Wide Input Voltage Power Management IC (PMIC) 40-VQFN 0 to 85
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | QFN |
包装说明 | VQFN-40 |
针数 | 40 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
Factory Lead Time | 1 week |
Samacsys Descripti | TRIPLE BUCK POWER MANAGEMENT IC |
可调阈值 | YES |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | S-PQCC-N40 |
JESD-609代码 | e4 |
长度 | 6 mm |
湿度敏感等级 | 3 |
信道数量 | 1 |
功能数量 | 1 |
端子数量 | 40 |
最高工作温度 | 85 °C |
最低工作温度 | |
最大输出电流 | 3 A |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
最大供电电压 (Vsup) | 22 V |
最小供电电压 (Vsup) | 1.8 V |
标称供电电压 (Vsup) | 12 V |
表面贴装 | YES |
温度等级 | OTHER |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 6 mm |
TPS65232A0RHAR | TPS65232A0RHA | TPS65232A2DCAR | TPS65232A2DCA | |
---|---|---|---|---|
描述 | Wide Input Voltage Power Management IC (PMIC) 40-VQFN 0 to 85 | Wide Input Voltage Power Management IC (PMIC) 40-VQFN | Wide Input Voltage Power Management IC (PMIC) 48-HTSSOP 0 to 85 | Wide Input Voltage Power Management IC (PMIC) 48-HTSSOP |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | QFN | QFN | TSSOP | TSSOP |
包装说明 | VQFN-40 | VQFN-40 | HTSSOP-48 | HTSSOP-48 |
针数 | 40 | 40 | 48 | 48 |
Reach Compliance Code | compli | compli | compli | compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
Factory Lead Time | 1 week | 1 week | 6 weeks | 16 weeks |
Samacsys Descripti | TRIPLE BUCK POWER MANAGEMENT IC | TRIPLE BUCK POWER MANAGEMENT IC | TRIPLE BUCK POWER MANAGEMENT IC | TRIPLE BUCK POWER MANAGEMENT IC |
可调阈值 | YES | YES | YES | YES |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | S-PQCC-N40 | S-PQCC-N40 | R-PDSO-G48 | R-PDSO-G48 |
JESD-609代码 | e4 | e4 | e4 | e4 |
长度 | 6 mm | 6 mm | 12.5 mm | 12.5 mm |
湿度敏感等级 | 3 | 3 | 3 | 3 |
信道数量 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 40 | 40 | 48 | 48 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最大输出电流 | 3 A | 3 A | 3 A | 3 A |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | HVQCCN | HTSSOP | HTSSOP |
封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | 1 mm | 1.2 mm | 1.2 mm |
最大供电电压 (Vsup) | 22 V | 22 V | 22 V | 22 V |
最小供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
标称供电电压 (Vsup) | 12 V | 12 V | 12 V | 12 V |
表面贴装 | YES | YES | YES | YES |
温度等级 | OTHER | OTHER | OTHER | OTHER |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD | NO LEAD | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 6 mm | 6 mm | 6.1 mm | 6.1 mm |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved