DUAL LINE RECEIVER, CDFP16
参数名称 | 属性值 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | DFP, FL16,.3 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
其他特性 | CONFIGURABLE TOTEM-POLE OUTPUTS; BUILT-IN LINE TERMINATION; RESPONSE CONTROL |
输入特性 | DIFFERENTIAL |
接口集成电路类型 | LINE RECEIVER |
接口标准 | GENERAL PURPOSE |
JESD-30 代码 | R-GDFP-F16 |
JESD-609代码 | e0 |
长度 | 9.6645 mm |
功能数量 | 2 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
最大输出低电流 | 0.015 A |
输出极性 | INVERTED |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DFP |
封装等效代码 | FL16,.3 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
电源 | 5 V |
认证状态 | Not Qualified |
最大接收延迟 | 50 ns |
接收器位数 | 1 |
筛选级别 | 38535Q/M;38534H;883B |
座面最大高度 | 2.032 mm |
最大压摆率 | 50 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | BIPOLAR |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 6.604 mm |
DS55115W/883 | DS55115J/A+ | DS75115N/A+ | DS75115J/A+ | |
---|---|---|---|---|
描述 | DUAL LINE RECEIVER, CDFP16 | IC,LINE RECEIVER,DUAL,BIPOLAR,DIFFERENTIAL,DIP,16PIN,CERAMIC | IC,LINE RECEIVER,DUAL,BIPOLAR,DIFFERENTIAL,DIP,16PIN,PLASTIC | IC,LINE RECEIVER,DUAL,BIPOLAR,DIFFERENTIAL,DIP,16PIN,CERAMIC |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
包装说明 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-GDFP-F16 | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 |
JESD-609代码 | e0 | e0 | e0 | e0 |
端子数量 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 70 °C | 70 °C |
最大输出低电流 | 0.015 A | 0.015 A | 0.015 A | 0.015 A |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC | PLASTIC/EPOXY | CERAMIC |
封装代码 | DFP | DIP | DIP | DIP |
封装等效代码 | FL16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | IN-LINE | IN-LINE | IN-LINE |
电源 | 5 V | 5 V | 5 V | 5 V |
最大接收延迟 | 50 ns | 50 ns | 75 ns | 75 ns |
最大压摆率 | 50 mA | 50 mA | 50 mA | 50 mA |
标称供电电压 | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | NO |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 |
Base Number Matches | - | 1 | 1 | 1 |
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