F-208-1
MIT–019–01–F–D–A
MIT–038–01–F–D–A
®
MIT–057–01–L–D–A
0,635
mm
MIX TECH HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MIT
Insulator Material:
Liquid Crystal
Polymer
Contact Material:
Phospher Bronze
Plating:
Au over 50µ" (1,27µm) Ni
Current Rating:
Contacts: 1.6A @ 80°C
Ground Plane: 8.7A @ 80°C
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
275 VAC
Max Cycles:
100
RoHS Compliant:
Yes
MIT
SERIES
Mates with:
MIS, MICD
Integral metal plane
for power or ground
76 signal lines
per linear inch
Choice of
mated heights
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (019-076)
Board Stacking:
For applications requiring
more than two connectors per
board or 76 positions or higher,
contact ipg@samtec.com
5mm Stack Height
Rated @ -3dB Insertion Loss
Single-Ended Signaling
8.5 GHz / 17 Gbps
Differential Pair Signaling
8.5 GHz / 17 Gbps
Performance data for other stack heights
available at www.samtec.com?MIT
(0,64mm)
.025" pitch
Polarized
ALSO AVAILABLE
Board Spacing Standoffs.
See SO Series.
MIT
NO. OF POSITIONS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
D
A
OTHER
OPTION
–K
–L
= 10µ" (0,25µm) Gold on
Signal Pins and Ground Plane,
Matte Tin on tails
= (7,00mm)
.275" DIA
Polyimide
film Pick &
Place Pad
–019, –038, –057, –076
APPLICATION
SPECIFIC OPTION
• 11mm, 16mm, 18,75mm
and 22mm stack height
• 30µ" (0,76µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-
ended banks in same
connector) available.
• 95, 114 and 133
positions per row
• Edge Mount
Call Samtec.
(7,11)
.280
(0,64)
.025
(1,40)
.055
*Note:
–C Plating passes
10 year MFG testing
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
(38 total positions per bank)
–F
= Gold Flash on Signal Pins and
Ground Plane, Matte Tin on tails
–TR
= Tape &
Reel
–C*
= Electro-Polished Selective
50µ" (1,27µm) min Au over 150µ"
(3,81µm) Ni on Signal Pins in contact
area, 10µ" (0,25µm) min Au over
50µ" (1,27µm) Ni on Ground Plane
in contact area, Matte Tin over 50µ"
(1,27µm) min Ni on all solder tails
(No. of Positions/19) x (12,70) .500 + (11,43) .450
(12,70)
.500
02
(5,97)
.235
(0,20)
.008
01
STACK HEIGHTS
LEAD
MATED
A
STYLE
HEIGHT
(7,11)
.280
–01
–02
(4,27) .168 (5,00) .198
(7,26).286 (8,00) .315
Processing conditions will
affect mated height.
A
(0,58) .023 x (0,38) .015
(0,38)
.015
Note:
Rugged through-hole ground plane soldered to board
(requires paste-over-hole, not press-fit) for added retention to PCB.
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