HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP24
参数名称 | 属性值 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | DIP, |
Reach Compliance Code | unknown |
其他特性 | TWO INVERTERS; ONE 2-INPUT NOR GATE; ONE 2-INPUT NAND GATE |
系列 | HC/UH |
JESD-30 代码 | R-GDIP-T24 |
长度 | 32.005 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP |
位数 | 1 |
功能数量 | 2 |
端子数量 | 24 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | COMPLEMENTARY |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
传播延迟(tpd) | 53 ns |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
最大供电电压 (Vsup) | 6 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
触发器类型 | POSITIVE EDGE |
宽度 | 7.62 mm |
最小 fmax | 19 MHz |
SN54HC7074JT-00 | SNJ54HC7074JT-00 | SNJ54HC7074FK-00 | SN54HC7074FK-00 | |
---|---|---|---|---|
描述 | HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP24 | HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP24 | HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CQCC28 | HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CQCC28 |
包装说明 | DIP, | DIP, | QCCN, | QCCN, |
Reach Compliance Code | unknown | unknown | unknown | unknown |
其他特性 | TWO INVERTERS; ONE 2-INPUT NOR GATE; ONE 2-INPUT NAND GATE | TWO INVERTERS; ONE 2-INPUT NOR GATE; ONE 2-INPUT NAND GATE | TWO INVERTERS; ONE 2-INPUT NOR GATE; ONE 2-INPUT NAND GATE | TWO INVERTERS; ONE 2-INPUT NOR GATE; ONE 2-INPUT NAND GATE |
系列 | HC/UH | HC/UH | HC/UH | HC/UH |
JESD-30 代码 | R-GDIP-T24 | R-GDIP-T24 | S-CQCC-N28 | S-CQCC-N28 |
长度 | 32.005 mm | 32.005 mm | 11.43 mm | 11.43 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
位数 | 1 | 1 | 1 | 1 |
功能数量 | 2 | 2 | 2 | 2 |
端子数量 | 24 | 24 | 28 | 28 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | DIP | QCCN | QCCN |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
传播延迟(tpd) | 53 ns | 53 ns | 53 ns | 53 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 5.08 mm | 2.03 mm | 2.03 mm |
最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V |
最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | QUAD | QUAD |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
宽度 | 7.62 mm | 7.62 mm | 11.43 mm | 11.43 mm |
最小 fmax | 19 MHz | 19 MHz | 19 MHz | 19 MHz |
厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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