编程性 | MROM | MROM | MROM | - | MROM | MROM | MROM | MROM | MROM |
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