Fast Page DRAM, 512KX9, 60ns, CMOS, PDSO28, PLASTIC, TSOP2-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | SAMSUNG(三星) |
| 零件包装代码 | TSOP |
| 包装说明 | TSOP2, TSOP28,.46 |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 访问模式 | FAST PAGE |
| 最长访问时间 | 60 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDSO-G28 |
| JESD-609代码 | e0 |
| 长度 | 18.41 mm |
| 内存密度 | 4718592 bit |
| 内存集成电路类型 | FAST PAGE DRAM |
| 内存宽度 | 9 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 28 |
| 字数 | 524288 words |
| 字数代码 | 512000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 512KX9 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP2 |
| 封装等效代码 | TSOP28,.46 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 1024 |
| 座面最大高度 | 1.2 mm |
| 自我刷新 | YES |
| 最大待机电流 | 0.00015 A |
| 最大压摆率 | 0.075 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 10.16 mm |
| KM49C512BLLT-6 | KM49C512BLLTR-6 | KM49C512BLLJ-8 | KM49C512BLLJ-7 | KM49C512BLLTR-7 | KM49C512BLLT-8 | KM49C512BLLTR-8 | KM49C512BLLT-7 | KM49C512BLLJ-6 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Fast Page DRAM, 512KX9, 60ns, CMOS, PDSO28, PLASTIC, TSOP2-28 | Fast Page DRAM, 512KX9, 60ns, CMOS, PDSO28, PLASTIC, REVERSE, TSOP2-28 | Fast Page DRAM, 512KX9, 80ns, CMOS, PDSO28, PLASTIC, SOJ-28 | Fast Page DRAM, 512KX9, 70ns, CMOS, PDSO28, PLASTIC, SOJ-28 | Fast Page DRAM, 512KX9, 70ns, CMOS, PDSO28, PLASTIC, REVERSE, TSOP2-28 | Fast Page DRAM, 512KX9, 80ns, CMOS, PDSO28, PLASTIC, TSOP2-28 | Fast Page DRAM, 512KX9, 80ns, CMOS, PDSO28, PLASTIC, REVERSE, TSOP2-28 | Fast Page DRAM, 512KX9, 70ns, CMOS, PDSO28, PLASTIC, TSOP2-28 | Fast Page DRAM, 512KX9, 60ns, CMOS, PDSO28, PLASTIC, SOJ-28 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
| 零件包装代码 | TSOP | TSOP | SOJ | SOJ | TSOP | TSOP | TSOP | TSOP | SOJ |
| 包装说明 | TSOP2, TSOP28,.46 | TSOP2-R, TSOP28,.46 | SOJ, SOJ28,.44 | SOJ, SOJ28,.44 | TSOP2-R, TSOP28,.46 | TSOP2, TSOP28,.46 | TSOP2-R, TSOP28,.46 | TSOP2, TSOP28,.46 | SOJ, SOJ28,.44 |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| 最长访问时间 | 60 ns | 60 ns | 80 ns | 70 ns | 70 ns | 80 ns | 80 ns | 70 ns | 60 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-J28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 18.41 mm | 18.41 mm | 18.415 mm | 18.415 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.415 mm |
| 内存密度 | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bi | 4718592 bi |
| 内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 512KX9 | 512KX9 | 512KX9 | 512KX9 | 512KX9 | 512KX9 | 512KX9 | 512KX9 | 512KX9 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP2 | TSOP2-R | SOJ | SOJ | TSOP2-R | TSOP2 | TSOP2-R | TSOP2 | SOJ |
| 封装等效代码 | TSOP28,.46 | TSOP28,.46 | SOJ28,.44 | SOJ28,.44 | TSOP28,.46 | TSOP28,.46 | TSOP28,.46 | TSOP28,.46 | SOJ28,.44 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
| 座面最大高度 | 1.2 mm | 1.2 mm | 3.76 mm | 3.76 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 3.76 mm |
| 自我刷新 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 最大待机电流 | 0.00015 A | 0.00015 A | 0.00015 A | 0.00015 A | 0.00015 A | 0.00015 A | 0.00015 A | 0.00015 A | 0.00015 A |
| 最大压摆率 | 0.075 mA | 0.075 mA | 0.065 mA | 0.07 mA | 0.07 mA | 0.065 mA | 0.065 mA | 0.07 mA | 0.075 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | J BEND | J BEND | GULL WING | GULL WING | GULL WING | GULL WING | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
嵌入式系统
WindowsCE
微控制器 MCU
stm32/stm8
TI技术论坛
嵌入式系统
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
